DK4005195T3 - Sensorindretning - Google Patents

Sensorindretning

Info

Publication number
DK4005195T3
DK4005195T3 DK20789902.2T DK20789902T DK4005195T3 DK 4005195 T3 DK4005195 T3 DK 4005195T3 DK 20789902 T DK20789902 T DK 20789902T DK 4005195 T3 DK4005195 T3 DK 4005195T3
Authority
DK
Denmark
Prior art keywords
sensor device
sensor
Prior art date
Application number
DK20789902.2T
Other languages
English (en)
Inventor
Michael Gruber
Zanin Cosic
Martin Ponticelli
Original Assignee
Vexcel Imaging Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vexcel Imaging Gmbh filed Critical Vexcel Imaging Gmbh
Application granted granted Critical
Publication of DK4005195T3 publication Critical patent/DK4005195T3/da

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0271—Housings; Attachments or accessories for photometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C11/00—Photogrammetry or videogrammetry, e.g. stereogrammetry; Photographic surveying
    • G01C11/02—Picture taking arrangements specially adapted for photogrammetry or photographic surveying, e.g. controlling overlapping of pictures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Biomedical Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Studio Devices (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
DK20789902.2T 2019-10-07 2020-10-05 Sensorindretning DK4005195T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATA50846/2019A AT522995B1 (de) 2019-10-07 2019-10-07 Sensoranordnung
PCT/EP2020/077862 WO2021069382A1 (de) 2019-10-07 2020-10-05 Sensoranordnung

Publications (1)

Publication Number Publication Date
DK4005195T3 true DK4005195T3 (da) 2025-10-06

Family

ID=72840514

Family Applications (1)

Application Number Title Priority Date Filing Date
DK20789902.2T DK4005195T3 (da) 2019-10-07 2020-10-05 Sensorindretning

Country Status (9)

Country Link
US (1) US12025490B2 (da)
EP (1) EP4005195B1 (da)
JP (1) JP7592077B2 (da)
KR (1) KR102800766B1 (da)
CN (1) CN114846293B (da)
AT (1) AT522995B1 (da)
DK (1) DK4005195T3 (da)
TW (1) TWI767333B (da)
WO (1) WO2021069382A1 (da)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021212985A1 (de) * 2021-11-18 2023-05-25 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Kamera und Kamera
US20220100061A1 (en) * 2021-12-11 2022-03-31 Components Express, Inc. Securing Bracket
AT525579B1 (de) 2022-03-09 2023-05-15 Vexcel Imaging Gmbh Verfahren und Kamera zur Korrektur eines geometrischen Abbildungsfehlers in einer Bildaufnahme

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1384046B1 (en) 2001-05-04 2018-10-03 Vexcel Imaging GmbH Digital camera for and method of obtaining overlapping images
JP4510403B2 (ja) * 2003-05-08 2010-07-21 富士フイルム株式会社 カメラモジュール及びカメラモジュールの製造方法
WO2005022900A2 (en) * 2003-08-26 2005-03-10 Redshift Systems Corporation Infrared camera system
JP4322837B2 (ja) 2004-03-31 2009-09-02 富士フイルム株式会社 露光装置の校正方法及び露光方法並びに露光装置
JP2006344838A (ja) 2005-06-10 2006-12-21 Matsushita Electric Ind Co Ltd 固体撮像装置およびその製造方法
JP5029334B2 (ja) 2007-12-07 2012-09-19 株式会社ニコン 撮像装置の製造方法
JP5157840B2 (ja) * 2008-11-13 2013-03-06 コニカミノルタビジネステクノロジーズ株式会社 画像読取装置
US7795573B2 (en) 2008-11-17 2010-09-14 Teledyne Scientific & Imaging, Llc Detector with mounting hub to isolate temperature induced strain and method of fabricating the same
CN102130138B (zh) 2010-01-12 2013-01-02 中芯国际集成电路制造(上海)有限公司 图像传感器及其形成方法
US8308379B2 (en) * 2010-12-01 2012-11-13 Digitaloptics Corporation Three-pole tilt control system for camera module
EP2485474B1 (en) * 2011-02-08 2013-05-01 Axis AB Digital camera with adjustable sensor
JP2013174784A (ja) 2012-02-27 2013-09-05 Ricoh Co Ltd カメラモジュール、カメラモジュールの組み付け方法、レンズアレイの製造方法及び金型
JP5355766B2 (ja) 2012-03-06 2013-11-27 株式会社東京精密 研削装置
DE102012103980A1 (de) * 2012-05-07 2013-11-07 GOM - Gesellschaft für Optische Meßtechnik mbH Verfahren und Vorrichtung zur Ausrichtung einer Komponente
JP5947114B2 (ja) * 2012-06-08 2016-07-06 浜松ホトニクス株式会社 位置検出装置
JP2015224946A (ja) 2014-05-27 2015-12-14 株式会社キーエンス 光学式座標測定装置
DE102014212104A1 (de) 2014-06-24 2015-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und verfahren zur relativen positionierung einer multiaperturoptik mit mehreren optischen kanälen relativ zu einem bildsensor
US9696199B2 (en) * 2015-02-13 2017-07-04 Taiwan Biophotonic Corporation Optical sensor
JP6643834B2 (ja) * 2015-09-02 2020-02-12 キヤノン株式会社 ディストーション検出方法、露光装置、露光方法、およびデバイス製造方法
US10382698B2 (en) * 2015-09-30 2019-08-13 Apple Inc. Mobile zoom using multiple optical image stabilization cameras
EP3423874A2 (en) * 2016-03-02 2019-01-09 Optotune Consumer AG Optical device, particularly camera, particularly comprising autofocus, image stabilization and super resolution
DE102016124549B4 (de) * 2016-12-15 2019-11-07 Carl Zeiss Industrielle Messtechnik Gmbh Messsystem
FR3060851B1 (fr) 2016-12-20 2018-12-07 3D Plus Module optoelectronique 3d d'imagerie
US10908282B2 (en) 2017-04-07 2021-02-02 General Electric Company LiDAR system and method
KR102336174B1 (ko) * 2017-08-29 2021-12-07 삼성전자주식회사 전방위 이미지 센서 및 그 제조 방법
CN109951971B (zh) * 2019-04-11 2020-09-04 Oppo广东移动通信有限公司 一种壳体组件及一种电子装置

Also Published As

Publication number Publication date
WO2021069382A1 (de) 2021-04-15
US20220412795A1 (en) 2022-12-29
AT522995B1 (de) 2021-05-15
JP7592077B2 (ja) 2024-11-29
US12025490B2 (en) 2024-07-02
CN114846293B (zh) 2024-06-14
AT522995A1 (de) 2021-04-15
JP2022550776A (ja) 2022-12-05
KR20220098140A (ko) 2022-07-11
TW202128001A (zh) 2021-07-16
KR102800766B1 (ko) 2025-04-24
EP4005195A1 (de) 2022-06-01
EP4005195B1 (de) 2025-09-10
TWI767333B (zh) 2022-06-11
CN114846293A (zh) 2022-08-02

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