DK4098964T3 - Køleanordning med en lukket kreds, en halvåben kreds og mindst en ventilator - Google Patents

Køleanordning med en lukket kreds, en halvåben kreds og mindst en ventilator Download PDF

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Publication number
DK4098964T3
DK4098964T3 DK21305725.0T DK21305725T DK4098964T3 DK 4098964 T3 DK4098964 T3 DK 4098964T3 DK 21305725 T DK21305725 T DK 21305725T DK 4098964 T3 DK4098964 T3 DK 4098964T3
Authority
DK
Denmark
Prior art keywords
fan
semi
cooling device
circuit
open circuit
Prior art date
Application number
DK21305725.0T
Other languages
English (en)
Inventor
Mohamad Hnayno
Hadrien Bauduin
Anas Chakir
Ali Chehade
Original Assignee
Ovh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ovh filed Critical Ovh
Application granted granted Critical
Publication of DK4098964T3 publication Critical patent/DK4098964T3/da

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/0233Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels
    • F28D1/024Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with air flow channels with an air driving element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20827Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28CHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
    • F28C1/00Direct-contact trickle coolers, e.g. cooling towers
    • F28C1/14Direct-contact trickle coolers, e.g. cooling towers comprising also a non-direct contact heat exchange
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D5/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D5/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
    • F28D5/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation in which the evaporating medium flows in a continuous film or trickles freely over the conduits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263Heat dissipaters releasing heat from coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309Evaporators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/2079Liquid cooling without phase change within rooms for removing heat from cabinets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28BSTEAM OR VAPOUR CONDENSERS
    • F28B1/00Condensers in which the steam or vapour is separate from the cooling medium by walls, e.g. surface condenser
    • F28B1/02Condensers in which the steam or vapour is separate from the cooling medium by walls, e.g. surface condenser using water or other liquid as the cooling medium
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28BSTEAM OR VAPOUR CONDENSERS
    • F28B1/00Condensers in which the steam or vapour is separate from the cooling medium by walls, e.g. surface condenser
    • F28B1/06Condensers in which the steam or vapour is separate from the cooling medium by walls, e.g. surface condenser using air or other gas as the cooling medium
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28CHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION
    • F28C1/00Direct-contact trickle coolers, e.g. cooling towers
    • F28C1/14Direct-contact trickle coolers, e.g. cooling towers comprising also a non-direct contact heat exchange
    • F28C2001/145Direct-contact trickle coolers, e.g. cooling towers comprising also a non-direct contact heat exchange with arrangements of adjacent wet and dry passages
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031Radiators for recooling a coolant of cooling systems
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/54Free-cooling systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
DK21305725.0T 2021-05-31 2021-05-31 Køleanordning med en lukket kreds, en halvåben kreds og mindst en ventilator DK4098964T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP21305725.0A EP4098964B1 (en) 2021-05-31 2021-05-31 Cooling arrangement comprising a closed loop, a semi-open loop and at least one fan

Publications (1)

Publication Number Publication Date
DK4098964T3 true DK4098964T3 (da) 2023-06-06

Family

ID=76355426

Family Applications (1)

Application Number Title Priority Date Filing Date
DK21305725.0T DK4098964T3 (da) 2021-05-31 2021-05-31 Køleanordning med en lukket kreds, en halvåben kreds og mindst en ventilator

Country Status (7)

Country Link
US (1) US11768035B2 (da)
EP (1) EP4098964B1 (da)
KR (1) KR20220162087A (da)
CN (1) CN115968162B (da)
CA (1) CA3160980A1 (da)
DK (1) DK4098964T3 (da)
PL (1) PL4098964T3 (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12160981B2 (en) * 2022-01-24 2024-12-03 Nvidia Corporation Three-way flow controller paths for single-phase and two-phase cooling in datacenter cooling systems
US12004326B2 (en) * 2022-10-21 2024-06-04 Dell Products L.P. Architecture to provide liquid and closed loop air cooling
EP4498771B1 (en) * 2023-06-28 2026-04-22 Ovh Dry cooling arrangement for a datacenter
EP4598292A1 (en) * 2024-01-31 2025-08-06 Ovh Thermal regulation system for a back-up system for a data center
US20250393173A1 (en) * 2024-06-20 2025-12-25 Bradley John Klein High-efficiency cooling systems and methods for a computer data center using a supplemental heat exchanger
EP4672885A1 (en) * 2024-06-28 2025-12-31 Ovh OPTIMIZED EVAPORATIVE DRY COOLING LAYOUT FOR A DATA CENTER
EP4687379A1 (en) * 2024-08-02 2026-02-04 Ovh Optimized evaporative dry cooling arrangement and process for a datacenter

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4107942A (en) 1977-03-31 1978-08-22 Fairman Stanley W Cooling system
US4827733A (en) * 1987-10-20 1989-05-09 Dinh Company Inc. Indirect evaporative cooling system
US20030033831A1 (en) * 2001-08-15 2003-02-20 Davies Brian M. System and method of cooling
EP1698847A1 (en) 2005-02-07 2006-09-06 Dambassinas Hippocrates Hybrid adiabatic heat exchange system
EP2171362A1 (en) 2007-06-14 2010-04-07 Muller Industries Australia PTY LTD System and method of wetting adiabatic material
US7887030B2 (en) 2008-05-19 2011-02-15 Spx Cooling Technologies, Inc. Wet/dry cooling tower and method
KR20120036811A (ko) * 2009-05-29 2012-04-18 파커-한니핀 코포레이션 펌프형 루프 구동식 증기 압축 냉각 시스템
US9476649B2 (en) * 2011-09-23 2016-10-25 R4 Ventures Llc Real-time individual electronic enclosure cooling system
US8635878B2 (en) 2011-10-26 2014-01-28 Arthur Samuel Consoli Dual usage two-stage indirect evaporative cooling system
US9945569B2 (en) 2014-09-10 2018-04-17 Munters Corporation Water minimizing method and apparatus for use with evaporative cooling devices
WO2017152268A1 (en) * 2016-03-08 2017-09-14 Nortek Air Solutions Canada, Inc. Systems and methods for providing cooling to a heat load
EP3295088B1 (en) * 2015-05-15 2022-01-12 Nortek Air Solutions Canada, Inc. Using liquid to air membrane energy exchanger for liquid cooling
US10619898B2 (en) * 2017-02-09 2020-04-14 Baltimore Aircoil Company, Inc. Water recirculation system
US10132569B2 (en) 2017-03-21 2018-11-20 SPX Technologies, Inc. Hybrid fluid cooler with extended intermediate basin nozzles
US10948223B2 (en) 2017-08-01 2021-03-16 Maryam Tolouei Asbforoushani Evaporative fluid-cooler with integrated mechanical cooling system
CA3119386A1 (en) * 2018-12-20 2020-06-25 Nortek Air Solutions Canada, Inc. Evaporative cooler wet and dry mode control

Also Published As

Publication number Publication date
EP4098964A1 (en) 2022-12-07
EP4098964B1 (en) 2023-05-17
KR20220162087A (ko) 2022-12-07
CA3160980A1 (en) 2022-11-30
PL4098964T3 (pl) 2023-07-24
US11768035B2 (en) 2023-09-26
US20220390178A1 (en) 2022-12-08
CN115968162A (zh) 2023-04-14
CN115968162B (zh) 2024-08-13

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