DK3765567T3 - Lagerstabile og hærdelige harpikssammensætninger - Google Patents
Lagerstabile og hærdelige harpikssammensætninger Download PDFInfo
- Publication number
- DK3765567T3 DK3765567T3 DK19709531.8T DK19709531T DK3765567T3 DK 3765567 T3 DK3765567 T3 DK 3765567T3 DK 19709531 T DK19709531 T DK 19709531T DK 3765567 T3 DK3765567 T3 DK 3765567T3
- Authority
- DK
- Denmark
- Prior art keywords
- stable
- resin compositions
- cure resin
- cure
- compositions
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP18162350 | 2018-03-16 | ||
| PCT/EP2019/056473 WO2019175342A1 (en) | 2018-03-16 | 2019-03-14 | Storage stable and curable resin compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3765567T3 true DK3765567T3 (da) | 2024-11-18 |
Family
ID=61873270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK19709531.8T DK3765567T3 (da) | 2018-03-16 | 2019-03-14 | Lagerstabile og hærdelige harpikssammensætninger |
Country Status (16)
| Country | Link |
|---|---|
| US (1) | US12516188B2 (da) |
| EP (1) | EP3765567B1 (da) |
| JP (1) | JP7411587B2 (da) |
| KR (1) | KR102802243B1 (da) |
| CN (1) | CN111868170B (da) |
| BR (1) | BR112020018692B1 (da) |
| CA (1) | CA3092009A1 (da) |
| DK (1) | DK3765567T3 (da) |
| ES (1) | ES2993018T3 (da) |
| FI (1) | FI3765567T3 (da) |
| HU (1) | HUE069184T2 (da) |
| MX (1) | MX2020009610A (da) |
| MY (1) | MY208152A (da) |
| PH (1) | PH12020551415A1 (da) |
| PL (1) | PL3765567T3 (da) |
| WO (1) | WO2019175342A1 (da) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2952269T3 (es) * | 2019-04-11 | 2023-10-30 | Huntsman Adv Mat Licensing Switzerland Gmbh | Sistema curable a base de resina de dos componentes |
| CN116685617A (zh) | 2020-12-22 | 2023-09-01 | 亨斯迈先进材料许可(瑞士)有限公司 | 可固化的两部分树脂体系 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3271509A (en) | 1963-04-12 | 1966-09-06 | Westinghouse Electric Corp | Electrical insulation for condenser bushings and the like |
| US5037898A (en) * | 1990-02-27 | 1991-08-06 | Shell Oil Company | Polysiloxane-polylactone block copolymer modified thermostat compositions |
| KR100193147B1 (ko) | 1990-03-30 | 1999-06-15 | 월터클라웨인, 한느-피터 위트린 | 개질된 에폭시 수지 |
| JP3043838B2 (ja) | 1991-06-05 | 2000-05-22 | 日本ユニカー株式会社 | シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物 |
| ES2148213T3 (es) | 1992-07-09 | 2000-10-16 | Vantico Ag | Suspensiones endurecibles a base de resinas epoxi. |
| JPH09137041A (ja) | 1995-11-16 | 1997-05-27 | Hitachi Ltd | 含浸用樹脂組成物およびそれを用いた電気絶縁線輪 |
| US6103157A (en) | 1997-07-02 | 2000-08-15 | Ciba Specialty Chemicals Corp. | Process for impregnating electrical coils |
| ES2237832T3 (es) * | 1997-08-27 | 2005-08-01 | Huntsman Advanced Materials (Switzerland) Gmbh | Sistema de resina epoxi hidrofoba. |
| JP2000026708A (ja) | 1998-05-07 | 2000-01-25 | Mitsubishi Electric Corp | エポキシ樹脂組成物及び半導体装置 |
| DE69922577T2 (de) * | 1998-05-07 | 2005-12-01 | Shin-Etsu Chemical Co., Ltd. | Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen |
| EP1165688B1 (de) | 1999-03-16 | 2007-01-24 | Huntsman Advanced Materials (Switzerland) GmbH | Härtbare zusammensetzung mit besonderer eigenschaftskombination |
| US6562884B1 (en) | 1999-03-17 | 2003-05-13 | Vantico, Inc. | Epoxy resin compositions having a long shelf life |
| JP3707531B2 (ja) | 1999-06-08 | 2005-10-19 | 信越化学工業株式会社 | フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置 |
| GB9927431D0 (en) | 1999-11-22 | 2000-01-19 | Ciba Sc Holding Ag | Casting resin and process for the fabrication of resin molds |
| JP4221585B2 (ja) | 2002-09-13 | 2009-02-12 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び半導体装置 |
| JP4015613B2 (ja) | 2003-12-15 | 2007-11-28 | 三洋化成工業株式会社 | 注型用樹脂組成物 |
| EP1754733A1 (en) | 2005-07-26 | 2007-02-21 | Huntsman Advanced Materials (Switzerland) GmbH | Composition |
| EP1798740B1 (en) | 2005-12-14 | 2011-08-31 | ABB Research Ltd. | High voltage bushing |
| EP2044138A1 (en) | 2006-07-20 | 2009-04-08 | ABB Research Ltd | Hardenable epoxy resin composition |
| JP4952283B2 (ja) | 2007-02-14 | 2012-06-13 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
| JP5336485B2 (ja) * | 2007-08-02 | 2013-11-06 | ダウ グローバル テクノロジーズ エルエルシー | 熱硬化性ポリマーの性能を向上させるための両親媒性ブロックコポリマーおよび無機ナノフィラー |
| JP5176144B2 (ja) | 2007-08-22 | 2013-04-03 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、これを用いた光半導体搭載用基板及びその製造方法、並びに光半導体装置 |
| MY155463A (en) * | 2008-09-30 | 2015-10-15 | Hitachi Chemical Co Ltd | Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device |
| DE102008044199A1 (de) * | 2008-11-28 | 2010-06-02 | Wacker Chemie Ag | Siloxan-Mischungen enthaltende Epoxidharze und Verfahren zu ihrer Herstellung und deren Verwendung |
| GB201113196D0 (en) * | 2011-08-01 | 2011-09-14 | Cytec Tech Corp | Thermoset resin compositions with increased toughness |
| ITTO20111208A1 (it) | 2011-12-23 | 2013-06-24 | Bridgestone Corp | Mescola di gomma per pneumatici |
| US20170349795A1 (en) * | 2015-02-11 | 2017-12-07 | Dow Global Technologies Llc | Low temperature curable adhesives and use thereof |
| JP7365118B2 (ja) | 2016-03-15 | 2023-10-19 | ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー | 電気工学用の絶縁系の製造方法、それから得られる製品及びその使用 |
| DE102016006910A1 (de) | 2016-06-08 | 2017-12-14 | Hexion GmbH | Zusammensetzung enthaltend ein Polymer auf der Basis von Epoxidverbindungen |
-
2019
- 2019-03-14 MY MYPI2020004355A patent/MY208152A/en unknown
- 2019-03-14 HU HUE19709531A patent/HUE069184T2/hu unknown
- 2019-03-14 MX MX2020009610A patent/MX2020009610A/es unknown
- 2019-03-14 WO PCT/EP2019/056473 patent/WO2019175342A1/en not_active Ceased
- 2019-03-14 FI FIEP19709531.8T patent/FI3765567T3/fi active
- 2019-03-14 DK DK19709531.8T patent/DK3765567T3/da active
- 2019-03-14 PL PL19709531.8T patent/PL3765567T3/pl unknown
- 2019-03-14 US US16/981,334 patent/US12516188B2/en active Active
- 2019-03-14 JP JP2020572621A patent/JP7411587B2/ja active Active
- 2019-03-14 ES ES19709531T patent/ES2993018T3/es active Active
- 2019-03-14 KR KR1020207029884A patent/KR102802243B1/ko active Active
- 2019-03-14 CA CA3092009A patent/CA3092009A1/en active Pending
- 2019-03-14 EP EP19709531.8A patent/EP3765567B1/en active Active
- 2019-03-14 BR BR112020018692-9A patent/BR112020018692B1/pt active IP Right Grant
- 2019-03-14 CN CN201980019849.4A patent/CN111868170B/zh active Active
-
2020
- 2020-09-09 PH PH12020551415A patent/PH12020551415A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP3765567A1 (en) | 2021-01-20 |
| CN111868170A (zh) | 2020-10-30 |
| CN111868170B (zh) | 2024-08-06 |
| CA3092009A1 (en) | 2019-09-19 |
| FI3765567T3 (fi) | 2024-11-13 |
| BR112020018692A2 (pt) | 2020-12-29 |
| BR112020018692B1 (pt) | 2024-04-30 |
| HUE069184T2 (hu) | 2025-02-28 |
| US20210009803A1 (en) | 2021-01-14 |
| MX2020009610A (es) | 2020-10-07 |
| EP3765567B1 (en) | 2024-09-18 |
| WO2019175342A1 (en) | 2019-09-19 |
| JP2021518483A (ja) | 2021-08-02 |
| JP7411587B2 (ja) | 2024-01-11 |
| ES2993018T3 (en) | 2024-12-20 |
| KR20200133267A (ko) | 2020-11-26 |
| PH12020551415A1 (en) | 2021-09-13 |
| PL3765567T3 (pl) | 2025-02-03 |
| KR102802243B1 (ko) | 2025-05-07 |
| US12516188B2 (en) | 2026-01-06 |
| MY208152A (en) | 2025-04-18 |
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