EP0006459A2 - Usage d'un procédé d'électroformage pour la fabrication des composants flat-pack - Google Patents

Usage d'un procédé d'électroformage pour la fabrication des composants flat-pack Download PDF

Info

Publication number
EP0006459A2
EP0006459A2 EP79101647A EP79101647A EP0006459A2 EP 0006459 A2 EP0006459 A2 EP 0006459A2 EP 79101647 A EP79101647 A EP 79101647A EP 79101647 A EP79101647 A EP 79101647A EP 0006459 A2 EP0006459 A2 EP 0006459A2
Authority
EP
European Patent Office
Prior art keywords
resist
exposure
mask
substrate
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP79101647A
Other languages
German (de)
English (en)
Other versions
EP0006459B1 (fr
EP0006459A3 (en
Inventor
Günter-Elmar Dipl.-Ing. Trausch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP0006459A2 publication Critical patent/EP0006459A2/fr
Publication of EP0006459A3 publication Critical patent/EP0006459A3/xx
Application granted granted Critical
Publication of EP0006459B1 publication Critical patent/EP0006459B1/fr
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/32—After-treatment
    • C03C2218/328—Partly or completely removing a coating
    • C03C2218/33—Partly or completely removing a coating by etching

Definitions

  • the invention relates to a method for the production of precision flat parts, such as masks, stencils, screens, nozzle plates with the smallest window openings and contour details with a large material thickness as well as high demands on contour shaping and constancy of the dimensions.
  • the fineness of the details of a flat part is limited by the resolution of the photoresist (photoresist or photo film).
  • the thickness of the flat part is limited by the resist thickness, the resist thickness and resist resolution correlating so that increasing thickness causes decreasing resolution.
  • the object of the invention is to implement the electroplating process described at the beginning with the simplest possible means and to increase the resolution of the resist.
  • This task is loaded by the fact that on a flat, fully translucent support, for. B. a glass pane, with a thin one-sided metallization in this metallization on usual. Way z. B. etching or lifting a desired flat part pattern is generated, which serves as a template and that a photoresist applied to the template side is exposed by the carrier and developed in a known manner and furthermore the spaces not covered with resist are filled by galvanic metal deposition.
  • the exposure of the resist in the conventional method by means of a mask, which is placed over the carrier and resist, is replaced in the method according to the invention by exposure by the glass carrier, so that light only enters the resist on the areas not covered by the template .
  • the carrier is also an exposure mask.
  • the structure receives full light intensity at its base. As a result, it has maximum adhesion.
  • Conventional exposure results in underexposure on the substrate, that is to say adhesion decreases with increasing resist height. Underexposure also results in a rejuvenation of the resist structure and thus an additional reduction in the size of the base.
  • minimal light reflection occurs when exiting the resist in the method according to the invention if a matt black base is used and additionally. with dry resists - peel off the protective film before exposure. In the conventional method, the reflection on the metallic support significantly reduces the resolution.
  • flanks with - seen in cross section - inconsistent course are generated by exposing the resist twice or more with different light sources. This can be for certain hole shapes in the flat part, e.g. B. for nozzle openings, may be desired.
  • correspondingly inclined resist structures are produced during the exposure by one or more defined inclination of the substrate against the incident light. In this way, it is possible in a targeted manner. To produce flat parts with inclined edges. Resist structures can also be produced by continuously changing the substrate inclination during exposure about one or more axes of rotation perpendicular to the incident light.
  • inclination of the substrate (carrier) against the incident light and uniform rotation about an axis perpendicular to the substrate during exposure results in rotationally symmetrical structures with surface lines inclined to the substrate.
  • inclined contours are desired for nozzle openings or stencils (lift-out bevels), which are easy to produce with the method according to the invention.
  • a further advantage of the method is that the resist is exposed through the glass support to produce the coarse mask, the fine mask serving as an exposure mask.
  • the known methods of assigning a coarse and fine mask to one another by optical alignment require considerable effort and often result in inaccuracies. This is remedied by the invention; Position errors are excluded.
  • the development of the invention for relatively strong flat parts consists in the fact that exposure is carried out on two sides, once through the stencil, and the second time using a conventional mask through an applied mask.
  • the mask is placed on the resist and aligned with the template using a registration system (e.g. stops).
  • a registration system e.g. stops.
  • metals are used as the plating material which are easy to separate from the template material.
  • the galvanoplastic can be removed without damaging the template.
  • the removal of the electroplating can be made possible. In this way it is achieved that a template can be used several times.
  • a further embodiment of the method according to the invention for producing resist structures is that the templates are subsequently removed. Structures of this kind are used particularly in integrated optics.
  • Figure 1 shows a conventional method
  • Figure 2 shows the inventive method.
  • a negative photoresist 2 is applied to a metallic carrier 1 in FIG.
  • This photo layer is covered with an exposure mask 3 and exposed to the UV radiation 4 of a copying machine.
  • the light incident through the transparent spots 5, 6 triggers polymerization reactions in the areas below the photoresist, which create a latent image.
  • the non-exposed parts are detached so that only resist residues 7 (FIG. 1b) remain on the carrier plate 1 in the form of the desired contour limitation of the flat part. It can also be seen from FIG. 1b that structure 5 was no longer dissolved.
  • B. a nickel film 8 electrodeposited.
  • a carrier plate 9 made of glass with a metallization 10 can be seen.
  • This consists, for. B. from a titanium adhesive layer on which copper is evaporated.
  • Metallization becomes photolithographic and generates the desired flat part pattern using etching, which serves as a template.
  • Thin photoresist layers 11 achieve high resolution and thus high quality of the stencil.
  • the template can also be produced using the known lifting technique.
  • part b of FIG. 2 the photoresist layer 11 has been removed and a photo film 12 has been applied as a resist to the stencil. In this case, the exposure takes place through the glass support in the direction of the arrows 13. From part c of FIG. 2 it can be seen that both structures have dissolved Corresponding resist structures 14 and 15 have remained.
  • the plating is designated by 16.
  • the galvanoplastic or the carrier can be detached in this process step.
  • the spaces between the resist structure can instead of electroplating also by pouring z. B. filled with plastic.
  • the resulting flat part is separated from the carrier in the same way as the galvanoplastic. If material is applied in thicknesses greater than the height of the resist structure, then plates with surface reliefs can be created, such as those used for. B. needed in printing technology.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electrochemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Electroplating Methods And Accessories (AREA)
EP79101647A 1978-06-29 1979-05-29 Usage d'un procédé d'électroformage pour la fabrication des composants flat-pack Expired EP0006459B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2828625 1978-06-29
DE2828625A DE2828625C2 (de) 1978-06-29 1978-06-29 Verfahren zur galvanoplastischen Herstellung von Präzisionsflachteilen

Publications (3)

Publication Number Publication Date
EP0006459A2 true EP0006459A2 (fr) 1980-01-09
EP0006459A3 EP0006459A3 (en) 1980-01-23
EP0006459B1 EP0006459B1 (fr) 1982-06-09

Family

ID=6043130

Family Applications (1)

Application Number Title Priority Date Filing Date
EP79101647A Expired EP0006459B1 (fr) 1978-06-29 1979-05-29 Usage d'un procédé d'électroformage pour la fabrication des composants flat-pack

Country Status (6)

Country Link
US (1) US4264714A (fr)
EP (1) EP0006459B1 (fr)
JP (1) JPS557799A (fr)
BR (1) BR7904111A (fr)
CS (1) CS215019B2 (fr)
DE (1) DE2828625C2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163130A3 (en) * 1984-04-30 1986-05-07 Ppg Industries, Inc. Electroforming method and mandrel

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2933570C3 (de) * 1979-08-18 1982-02-25 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Verfahren zum Herstellen von Trenndüsenelementen
DE3115116A1 (de) * 1980-05-07 1982-02-04 The Perkin-Elmer Corp., 06856 Norwalk, Conn. Verfahren zur herstellung eines maskensubstrats zur anwendung bei der roentgenstrahlen-lithographie
US4404060A (en) * 1981-05-08 1983-09-13 Siemens Aktiengesellschaft Method for producing insulating ring zones by galvanic and etch technologies at orifice areas of through-holes in a plate
JPS5848055A (ja) * 1981-09-17 1983-03-19 Mizuho Shoji Kk 彫刻機用原版の製造方法
DE3151290C2 (de) * 1981-12-24 1986-08-14 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Lamelle für lichtoptische Verschlüsse optischer Geräte
DE3315665A1 (de) * 1983-04-29 1984-10-31 Siemens AG, 1000 Berlin und 8000 München Herstellung von galvanoplastischen flachteilen mit totationsunsymmetrischen, kegelfoermigen strukturen
DE3401963A1 (de) * 1984-01-20 1985-07-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von fotoresiststrukturen mit gestuften flanken
US4490217A (en) * 1984-02-24 1984-12-25 Armstrong World Industries, Inc. Method of making a stencil plate
DE3842354A1 (de) * 1988-12-16 1990-06-21 Kernforschungsz Karlsruhe Verfahren zur lithographischen herstellung von galvanisch abformbaren mikrostrukturen mit dreieckigem oder trapezfoermigem querschnitt
US5560837A (en) * 1994-11-08 1996-10-01 Hewlett-Packard Company Method of making ink-jet component
DE69712654T2 (de) * 1996-02-22 2002-09-05 Seiko Epson Corp., Tokio/Tokyo Tintenstrahlaufzeichnungskopf, Tintenstrahlaufzeichnungsgerät damit versehen und Herstellungsverfahren eines Tintenstrahlaufzeichnungskopfes
US6179978B1 (en) 1999-02-12 2001-01-30 Eastman Kodak Company Mandrel for forming a nozzle plate having a non-wetting surface of uniform thickness and an orifice wall of tapered contour, and method of making the mandrel
US6350558B1 (en) 1999-10-05 2002-02-26 Rainer Gocksch Method of making decorative panels
KR20020000813A (ko) * 2000-03-22 2002-01-05 마치오 나카지마 구멍 구조체 및 구멍 구조체의 제조 방법
US7025865B2 (en) * 2000-09-26 2006-04-11 Eastman Kodak Company Method for producing metal mask and metal mask
JP2002245947A (ja) * 2000-12-15 2002-08-30 Canon Inc 細線を有する基板及びその製造方法及び電子源基板及び画像表示装置
JP4582494B2 (ja) * 2003-12-10 2010-11-17 ウシオ電機株式会社 コンタクト露光装置
JP2007245364A (ja) * 2006-03-13 2007-09-27 Fujifilm Corp ノズルプレートの製造方法及び液滴吐出ヘッド並びに画像形成装置
JP4911682B2 (ja) 2006-07-20 2012-04-04 富士フイルム株式会社 露光装置
US7828417B2 (en) * 2007-04-23 2010-11-09 Hewlett-Packard Development Company, L.P. Microfluidic device and a fluid ejection device incorporating the same
US7749883B2 (en) 2007-09-20 2010-07-06 Fry's Metals, Inc. Electroformed stencils for solar cell front side metallization
EP2658719B1 (fr) * 2010-12-28 2018-08-29 Stamford Devices Limited Plaque d'ouverture photodéfinie et son procédé de production

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
US2559389A (en) * 1942-04-02 1951-07-03 Keuffel & Esser Co Method of producing precision images
US3507654A (en) * 1966-12-29 1970-04-21 Corning Glass Works Stencil screen and method
US3703450A (en) * 1971-04-01 1972-11-21 Dynamics Res Corp Method of making precision conductive mesh patterns
SU484816A1 (ru) * 1972-06-16 1976-08-05 Предприятие П/Я А-1631 Способ изготовлени цветных фотошаблонов
US3900359A (en) * 1973-02-26 1975-08-19 Dynamics Res Corp Method and apparatus for television tube shadow mask
JPS51117033A (en) * 1975-04-07 1976-10-14 Hitachi Ltd Photograph processing method
JPS52106805A (en) * 1976-03-04 1977-09-07 Toagosei Chem Ind Co Ltd Stabilization of 1,1,1-trichloroethane
FR2356975A1 (fr) * 1976-06-30 1978-01-27 Ibm Procede d'impression photolithographique du type a contact permettant d'obtenir des profils a resolution elevee et appareil utilisant un tel procede
JPS5357973A (en) * 1976-11-05 1978-05-25 Mitsubishi Electric Corp Preparation of photo mask
US4115120A (en) * 1977-09-29 1978-09-19 International Business Machines Corporation Method of forming thin film patterns by differential pre-baking of resist

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163130A3 (en) * 1984-04-30 1986-05-07 Ppg Industries, Inc. Electroforming method and mandrel

Also Published As

Publication number Publication date
EP0006459B1 (fr) 1982-06-09
CS215019B2 (en) 1982-06-25
US4264714A (en) 1981-04-28
BR7904111A (pt) 1980-03-11
EP0006459A3 (en) 1980-01-23
JPS557799A (en) 1980-01-19
JPH0232619B2 (fr) 1990-07-23
DE2828625C2 (de) 1980-06-19
DE2828625B1 (de) 1979-09-13

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