DK3912441T3 - Varmeoverføringsindretning og effektelektronikindretning - Google Patents

Varmeoverføringsindretning og effektelektronikindretning Download PDF

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Publication number
DK3912441T3
DK3912441T3 DK19701804.7T DK19701804T DK3912441T3 DK 3912441 T3 DK3912441 T3 DK 3912441T3 DK 19701804 T DK19701804 T DK 19701804T DK 3912441 T3 DK3912441 T3 DK 3912441T3
Authority
DK
Denmark
Prior art keywords
heat transfer
power electronics
transfer device
electronics device
power
Prior art date
Application number
DK19701804.7T
Other languages
English (en)
Inventor
Lasse Christian Larsen
Torben Nielsen
Original Assignee
Bitzer Electronics As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bitzer Electronics As filed Critical Bitzer Electronics As
Application granted granted Critical
Publication of DK3912441T3 publication Critical patent/DK3912441T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK19701804.7T 2019-01-18 2019-01-18 Varmeoverføringsindretning og effektelektronikindretning DK3912441T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2019/051228 WO2020147961A1 (en) 2019-01-18 2019-01-18 Heat transfer assembly and power electronics device

Publications (1)

Publication Number Publication Date
DK3912441T3 true DK3912441T3 (da) 2024-07-08

Family

ID=65234540

Family Applications (1)

Application Number Title Priority Date Filing Date
DK19701804.7T DK3912441T3 (da) 2019-01-18 2019-01-18 Varmeoverføringsindretning og effektelektronikindretning

Country Status (5)

Country Link
US (2) US12089379B2 (da)
EP (2) EP3912441B1 (da)
CN (2) CN119095336A (da)
DK (1) DK3912441T3 (da)
WO (1) WO2020147961A1 (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117254629B (zh) * 2023-11-15 2024-02-06 广东启新汽车零部件有限公司 一种汽车电机外壳

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* Cited by examiner, † Cited by third party
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JPH0795771A (ja) * 1993-09-20 1995-04-07 Sansha Electric Mfg Co Ltd 電源装置の冷却構造
US5793608A (en) * 1996-06-11 1998-08-11 Sun Microsystems, Inc. Cooling system for enclosed electronic components
JP3237609B2 (ja) * 1998-05-11 2001-12-10 株式会社日立製作所 インバータ装置
US6843306B2 (en) * 1998-07-27 2005-01-18 Cymer, Inc. Compact ductless cooling with heat exchangers
PL193094B1 (pl) * 2004-11-15 2007-01-31 Adb Polska Sp Urządzenie elektroniczne z płytą montażową z obwodami drukowanymi i płyta montażowa z obwodami drukowanymi
US7218517B2 (en) * 2004-12-07 2007-05-15 International Business Machines Corporation Cooling apparatus for vertically stacked printed circuit boards
JP2007078280A (ja) * 2005-09-15 2007-03-29 Denso Corp 冷却用熱交換器
US7885062B2 (en) * 2005-12-09 2011-02-08 Nvidia Corporation Computer chassis with partitions for improved airflow
US20080117589A1 (en) * 2006-11-22 2008-05-22 Dell Products L.P. Self Adjusting Air Directing Baffle
CN101202529A (zh) * 2006-12-11 2008-06-18 丹佛斯传动有限公司 电子装置及电动机变频器
JP5011016B2 (ja) * 2007-07-30 2012-08-29 株式会社日立産機システム 電力変換装置
JP2009231511A (ja) * 2008-03-21 2009-10-08 Sharp Corp 筐体
US9192079B2 (en) * 2008-09-26 2015-11-17 Rockwell Automation Technologies, Inc. Power electronic module cooling system and method
FI20085945A7 (fi) * 2008-10-08 2010-04-09 Abb Oy Elektroniikkalaitteen jäähdytysrakenne ja menetelmä
US7929301B2 (en) * 2008-11-03 2011-04-19 Microsoft Corporation Splash resistant power adapter
JP4706747B2 (ja) * 2008-11-17 2011-06-22 富士ゼロックス株式会社 電子装置及び画像形成装置
EP2299582B1 (de) * 2009-09-18 2015-03-11 SMA Solar Technology AG Wechselrichter mit einem Gehäuse und darin angeordneten elektrischen und elektronischen Bauteilen
US20110308777A1 (en) * 2010-06-18 2011-12-22 O'connor John F Cooling Module with Multiple Parallel Blowers
US9429151B2 (en) * 2011-05-17 2016-08-30 Carrier Corporation Variable frequency drive heat sink assembly
JP5794101B2 (ja) * 2011-10-24 2015-10-14 富士電機株式会社 強制空冷式ヒートシンク
AU2012232968B2 (en) * 2011-10-31 2014-11-13 Abb Technology Ag Thermosiphon cooler arrangement in modules with electric and/or electronic components
FR2983013B1 (fr) * 2011-11-18 2013-11-08 Sagemcom Broadband Sas Appareil electronique de type modem ou analogue comportant plusieurs processeurs refroidis par air
WO2014020806A1 (ja) * 2012-08-03 2014-02-06 富士電機株式会社 冷却構造体及び電力変換装置
JP5965779B2 (ja) * 2012-08-24 2016-08-10 株式会社日立産機システム 電力変換装置
EP2879476B1 (en) * 2013-11-29 2016-06-29 ABB Technology Oy Electric apparatus
DE112015006041B4 (de) * 2015-01-22 2021-03-11 Mitsubishi Electric Corporation Halbleiteranordnung
CN204829757U (zh) * 2015-05-08 2015-12-02 深圳市莱福德光电有限公司 一种led电源外壳、led电源及照明装置
CN207491429U (zh) * 2017-03-06 2018-06-12 达纳加拿大公司 用于冷却电子模块的多个层的热交换器组件和热交换器模组
US11502023B2 (en) * 2018-05-01 2022-11-15 Mitsubishi Electric Corporation Semiconductor device with partition for refrigerant cooling

Also Published As

Publication number Publication date
CN113273322A (zh) 2021-08-17
CN113273322B (zh) 2024-11-08
WO2020147961A1 (en) 2020-07-23
EP3912441A1 (en) 2021-11-24
US20210337698A1 (en) 2021-10-28
US12089379B2 (en) 2024-09-10
CN119095336A (zh) 2024-12-06
EP3912441B1 (en) 2024-06-26
EP4440273A3 (en) 2024-12-04
EP4440273A2 (en) 2024-10-02
US20240397675A1 (en) 2024-11-28

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