DK54988D0 - Materiale til binding af integrerede kredsloeb til uorganiske, dielektriske underlag - Google Patents

Materiale til binding af integrerede kredsloeb til uorganiske, dielektriske underlag

Info

Publication number
DK54988D0
DK54988D0 DK054988A DK54988A DK54988D0 DK 54988 D0 DK54988 D0 DK 54988D0 DK 054988 A DK054988 A DK 054988A DK 54988 A DK54988 A DK 54988A DK 54988 D0 DK54988 D0 DK 54988D0
Authority
DK
Denmark
Prior art keywords
inorganic
materials
integrated circuits
dielectric surfaces
binding integrated
Prior art date
Application number
DK054988A
Other languages
English (en)
Other versions
DK54988A (da
Inventor
Sara Trygg Joslin
Christine Mary Rosell
Jerome David Smith
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of DK54988D0 publication Critical patent/DK54988D0/da
Publication of DK54988A publication Critical patent/DK54988A/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
DK054988A 1987-11-25 1988-02-03 Materiale til binding af integrerede kredsloeb til uorganiske, dielektriske underlag DK54988A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12262887A 1987-11-25 1987-11-25

Publications (2)

Publication Number Publication Date
DK54988D0 true DK54988D0 (da) 1988-02-03
DK54988A DK54988A (da) 1989-05-26

Family

ID=22403829

Family Applications (1)

Application Number Title Priority Date Filing Date
DK054988A DK54988A (da) 1987-11-25 1988-02-03 Materiale til binding af integrerede kredsloeb til uorganiske, dielektriske underlag

Country Status (7)

Country Link
EP (1) EP0317694B1 (da)
JP (1) JP2895063B2 (da)
KR (1) KR910003851B1 (da)
CA (1) CA1324859C (da)
DE (1) DE3882920T2 (da)
DK (1) DK54988A (da)
HK (1) HK27394A (da)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4986849A (en) * 1988-09-23 1991-01-22 Johnson Matthey Inc. Silver-glass pastes
JP2659578B2 (ja) * 1989-02-06 1997-09-30 三菱製紙株式会社 写真用支持体
US4933030A (en) * 1989-06-21 1990-06-12 Dietz Raymond L Low temperature glass composition, paste and method of use
DE4013256C1 (en) * 1990-04-26 1991-10-24 Degussa Ag, 6000 Frankfurt, De Solder paste for sticking electrical components on substrates - comprises mixt. of silver powder and low melting glass powder
EP0558841A1 (en) * 1992-03-04 1993-09-08 CTS Corporation Copper ink for aluminium nitride
DE19531170C1 (de) * 1995-08-24 1996-11-21 Cerdec Ag Elektrostatisch applizierbares Beschichtungspulver, Verfahren zu seiner Herstellung und seine Verwendung zur Herstellung keramischer Beschichtungen
DE10150197A1 (de) * 2001-10-12 2003-05-08 Tesa Ag Haftklebemassen mit geringer Klebkraft
TWI540590B (zh) * 2011-05-31 2016-07-01 住友電木股份有限公司 半導體裝置
TW201529655A (zh) * 2013-12-11 2015-08-01 Heraeus Precious Metals North America Conshohocken Llc 用於導電性糊料之含有丙烯酸系樹脂之有機載體
EP3276652A3 (de) * 2015-04-02 2018-04-25 Heraeus Deutschland GmbH & Co. KG Verfahren zum herstellen einer substratanordnung mit einem klebevorfixiermittel, entsprechende substratanordnung, verfahren zum verbinden eines elektronikbauteils mit einer substratanordnung mit anwendung eines auf dem elektronikbauteil und/oder der substratanordnung aufgebrachten klebevorfixiermittels und mit einer substratanordnung verbundenes elektronikbauteil
CN105693094B (zh) * 2016-03-24 2019-06-14 福建省南平市三金电子有限公司 一种预烧低熔封接玻璃片及其制备方法
WO2025142516A1 (ja) * 2023-12-28 2025-07-03 ナミックス株式会社 導電性ペースト、導電膜、セラミックス回路基板及び電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3350341A (en) * 1964-07-16 1967-10-31 Du Pont Silver compositions containing novel vitreous binders and a vehicle
US3843379A (en) * 1971-03-15 1974-10-22 Owens Illinois Inc Gold powder
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate

Also Published As

Publication number Publication date
KR910003851B1 (ko) 1991-06-12
EP0317694A1 (en) 1989-05-31
JP2895063B2 (ja) 1999-05-24
DK54988A (da) 1989-05-26
HK27394A (en) 1994-03-31
JPH02269172A (ja) 1990-11-02
CA1324859C (en) 1993-11-30
EP0317694B1 (en) 1993-08-04
DE3882920D1 (de) 1993-09-09
DE3882920T2 (de) 1993-12-23
KR890008280A (ko) 1989-07-10

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment