ECSP972058A - CONDUCTOR BOARD AND PROCEDURE FOR THE PRECISE POSITIONING OF THE EQUIPMENT AND WELDING OF ELECTRONIC CONSTRUCTION ELEMENTS ON THE SURFACES OF THE CONDUCTOR BOARD - Google Patents
CONDUCTOR BOARD AND PROCEDURE FOR THE PRECISE POSITIONING OF THE EQUIPMENT AND WELDING OF ELECTRONIC CONSTRUCTION ELEMENTS ON THE SURFACES OF THE CONDUCTOR BOARDInfo
- Publication number
- ECSP972058A ECSP972058A ECSP972058A ECSP972058A EC SP972058 A ECSP972058 A EC SP972058A EC SP972058 A ECSP972058 A EC SP972058A EC SP972058 A ECSP972058 A EC SP972058A
- Authority
- EC
- Ecuador
- Prior art keywords
- conductive plate
- construction elements
- electronic construction
- electronic
- welding
- Prior art date
Links
- 238000010276 construction Methods 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 4
- 239000004020 conductor Substances 0.000 title 2
- 238000003466 welding Methods 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000007373 indentation Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
Abstract
Placa conductora y procedimiento para el posicionamiento preciso de los equipos y soldadura de los elementos de construcción electrónicos en las superficies de la placa conductora. La invención se refiere a una placa conductora (1) y a un procedimiento para el posicionamiento preciso de los elementos de construcción electrónicos en la superficie (12) de la placa conductora (1), en cuyo caso los elementos de construcción electrónica han de ser unidos de forma eléctricamente conductiva y estable en la placa conductora (1), mediante la técnica de soldadura Reflow. Para ello, se emplea una placa conductora (1) que dispone de zonas (2,3), por lo menos parcialmente adaptadas a los elementos de construcción electrónicos en la superficie (12) del contorno exterior, para el alojamiento de los elementos de construcción electrónicos. Estas zonas que están configuradas como contornos de hendidura (3) ó como ranuras elaboradas (2), aseguran que los elementos de construcción electrónicos colocados quedan sujetados en la posición deseada, después de la aplicación de la pasta de soldar y antes de la propia realización de soldadura. Adicionalmente, se puede empalmar la placa conductora equipada, con una caja consistente en los aditamientos de configuración abovedada de un material por lo menos parcialmente conformable. Los aditamentos, atravesando la placa conductora, se introducen en las escotaduras (14,15 ó 17) elaboradas en ella y así se consigue una unión contundente en forma y/o fuerza entre la caja y la placa conductora mediante la conformación de los aditamientos (14). Además se puede colocar un enchufe de protección contra sobretensiones para las regletas de la técnica de telecomunicación con un descargador de sobretensión (4), que une las dos funciones de "contacto a tierra" y "contacto fail-safe" en una misma pieza y por lo tanto, se puede realizar un equipamiento con un montaje con costes y esfuerzos reducidos.Conductive plate and procedure for the precise positioning of the equipment and welding of the electronic construction elements on the surfaces of the conductive plate. The invention relates to a conductive plate (1) and to a method for the precise positioning of the electronic construction elements on the surface (12) of the conductive plate (1), in which case the electronic construction elements are to be joined electrically conductive and stable on the conductive plate (1), using the Reflow soldering technique. For this, a conductive plate (1) is used that has zones (2,3), at least partially adapted to the electronic construction elements on the surface (12) of the outer contour, for housing the construction elements electronic. These zones, which are configured as indentation contours (3) or as elaborate grooves (2), ensure that the placed electronic construction elements are held in the desired position, after the application of the solder paste and before the actual execution. welding. Additionally, the fitted conductive plate can be spliced, with a box consisting of domed configuration attachments of at least partially conformable material. The fittings, passing through the conductive plate, are introduced into the recesses (14,15 or 17) made in it and thus a forceful union in shape and / or force is achieved between the box and the conductive plate by means of the conformation of the attachments ( 14). In addition, a surge protection plug for the power strips of the telecommunication technology can be placed with a surge arrester (4), which joins the two functions of "ground contact" and "fail-safe contact" in the same piece and therefore, equipment can be assembled with mounting with reduced cost and effort.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ECSP972058 ECSP972058A (en) | 1997-03-14 | 1997-03-14 | CONDUCTOR BOARD AND PROCEDURE FOR THE PRECISE POSITIONING OF THE EQUIPMENT AND WELDING OF ELECTRONIC CONSTRUCTION ELEMENTS ON THE SURFACES OF THE CONDUCTOR BOARD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ECSP972058 ECSP972058A (en) | 1997-03-14 | 1997-03-14 | CONDUCTOR BOARD AND PROCEDURE FOR THE PRECISE POSITIONING OF THE EQUIPMENT AND WELDING OF ELECTRONIC CONSTRUCTION ELEMENTS ON THE SURFACES OF THE CONDUCTOR BOARD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ECSP972058A true ECSP972058A (en) | 1998-04-24 |
Family
ID=42042891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ECSP972058 ECSP972058A (en) | 1997-03-14 | 1997-03-14 | CONDUCTOR BOARD AND PROCEDURE FOR THE PRECISE POSITIONING OF THE EQUIPMENT AND WELDING OF ELECTRONIC CONSTRUCTION ELEMENTS ON THE SURFACES OF THE CONDUCTOR BOARD |
Country Status (1)
| Country | Link |
|---|---|
| EC (1) | ECSP972058A (en) |
-
1997
- 1997-03-14 EC ECSP972058 patent/ECSP972058A/en unknown
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