DK446884A - Palladium/nikkelovertraek, der kan loddes, og fremgangsmaade til tilvejebringelse heraf ved elektroplettering - Google Patents

Palladium/nikkelovertraek, der kan loddes, og fremgangsmaade til tilvejebringelse heraf ved elektroplettering Download PDF

Info

Publication number: DK446884A
Authority: DK; Denmark
Prior art keywords: palladium; layer; nickel; atomic percent; electropleting
Prior art date: 1983-11-15

Application number

DK446884A

Other languages

Danish (da)

English (en)

Other versions

DK446884D0 (da

Inventor

Stephen Wayne Updegraff

Original Assignee

Du Pont

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-11-15

Filing date

1984-09-19

Publication date

1985-05-16

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24203230&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK446884(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1984-09-19 Application filed by Du Pont filed Critical Du Pont

1984-09-19 Publication of DK446884D0 publication Critical patent/DK446884D0/da

1985-05-16 Publication of DK446884A publication Critical patent/DK446884A/da

Links

PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 7
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title abstract 5
229910052759 nickel Inorganic materials 0.000 title abstract 4
229910052763 palladium Inorganic materials 0.000 title abstract 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 2
239000011248 coating agent Substances 0.000 abstract 2
238000000576 coating method Methods 0.000 abstract 2
239000000956 alloy Substances 0.000 abstract 1
229910045601 alloy Inorganic materials 0.000 abstract 1
238000007598 dipping method Methods 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Electroplating Methods And Accessories (AREA)
Electroplating And Plating Baths Therefor (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Laminated Bodies (AREA)
Non-Insulated Conductors (AREA)
Other Surface Treatments For Metallic Materials (AREA)
ing And Chemical Polishing (AREA)
Coating With Molten Metal (AREA)
Lead Frames For Integrated Circuits (AREA)

DK446884A 1983-11-15 1984-09-19 Palladium/nikkelovertraek, der kan loddes, og fremgangsmaade til tilvejebringelse heraf ved elektroplettering DK446884A (da)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US06/551,925 US4463060A (en)	1983-11-15	1983-11-15	Solderable palladium-nickel coatings and method of making said coatings

Publications (2)

Publication Number	Publication Date
DK446884D0 DK446884D0 (da)	1984-09-19
DK446884A true DK446884A (da)	1985-05-16

Family

ID=24203230

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DK446884A DK446884A (da)	1983-11-15	1984-09-19	Palladium/nikkelovertraek, der kan loddes, og fremgangsmaade til tilvejebringelse heraf ved elektroplettering

Country Status (13)

Country	Link
US (1)	US4463060A (de)
EP (1)	EP0146152B1 (de)
JP (1)	JPS60106993A (de)
KR (1)	KR890002838B1 (de)
AT (1)	ATE24554T1 (de)
AU (1)	AU549886B2 (de)
BR (1)	BR8405026A (de)
CA (1)	CA1255618A (de)
DE (1)	DE3461834D1 (de)
DK (1)	DK446884A (de)
ES (1)	ES8602971A1 (de)
MX (1)	MX162670A (de)
NO (1)	NO165250C (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4613069A (en) *	1981-11-23	1986-09-23	The United States Of America As Represented By The Secretary Of The Interior	Method for soldering aluminum and magnesium
US4628165A (en) *	1985-09-11	1986-12-09	Learonal, Inc.	Electrical contacts and methods of making contacts by electrodeposition
US4849303A (en) *	1986-07-01	1989-07-18	E. I. Du Pont De Nemours And Company	Alloy coatings for electrical contacts
EP0329877B1 (de) *	1988-02-25	1993-05-12	E.I. Du Pont De Nemours And Company	Elektroplattierungsbad und Verfahren zum Stabilhalten der Zusammensetzung der plattierten Legierung
US4846941A (en) *	1986-07-01	1989-07-11	E. I. Du Pont De Nemours And Company	Electroplating bath and process for maintaining plated alloy composition stable
US4743346A (en) *	1986-07-01	1988-05-10	E. I. Du Pont De Nemours And Company	Electroplating bath and process for maintaining plated alloy composition stable
DE68909984T2 (de) *	1988-04-01	1994-04-21	Du Pont	Elektroplattierte Legierungsbeschichtungen, die eine stabile Legierungszusammensetzung aufweisen.
JPH0359972A (ja) *	1989-07-27	1991-03-14	Yazaki Corp	電気接点
JPH0484449A (ja) *	1990-07-27	1992-03-17	Shinko Electric Ind Co Ltd	Ｔａｂテープ
US6060175A (en) *	1990-09-13	2000-05-09	Sheldahl, Inc.	Metal-film laminate resistant to delamination
US5086966A (en) *	1990-11-05	1992-02-11	Motorola Inc.	Palladium-coated solder ball
US5597470A (en) *	1995-06-18	1997-01-28	Tessera, Inc.	Method for making a flexible lead for a microelectronic device
US5749933A (en) *	1996-03-28	1998-05-12	Johns Manville International, Inc.	Apparatus and method for producing glass fibers
SG71046A1 (en)	1996-10-10	2000-03-21	Connector Systems Tech Nv	High density connector and method of manufacture
JP3379412B2 (ja) *	1997-05-30	2003-02-24	松下電器産業株式会社	パラジウムめっき液とこれを用いたパラジウムめっき皮膜及びこのパラジウムめっき皮膜を有する半導体装置用リードフレーム
US7023231B2 (en) *	2004-05-14	2006-04-04	Solid State Measurements, Inc.	Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
US8636579B2 (en)	2006-11-09	2014-01-28	Wms Gaming Inc.	Wagering game with pay lines extending through bonus regions
WO2012001132A1 (de) *	2010-06-30	2012-01-05	Schauenburg Ruhrkunststoff Gmbh	Tribologisch belastbare edelmetall/metallschichten
EP2588645B1 (de)	2010-06-30	2018-05-30	RDM Family Investments LLC	Verfahren zur abscheidung einer nickel-metall-schicht
JP6973051B2 (ja) *	2017-12-26	2021-11-24	株式会社リコー	液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置
WO2020145096A1 (ja) *	2019-01-07	2020-07-16	株式会社村田製作所	濾過フィルタ
CN113993374A (zh) *	2019-06-21	2022-01-28	松下知识产权经营株式会社	动物信息管理系统和动物信息管理方法
CN113699565B (zh) *	2021-09-28	2023-07-04	万明电镀智能科技(东莞)有限公司	高耐蚀性钯镍合金镀层及其电镀方法和钯镍镀层电镀液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4100039A (en) *	1976-11-11	1978-07-11	International Business Machines Corporation	Method for plating palladium-nickel alloy
US4284482A (en) *	1980-09-22	1981-08-18	Bell Telephone Laboratories, Incorporated	Palladium treatment procedure
DE3108466C2 (de) *	1981-03-06	1983-05-26	Langbein-Pfanhauser Werke Ag, 4040 Neuss	Verwendung eines Acetylenalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
DE3232735C2 (de) *	1981-09-11	1984-04-26	LPW-Chemie GmbH, 4040 Neuss	Verwendung einer als Glanzbildnerzusatz zu Nickelbädern bekannten Verbindung als Korrosionsschutzadditiv

1983
- 1983-11-15 US US06/551,925 patent/US4463060A/en not_active Expired - Lifetime
1984
- 1984-09-17 NO NO843689A patent/NO165250C/no unknown
- 1984-09-19 DK DK446884A patent/DK446884A/da not_active Application Discontinuation
- 1984-09-19 AU AU33295/84A patent/AU549886B2/en not_active Ceased
- 1984-09-20 CA CA000463708A patent/CA1255618A/en not_active Expired
- 1984-09-21 AT AT84201362T patent/ATE24554T1/de not_active IP Right Cessation
- 1984-09-21 DE DE8484201362T patent/DE3461834D1/de not_active Expired
- 1984-09-21 EP EP84201362A patent/EP0146152B1/de not_active Expired
- 1984-09-26 ES ES536238A patent/ES8602971A1/es not_active Expired
- 1984-10-02 MX MX202921A patent/MX162670A/es unknown
- 1984-10-04 BR BR8405026A patent/BR8405026A/pt not_active IP Right Cessation
- 1984-10-09 JP JP59210613A patent/JPS60106993A/ja active Granted
- 1984-10-11 KR KR1019840006282A patent/KR890002838B1/ko not_active Expired

Also Published As

Publication number	Publication date
MX162670A (es)	1991-06-14
JPS60106993A (ja)	1985-06-12
NO165250C (no)	1991-01-16
NO165250B (no)	1990-10-08
BR8405026A (pt)	1985-08-20
ES536238A0 (es)	1985-12-01
KR890002838B1 (ko)	1989-08-04
US4463060A (en)	1984-07-31
AU549886B2 (en)	1986-02-20
EP0146152B1 (de)	1986-12-30
AU3329584A (en)	1985-05-30
JPS623238B2 (de)	1987-01-23
EP0146152A1 (de)	1985-06-26
ATE24554T1 (de)	1987-01-15
CA1255618A (en)	1989-06-13
ES8602971A1 (es)	1985-12-01
DE3461834D1 (en)	1987-02-05
KR850004135A (ko)	1985-07-01
NO843689L (no)	1985-05-20
DK446884D0 (da)	1984-09-19

Legal Events

Date	Code	Title	Description
1992-10-12	AHS	Application shelved for other reasons than non-payment

Publication	Publication Date	Title
DK446884A (da)	1985-05-16	Palladium/nikkelovertraek, der kan loddes, og fremgangsmaade til tilvejebringelse heraf ved elektroplettering
CA2069363A1 (en)	1993-01-23	Thermal annealing of palladium alloys
JPS5534692A (en)	1980-03-11	Gold plated electronic parts and production thereof
JPH039198B2 (de)	1991-02-07
ES533300A0 (es)	1985-10-16	Un metodo de formar una estructura de contacto electrico
JPS63121693A (ja)	1988-05-25	コネクタ−用端子
JPS6486527A (en)	1989-03-31	Ccb tape carrier
ES8206082A1 (es)	1982-07-01	Procedimiento de realizacion de elementos conductores.
JPS5945754B2 (ja)	1984-11-08	時計用外装部品
JPS63114083A (ja)	1988-05-18	コネクタ−用リ−ドフレ−ム
Updegraff	1985	Solderable Palladium--Nickel Coatings
JPS61288384A (ja)	1986-12-18	電気用接点
Sterling	1984	Electroplating Electrical Contacts
EP0063925A1 (de)	1982-11-03	Verfahren zur elektrolytischen Plattierung und dadurch hergestellte Produkte
JPS56142886A (en)	1981-11-07	Tin plating method for aluminum alloy
US2211582A (en)	1940-08-13	Process of electrolytically coating nonconductive materials
JPS6417450A (en)	1989-01-20	Formation of bump
JPS61284593A (ja)	1986-12-15	接触子用銅合金条の製造方法
JPS56269A (en)	1981-01-06	Plural layer non-electrolytic plating
Blidariu et al.	1984	Deposition of Sn--Pb Alloy Applied to the Electric Contact Technology
JPS56104241A (en)	1981-08-19	Gas sensing element
JPS5941536Y2 (ja)	1984-11-30	リ−ド端子
DE2311660C3 (de)	1977-05-12	Verfahren zum partiellen Galvanisieren eines Halbleiterkörpers aus Silizium
FR2241143A1 (en)	1975-03-14	Semiconductor device with cct. element(s) with connecting points - has free areas of main and side surfaces coated with metal film
JPS645091A (en)	1989-01-10	Circuit substrate