DK401176A - Fremgangsmade til fremstilling af et termoelektrisk modul og svejselegering til brug ved fremgangsmadens udovelse - Google Patents

Fremgangsmade til fremstilling af et termoelektrisk modul og svejselegering til brug ved fremgangsmadens udovelse

Info

Publication number
DK401176A
DK401176A DK401176A DK401176A DK401176A DK 401176 A DK401176 A DK 401176A DK 401176 A DK401176 A DK 401176A DK 401176 A DK401176 A DK 401176A DK 401176 A DK401176 A DK 401176A
Authority
DK
Denmark
Prior art keywords
procedure
performance
production
thermoelectric module
welding alloy
Prior art date
Application number
DK401176A
Other languages
English (en)
Other versions
DK151425C (da
DK151425B (da
Inventor
G Germano
F Losciale
R Falesiedi
F Daclon
N Merzagora
Original Assignee
Snam Progetti
Chen Comitato Nazionale
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snam Progetti, Chen Comitato Nazionale filed Critical Snam Progetti
Publication of DK401176A publication Critical patent/DK401176A/da
Publication of DK151425B publication Critical patent/DK151425B/da
Application granted granted Critical
Publication of DK151425C publication Critical patent/DK151425C/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3013—Au as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/93—Thermoelectric, e.g. peltier effect cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
DK401176A 1975-09-30 1976-09-06 Fremgangsmaade til fremstilling af et termoelektrisk modul DK151425C (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT2777775 1975-09-30
IT27777/75A IT1042975B (it) 1975-09-30 1975-09-30 Metodo per la costruzione di un modulo termoelettrico e modulo cosi ottenuto

Publications (3)

Publication Number Publication Date
DK401176A true DK401176A (da) 1977-03-31
DK151425B DK151425B (da) 1987-11-30
DK151425C DK151425C (da) 1988-05-16

Family

ID=11222306

Family Applications (1)

Application Number Title Priority Date Filing Date
DK401176A DK151425C (da) 1975-09-30 1976-09-06 Fremgangsmaade til fremstilling af et termoelektrisk modul

Country Status (11)

Country Link
US (2) US4081895A (da)
JP (1) JPS5263084A (da)
BE (1) BE846800A (da)
CA (2) CA1081369A (da)
DE (1) DE2644283C3 (da)
DK (1) DK151425C (da)
FR (2) FR2335057A1 (da)
GB (2) GB1550689A (da)
IT (1) IT1042975B (da)
LU (1) LU75897A1 (da)
NL (1) NL176416C (da)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4654224A (en) * 1985-02-19 1987-03-31 Energy Conversion Devices, Inc. Method of manufacturing a thermoelectric element
EP0288022B1 (en) * 1987-04-22 1995-11-15 Sharp Kabushiki Kaisha Superconductive apparatus
US4855810A (en) * 1987-06-02 1989-08-08 Gelb Allan S Thermoelectric heat pump
US4902648A (en) * 1988-01-05 1990-02-20 Agency Of Industrial Science And Technology Process for producing a thermoelectric module
US5006505A (en) 1988-08-08 1991-04-09 Hughes Aircraft Company Peltier cooling stage utilizing a superconductor-semiconductor junction
US5722158A (en) * 1993-10-22 1998-03-03 Fritz; Robert E. Method of manufacture and resulting thermoelectric module
US5434744A (en) * 1993-10-22 1995-07-18 Fritz; Robert E. Thermoelectric module having reduced spacing between semiconductor elements
DE69735589T2 (de) * 1996-05-28 2007-01-04 Matsushita Electric Works, Ltd., Kadoma Herstellungsverfahren für einen thermoelektrischen modul
EP0887869B9 (en) 1996-11-15 2005-05-18 Citizen Watch Co. Ltd. Method of manufacturing thermionic element
US6300150B1 (en) 1997-03-31 2001-10-09 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
RU2124785C1 (ru) * 1997-07-04 1999-01-10 Акционерное общество закрытого типа "МИНЭКС" Способ изготовления термоэлектрического модуля
KR100297290B1 (ko) * 1998-04-22 2001-10-25 우대실 열전반도체모듈및그제조방법
AT410492B (de) * 2000-05-02 2003-05-26 Span Gerhard Dipl Ing Dr Thermoelektrisches element mit mindestens einer n-schicht und mindestens einer p-schicht
US20040251539A1 (en) * 2001-09-12 2004-12-16 Faris Sadeg M. Thermoelectric cooler array
US20070101737A1 (en) 2005-11-09 2007-05-10 Masao Akei Refrigeration system including thermoelectric heat recovery and actuation
US7310953B2 (en) 2005-11-09 2007-12-25 Emerson Climate Technologies, Inc. Refrigeration system including thermoelectric module
DE102006017547B4 (de) * 2006-04-13 2012-10-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermoelektrisches Bauelement sowie Herstellverfahren hierfür
US7937952B2 (en) * 2008-10-16 2011-05-10 Emcore Corporation Thermoelectric cooler with multiple temperature zones
JP2010251485A (ja) * 2009-04-15 2010-11-04 Sony Corp 熱電装置、熱電装置の製造方法、熱電装置の制御システム及び電子機器
DE102009032906A1 (de) * 2009-07-10 2011-01-20 O-Flexx Technologies Gmbh Modul mit mehreren thermoelektrischen Elementen
DE102009048985A1 (de) * 2009-10-09 2011-04-21 O-Flexx Technologies Gmbh Modul mit mehreren thermoelektrischen Elementen
DE102011001653A1 (de) * 2011-03-30 2012-10-04 O-Flexx Technologies Gmbh Thermoelektrische Anordnung
US20140048111A1 (en) * 2012-08-17 2014-02-20 Thomas G. Hinsperger Method and system for producing an electric current from a temperature differential
DE102012102090A1 (de) * 2012-01-31 2013-08-01 Curamik Electronics Gmbh Thermoelektrisches Generatormodul, Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
ES2397775B1 (es) * 2012-11-16 2013-09-27 La Farga Lacambra, S.A. Procedimiento de obtención de aleaciones Zn-Sb con propiedades termoeléctricas
US9218979B2 (en) 2014-01-16 2015-12-22 Phononic Devices, Inc. Low resistivity ohmic contact

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3208835A (en) * 1961-04-27 1965-09-28 Westinghouse Electric Corp Thermoelectric members
DE1243743B (de) * 1961-09-19 1967-07-06 Siemens Ag Thermoelektrische Anordnung
FR1380170A (fr) * 1963-01-21 1964-11-27 Rue Frigistor S A De Unité thermoélectrique et procédé pour sa fabrication
GB1118183A (en) * 1964-05-01 1968-06-26 Plessey Uk Ltd Improvements in or relating to thermoelectric devices
GB1198988A (en) * 1966-08-31 1970-07-15 G V Planer Ltd Improvements in or relating to Thermoelectric Devices
GB1202199A (en) * 1966-11-22 1970-08-12 G V Planer Ltd Improvements in or relating to thermoelectric devices
FR2261638B1 (da) * 1974-02-15 1976-11-26 Cit Alcatel
GB1469856A (en) * 1974-05-28 1977-04-06 Johnson Matthey Co Ltd Solder alloy

Also Published As

Publication number Publication date
FR2335057A1 (fr) 1977-07-08
DE2644283A1 (de) 1977-03-31
FR2334758A1 (fr) 1977-07-08
IT1042975B (it) 1980-01-30
DE2644283B2 (de) 1979-09-13
US4081895A (en) 1978-04-04
CA1081369A (en) 1980-07-08
JPS5263084A (en) 1977-05-25
DK151425C (da) 1988-05-16
GB1550689A (en) 1979-08-15
NL176416C (nl) 1985-04-01
DE2644283C3 (de) 1980-05-29
DK151425B (da) 1987-11-30
USRE30652E (en) 1981-06-16
FR2334758B1 (da) 1980-04-18
NL176416B (nl) 1984-11-01
NL7610703A (nl) 1977-04-01
FR2335057B1 (da) 1983-01-21
CA1092862A (en) 1981-01-06
JPS6112397B2 (da) 1986-04-08
BE846800A (fr) 1977-03-30
LU75897A1 (da) 1977-05-11
GB1550690A (en) 1979-08-15

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