DK627788D0 - Fremgangsmaade til fjernelse af bly/tin-, bly- eller tinlag fra kobber- eller nikkeloverflader samt badoploesninger til anvendelse derved - Google Patents

Fremgangsmaade til fjernelse af bly/tin-, bly- eller tinlag fra kobber- eller nikkeloverflader samt badoploesninger til anvendelse derved

Info

Publication number
DK627788D0
DK627788D0 DK627788A DK627788A DK627788D0 DK 627788 D0 DK627788 D0 DK 627788D0 DK 627788 A DK627788 A DK 627788A DK 627788 A DK627788 A DK 627788A DK 627788 D0 DK627788 D0 DK 627788D0
Authority
DK
Denmark
Prior art keywords
lead
tin
copper
removal
procedure
Prior art date
Application number
DK627788A
Other languages
English (en)
Other versions
DK627788A (da
Inventor
Guenter Mika
Original Assignee
Ruwel Werke Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ruwel Werke Gmbh filed Critical Ruwel Werke Gmbh
Publication of DK627788D0 publication Critical patent/DK627788D0/da
Publication of DK627788A publication Critical patent/DK627788A/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Chemically Coating (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Extraction Or Liquid Replacement (AREA)
DK627788A 1987-11-11 1988-11-10 Fremgangsmaade til fjernelse af bly/tin-, bly- eller tinlag fra kobber- eller nikkeloverflader samt badoploesninger til anvendelse derved DK627788A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873738307 DE3738307A1 (de) 1987-11-11 1987-11-11 Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen

Publications (2)

Publication Number Publication Date
DK627788D0 true DK627788D0 (da) 1988-11-10
DK627788A DK627788A (da) 1989-05-12

Family

ID=6340281

Family Applications (1)

Application Number Title Priority Date Filing Date
DK627788A DK627788A (da) 1987-11-11 1988-11-10 Fremgangsmaade til fjernelse af bly/tin-, bly- eller tinlag fra kobber- eller nikkeloverflader samt badoploesninger til anvendelse derved

Country Status (9)

Country Link
US (1) US4919752A (da)
EP (1) EP0315891B1 (da)
JP (1) JPH01156481A (da)
AT (1) ATE76663T1 (da)
CA (1) CA1313611C (da)
DE (1) DE3738307A1 (da)
DK (1) DK627788A (da)
ES (1) ES2041765T3 (da)
GB (1) GB2212112A (da)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921571A (en) * 1989-07-28 1990-05-01 Macdermid, Incorporated Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
US5017267A (en) * 1990-07-17 1991-05-21 Macdermid, Incorporated Composition and method for stripping tin or tin-lead alloy from copper surfaces
US5244539A (en) * 1992-01-27 1993-09-14 Ardrox, Inc. Composition and method for stripping films from printed circuit boards
CA2090349C (en) * 1992-03-04 1999-08-17 John L. Cordani Composition and method for stripping tin or tin-lead alloy from copper surfaces
US5755950A (en) * 1995-06-07 1998-05-26 Dulin Metals Company Process for removing plating materials from copper-based substrates
JPH1072682A (ja) * 1996-08-30 1998-03-17 Mec Kk 錫および錫合金の剥離液
JP3345569B2 (ja) * 1997-07-14 2002-11-18 株式会社キッツ バルブ・管継手等の銅合金製配管器材の鉛溶出防止法及びその銅合金製配管器材
US6258294B1 (en) 1997-10-01 2001-07-10 Morton International, Inc. Composition for stripping solder and tin from printed circuit boards
EP1302569A3 (en) * 2001-10-11 2004-03-03 Shipley Co. L.L.C. Stripping solution
US7771542B1 (en) 2006-05-30 2010-08-10 Stone Chemical Company Compositions and methods for removing lead from metal surfaces
US8859479B2 (en) * 2011-08-26 2014-10-14 United Technologies Corporation Chemical stripping composition and method
TWI521097B (zh) * 2014-06-25 2016-02-11 優勝奈米科技有限公司 剝錫添加劑及其應用
CN114453587B (zh) * 2021-12-31 2024-02-27 西安理工大学 纳米多孔铜镍合金的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU38281A1 (da) * 1959-03-09
US3607781A (en) * 1968-01-15 1971-09-21 Wyandotte Chemicals Corp Corrosion inhibitor for hydrochloric acid pickling of steel
US3677949A (en) * 1970-09-04 1972-07-18 Enthone Selectively stripping tin and/or lead from copper substrates
US3922229A (en) * 1973-11-12 1975-11-25 Dow Chemical Co Powderless etching bath for magnesium printing plates
DE2824975A1 (de) * 1978-06-07 1979-12-20 Basf Ag Verwendung von wasserloeslichen, vernetzten stickstoffhaltigen kondensationsprodukten als zusatz fuer beiz-, polier- und entmetallisierungsbaeder
US4297257A (en) * 1980-04-17 1981-10-27 Dart Industries Inc. Metal stripping composition and method
JPS57164984A (en) * 1981-04-06 1982-10-09 Metsuku Kk Exfoliating solution for tin or tin alloy
US4397753A (en) * 1982-09-20 1983-08-09 Circuit Chemistry Corporation Solder stripping solution
JPS60149790A (ja) * 1984-01-18 1985-08-07 Metsuku Kk 錫又は錫合金の剥離液
US4713144A (en) * 1986-08-01 1987-12-15 Ardrox Inc. Composition and method for stripping films from printed circuit boards

Also Published As

Publication number Publication date
ATE76663T1 (de) 1992-06-15
CA1313611C (en) 1993-02-16
JPH01156481A (ja) 1989-06-20
DE3738307A1 (de) 1989-05-24
JPH0450390B2 (da) 1992-08-14
DK627788A (da) 1989-05-12
DE3738307C2 (da) 1993-04-22
EP0315891B1 (de) 1992-05-27
ES2041765T3 (es) 1993-12-01
US4919752A (en) 1990-04-24
EP0315891A1 (de) 1989-05-17
GB2212112A (en) 1989-07-19
GB8825828D0 (en) 1988-12-07

Similar Documents

Publication Publication Date Title
DK627788A (da) Fremgangsmaade til fjernelse af bly/tin-, bly- eller tinlag fra kobber- eller nikkeloverflader samt badoploesninger til anvendelse derved
AU544447B2 (en) Vinylidene fluoride and ethylene trifluoride copolymer
ES507933A0 (es) Un metodo de preparar una composicion polimera constituida por un polimero de polimida poli (amida-imida) o poli (semia-mida.)
FR2528862B1 (fr) Adhesif de crepage contenant un copolymere oxyde d'ethylene/oxyde de propylene
DE68902002D1 (de) Herstellungsverfahren fuer ethylenoxid.
IT8223520A0 (it) Procedimento ed apparecchiatura per fabbricare una preforma di guida di luce.
MY107822A (en) Method of purifying saturated fluoroperhalocarbon liquids and related devices
NO173037C (no) Fremgangsmaate for aa tilveiebringe passive tynnsjikt-kretser, og en passiv krets fremstilt ved fremgangsmaaten
AU8626082A (en) Ethylene glycol-hydrogenate higher polyols
IT8249492A0 (it) Processo per separare ossido di etilene da soluzioni acquose
IT8423066A0 (it) Circuito di protezione antidisturbi per circuiti integrati.
IT1168002B (it) Utensile d'urto prevedente una estremita' di impatto ed una estremita' attiva di taglio, e suo procedimento di fabbricazione
NO176953C (no) Anvendelse av et isotiazolonholdig materiale til konservering av trevirke, samt fremgangsmåte for å motvirke at isotiazolon strippes fra en isotiazolonholdig lösning
IT8122944A0 (it) Procedimento di retro-corrisione per circuiti integrati.
AU6932991A (en) Probability estimation based on decision history
EP0227839A4 (en) PROCESS FOR FORMING A THIN FILM.
IT8319201A0 (it) Apparecchiatura di inserimento o commutazione per dispositivi diprotezione.
EP0206158A3 (en) Photopolymers on a polyether basis
EP0145749A4 (en) UNIVERSAL FLAT ORIENTER FOR SEMICONDUCTOR DEVICES.
FR2537908B1 (fr) Dispositif de prehension, notamment pour robot industriel
ES465819A1 (es) Un metodo de eliminacion y prevencion de la acumulacion de limo biologico sobre las superficies de los sistemas refri- gerantes comerciales e industriales y similares
Bogenschütz et al. GALVANISCHE KORROSIONSSCHUTZSCHICHTEN...(ELECTROPLATED CORROSION PROTECTION LAYERS FOR ELECTRONIC APPLICATIONS. PART 3)
IT8124945A0 (it) Complesso di trattenuta e trasporto per trasferire almeno un componente elettrico, o elettronico, su di un substrato.
IT206090Z2 (it) Dispositivo di afferramento per bottiglie.
JPS5321246A (en) Expoliation preventive polyolefin film

Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment