DK85491A - Fremgangsmaade til aetsning af overfladen paa polymermaterialer - Google Patents
Fremgangsmaade til aetsning af overfladen paa polymermaterialer Download PDFInfo
- Publication number
- DK85491A DK85491A DK085491A DK85491A DK85491A DK 85491 A DK85491 A DK 85491A DK 085491 A DK085491 A DK 085491A DK 85491 A DK85491 A DK 85491A DK 85491 A DK85491 A DK 85491A
- Authority
- DK
- Denmark
- Prior art keywords
- seating
- procedure
- polymer materials
- polymer
- materials
- Prior art date
Links
- 239000002861 polymer material Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/268,154 US4941940A (en) | 1988-11-07 | 1988-11-07 | Pre-swelling and etching of plastics for plating |
| PCT/US1989/004738 WO1990005203A1 (fr) | 1988-11-07 | 1989-10-20 | Pregonflement et degradation de matieres synthetiques a revetir |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DK85491D0 DK85491D0 (da) | 1991-05-07 |
| DK85491A true DK85491A (da) | 1991-07-02 |
Family
ID=23021719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK085491A DK85491A (da) | 1988-11-07 | 1991-05-07 | Fremgangsmaade til aetsning af overfladen paa polymermaterialer |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US4941940A (fr) |
| EP (1) | EP0441867A1 (fr) |
| KR (1) | KR900702076A (fr) |
| AU (1) | AU4623889A (fr) |
| BR (1) | BR8907752A (fr) |
| CA (1) | CA2002304A1 (fr) |
| DK (1) | DK85491A (fr) |
| ES (1) | ES2021176A6 (fr) |
| WO (1) | WO1990005203A1 (fr) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5308387A (en) * | 1987-09-25 | 1994-05-03 | Elf Atochem North America, Inc. | Pre-etch treatment of a plastic substrate |
| US5015329A (en) * | 1988-11-07 | 1991-05-14 | Jp Laboratories, Inc. | Pre-swelling and etching of plastics for plating |
| US5132191A (en) * | 1990-10-26 | 1992-07-21 | General Electric Company | Polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
| US5180639A (en) * | 1990-10-26 | 1993-01-19 | General Electric Company | Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
| US5167992A (en) * | 1991-03-11 | 1992-12-01 | Microelectronics And Computer Technology Corporation | Selective electroless plating process for metal conductors |
| US5302415A (en) * | 1992-12-08 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Electroless plated aramid surfaces and a process for making such surfaces |
| US5380474A (en) * | 1993-05-20 | 1995-01-10 | Sandia Corporation | Methods for patterned deposition on a substrate |
| DE4326079A1 (de) * | 1993-07-30 | 1995-02-02 | Atotech Deutschland Gmbh | Verfahren zur Behandlung von Kunststoffoberflächen und Anquell-Lösung |
| US5385728A (en) * | 1993-09-28 | 1995-01-31 | Suh; Byoung I. | Antimicrobial etchants |
| US6437955B1 (en) | 1995-09-14 | 2002-08-20 | Tyco Electronics Corporation | Frequency-selective circuit protection arrangements |
| US6500885B1 (en) | 1997-02-28 | 2002-12-31 | Candescent Technologies Corporation | Polycarbonate-containing liquid chemical formulation and methods for making and using polycarbonate film |
| US6180698B1 (en) | 1997-02-28 | 2001-01-30 | Candescent Technologies Corporation | Polycarbonate-containing liquid chemical formulation and method for making polycarbonate film |
| US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
| US6074997A (en) * | 1997-09-26 | 2000-06-13 | The Andrew Jergens Company | Method of manufacturing an improved cleansing bar with filler and excellent aesthetic properties |
| CN100338121C (zh) * | 2002-12-20 | 2007-09-19 | 纳幕尔杜邦公司 | 蚀刻聚缩醛制品表面以制备用于后续处理的表面的方法 |
| US20050186404A1 (en) * | 2004-02-23 | 2005-08-25 | Guoping Mao | Etched polycarbonate films |
| US20050199587A1 (en) * | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
| CN101107121A (zh) * | 2004-08-23 | 2008-01-16 | 高贵纤维科技有限公司 | 对聚合物泡沫材料镀金属以制备抗菌和过滤材料的方法 |
| WO2012047454A1 (fr) | 2010-10-06 | 2012-04-12 | E. I. Du Pont De Nemours And Company | Procédé de préparation de surface d'articles en polyamide pour application de revêtement métallique |
| US10260000B2 (en) | 2012-01-23 | 2019-04-16 | Macdermid Acumen, Inc. | Etching of plastic using acidic solutions containing trivalent manganese |
| US9534306B2 (en) | 2012-01-23 | 2017-01-03 | Macdermid Acumen, Inc. | Electrolytic generation of manganese (III) ions in strong sulfuric acid |
| US9752241B2 (en) | 2012-01-23 | 2017-09-05 | Macdermid Acumen, Inc. | Electrolytic generation of manganese (III) ions in strong sulfuric acid using an improved anode |
| CN110551307B (zh) * | 2019-08-07 | 2022-04-19 | 湖南松井新材料股份有限公司 | 一种塑料用打磨剂及在塑料表面形成均匀粗糙面的方法 |
| CN114059050B (zh) * | 2020-08-03 | 2023-03-28 | 比亚迪股份有限公司 | 一种聚苯硫醚基材的表面粗化方法及金属化方法 |
| CN114107965A (zh) * | 2021-10-29 | 2022-03-01 | 北京卫星制造厂有限公司 | 一种聚酰亚胺表面金属层制备方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3660293A (en) * | 1969-09-23 | 1972-05-02 | Crown City Plating Co | Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating |
| US3671289A (en) * | 1969-09-23 | 1972-06-20 | Crown City Plating Co | Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating |
| US3649391A (en) * | 1970-05-01 | 1972-03-14 | Albert D Lewis | Process for producing a marking receptive surface on a polystyrene substrate |
| US3758332A (en) * | 1971-08-20 | 1973-09-11 | Western Electric Co | Method of metal coating an epoxy surface |
| US3795622A (en) * | 1972-07-31 | 1974-03-05 | O Dutkewych | Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating |
| US4125649A (en) * | 1975-05-27 | 1978-11-14 | Crown City Plating | Pre-etch conditioning of polysulfone and other polymers for electroless plating |
| US4042730A (en) * | 1976-03-29 | 1977-08-16 | Bell Telephone Laboratories, Incorporated | Process for electroless plating using separate sensitization and activation steps |
| US4131698A (en) * | 1977-12-16 | 1978-12-26 | Rca Corporation | Pretreatment of polyvinyl chloride plastics for electroless deposition |
| US4335164A (en) * | 1978-12-19 | 1982-06-15 | Crown City Plating Co. | Conditioning of polyamides for electroless plating |
| US4281034A (en) * | 1980-04-03 | 1981-07-28 | Sunbeam Corporation | Plating on plastics by softening with trichloroethylene and methylene chloride bath |
| EP0052968B1 (fr) * | 1980-11-20 | 1986-02-26 | Crosfield Electronics Limited | Revêtement de substrats polymériques |
| US4592929A (en) * | 1984-02-01 | 1986-06-03 | Shipley Company Inc. | Process for metallizing plastics |
| US4820553A (en) * | 1984-03-09 | 1989-04-11 | Allied-Signal Inc. | Method for pretreatment of polyesters for metal plating |
| WO1987000391A1 (fr) * | 1985-06-24 | 1987-01-15 | Enthone, Incorporated | Procede de conditionnement de la surface de substrats en plastique avant la galvanoplastie |
| US4832799A (en) * | 1987-02-24 | 1989-05-23 | Polyonics Corporation | Process for coating at least one surface of a polyimide sheet with copper |
| US4803097A (en) * | 1987-04-20 | 1989-02-07 | Allied-Signal Inc. | Metal plating of plastic materials |
| EP0309243B1 (fr) * | 1987-09-25 | 1993-08-18 | Engelhard Technologies Limited | Traitement de pré-décapage d'un substrat plastique |
| US4775557A (en) * | 1987-11-09 | 1988-10-04 | Enthone, Incorporated | Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
| DE3740369A1 (de) * | 1987-11-25 | 1989-06-08 | Schering Ag | Verfahren zur vorbehandlung von kunststoffen |
-
1988
- 1988-11-07 US US07/268,154 patent/US4941940A/en not_active Expired - Fee Related
-
1989
- 1989-10-20 KR KR1019900701474A patent/KR900702076A/ko not_active Withdrawn
- 1989-10-20 EP EP89912773A patent/EP0441867A1/fr not_active Withdrawn
- 1989-10-20 WO PCT/US1989/004738 patent/WO1990005203A1/fr not_active Ceased
- 1989-10-20 BR BR898907752A patent/BR8907752A/pt not_active Application Discontinuation
- 1989-10-20 AU AU46238/89A patent/AU4623889A/en not_active Abandoned
- 1989-11-03 ES ES8903744A patent/ES2021176A6/es not_active Expired - Lifetime
- 1989-11-06 CA CA002002304A patent/CA2002304A1/fr not_active Abandoned
-
1991
- 1991-05-07 DK DK085491A patent/DK85491A/da unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DK85491D0 (da) | 1991-05-07 |
| EP0441867A1 (fr) | 1991-08-21 |
| WO1990005203A1 (fr) | 1990-05-17 |
| KR900702076A (ko) | 1990-12-05 |
| ES2021176A6 (es) | 1991-10-16 |
| BR8907752A (pt) | 1991-08-20 |
| CA2002304A1 (fr) | 1990-05-07 |
| AU4623889A (en) | 1990-05-28 |
| US4941940A (en) | 1990-07-17 |
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