EP0030227A2 - Vorrichtung und Verfahren zur elektrolytischen Behandlung eines Metallbandes - Google Patents

Vorrichtung und Verfahren zur elektrolytischen Behandlung eines Metallbandes Download PDF

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Publication number
EP0030227A2
EP0030227A2 EP81100331A EP81100331A EP0030227A2 EP 0030227 A2 EP0030227 A2 EP 0030227A2 EP 81100331 A EP81100331 A EP 81100331A EP 81100331 A EP81100331 A EP 81100331A EP 0030227 A2 EP0030227 A2 EP 0030227A2
Authority
EP
European Patent Office
Prior art keywords
strip
electrolyte
level
electrodes
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP81100331A
Other languages
English (en)
French (fr)
Other versions
EP0030227A3 (de
Inventor
Thomas Anthony Sellitto
Allen William White
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Production Machinery Corp
Original Assignee
Production Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Production Machinery Corp filed Critical Production Machinery Corp
Priority to DE7979301546T priority Critical patent/DE2964016D1/de
Publication of EP0030227A2 publication Critical patent/EP0030227A2/de
Publication of EP0030227A3 publication Critical patent/EP0030227A3/de
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0642—Anodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Definitions

  • This invention relates to electrolytically treating a metal strip.
  • the present invention is particularly applicable to plating zinc onto a moving steel strip and the embodiment of the invention described hereinafter relates to electroplating zinc onto a steel strip.
  • the invention has broader applications.
  • An object of the present invention is to enable a metal strip to be selectively electrolytically treated on one or both of its upper and lower surfaces as it passes through a chamber containing electrolyte.
  • apparatus for electrolytically treating a metal strip comprising a chamber for electrolyte through which chamber the strip is moved.along a given horizontal path, lower and upper electrodes located in said chamber so as to face the lower and upper surfaces of the strip respectively as it moves along said path through said chamber, in use, and means for applying a direct current voltage between the electrodes and the strip characterised in that means are provided for selectively changing the level of electrolyte in said chamber, in use, between a first level with the electrolyte filling the space between both electrodes and covering the lower and upper surfaces of the strip for allowing electrolytic treatment of one or both of the lower and upper surfaces of the strip and a second level with the electrolyte covering at least the lower surface of the strip and filling the space between the lower electrode and the lower surface of the strip but not filling the space between the upper surface of the strip and the upper electrode for allowing electrolytic treatment of only the lower surface of the strip.
  • the invention also provides a method of electrolytically treating a metal strip comprising moving the strip along a given horizontal path through a chamber in which lower and upper electrodes are located so as to face the lower and upper surfaces of the strip respectively as it is moved along said path, providing electrolyte in said chamber and providing a direct current voltage for application between said electrodes and said strip characterised by selectively maintaining the level of electrolyte in said chamber at a first level with the electrolyte filling the space between both electrodes and covering the lower and upper surfaces of the strip for allowing electrolytic treatment of one or both of the lower and upper surfaces of the strip or a second level with the electrolyte covering at least the lower surface of the strip and filling the space between the lower electrode and the lower surface of the strip but not filling the space between the upper surface of the strip and the upper electrode for allowing electrolytic treatment of only the lower surface of the strip.
  • the illustrated apparatus is adapted to electroplate zinc on either the lower surface 10 or the upper surface 12 or both surfaces 10 and 12 of a steel strip B having parallel edge portions 14, 16 and a center portion 18 as it is moved along a given horizontal path at right angles to the plane of the Figure through a chamber, or tray, 304 for electrolyte in which tray lower and upper anodes 300, 302 are located so as to face the lower and upper surfaces of the strip respectively.
  • Tray 304 is located in a reservoir 54 of electrolyte L from which electrolyte is supplied through lines 340, 350 via valves 342, 352 and pumps 344, 354 to the lower and upper anodes 300, 302 respectively.
  • Each anode 300, 302 is of similar construction and comprises a non-consumable, electrically conductive element 200 provided with openings 206 and an electrically non-conductive housing 110 which forms a plenum chamber for electrolyte from the reservoir which is pumped into the plenum chamber through inlets 52 from the reservoir 54 and forced through the openings 206 in the form of jets towards the surfaces 10 and 12 of the strip where the jets impinge against the strip surface throughout substantially the full width thereof facing the element 200 to decrease the ion layer at the strip surface.
  • Electrically non-conductive, elongate shields 130, 132 extend along the respective side edge portions of the surface 202 of each anode element 200 nearest the strip and are adjustable transversely of the surface 202 to alter the effective width of the electrode element 200.
  • Tray 304 includes sidewalls 306, 308 including side openings 310, 312 having upwardly facing edges 310a, 312a, respectively. These edges serve as auxiliary weirs to control the level of electrolyte L in tray 304 in a manner to be described later. Openings 310, 312 of sidewalls 306, 308 are closed in Figure 1 by plates 320, 322 held in position over the openings by bottom lugs 324 and side lugs 326, two of which are shown. With plates 320, 322 in place, the electrolyte level in tray 304 is level 330 with the electrolyte filling the space between the anodes 300, 302 and covering the lower and upper surfaces 10, 12 of the strip.
  • the electrolyte flows over the top of sidewalls 306, 308 into the reservoir 54.
  • One or both of the anodes can be provided selectively with electrolyte L for a plating operation via the lines 340, 342.
  • leads 362, 360 To provide the electrical current for anodes 300, 302, there are provided leads 362, 360, respectively. These leads are connected to a common positive potential lead 370 of the D.C. power supply used in the plating process. A negative potential is applied to the strip as schematically indicated.
  • the bottom surface 10 may be plated by removing plates 320, 322 from openings 310, 312, respectively. This lowers the level of electrolyte to the level 332 which is below anode 302, the electrolyte covering at least the lower surface 10 of the strip and filling the space between the lower anode 300 and the lower surface 10 of the strip but not filling the space between the upper surface 12 of the strip and the upper anode 302. Thus, anode 302 is inactive even though connected to the positive lead 370. By closing valve 352, a single side plating process is obtained. If both sides are to be plated, the plates 320, 322 are replaced. Valve 352 is opened and both surfaces 10, 12 are plated.
  • the apparatus as illustrated in Figure 1 can be easily converted to a single side plating arrangement from a two side plating arrangement. It is also possible to plate only the upper surface 312 in the apparatus as shown in Figure 1. This can be done by employing the electrical circuitry shown in Figures 2A or 2B.
  • the showing of Figure 2 is a schematic illustration of the electrical circuitry used in Figure 1. Referring now to Figure 2A, a second power supply is provided with a positive lead 372 electrically distinct from lead 370. If only the upper surface 12 of strip B is to be plated, lead 372 is disconnected. This supplies power therefore only to anode element 200 of upper anode 302.
  • valve 342 is closed.
  • a similar arrangement could be accomplished with a single positive potential lead 370 by providing a switch 374 between lead 370 and input lead 362 of anode 300 as shown in Figure 2B. By opening switch 374, electrical potential is created only between the upper anode 302 and strip B.
  • FIG 3 a method utilizing the apparatus shown in Figure 1 for selective plating of both sides of strip B is schematically illustrated, the anodes being shown rotated through 90° from their actual positions.
  • the strip B is moved along a given path P through a series of seven units, each of which is constructed as shown in Figure 1. Five units are used for plating the lower surface and only two units are used for plating the upper surface. Thus, a substantially heavier layer of material is plated on the lower surface of strip B. It is also possible to use this concept to plate the upper surface only as previously described. Also, different metals can be plated on different surfaces by using a series of trays with the controllable electrode arrangement as shown in Figure 1 and containing different electrolyte.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP81100331A 1978-08-31 1979-08-01 Vorrichtung und Verfahren zur elektrolytischen Behandlung eines Metallbandes Withdrawn EP0030227A3 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE7979301546T DE2964016D1 (en) 1978-08-31 1979-08-01 Device and apparatus for and method of electrolytically treating the surface of a metal strip

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US938656 1978-08-31
US05/938,656 US4183799A (en) 1978-08-31 1978-08-31 Apparatus for plating a layer onto a metal strip

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP79301546.2 Division 1979-08-01
EP79301546A Division EP0008875B1 (de) 1978-08-31 1979-08-01 Vorrichtung, Apparat und Verfahren zur electrolytischen Behandlung eines Metallbandes

Publications (2)

Publication Number Publication Date
EP0030227A2 true EP0030227A2 (de) 1981-06-10
EP0030227A3 EP0030227A3 (de) 1981-09-23

Family

ID=25471747

Family Applications (2)

Application Number Title Priority Date Filing Date
EP81100331A Withdrawn EP0030227A3 (de) 1978-08-31 1979-08-01 Vorrichtung und Verfahren zur elektrolytischen Behandlung eines Metallbandes
EP79301546A Expired EP0008875B1 (de) 1978-08-31 1979-08-01 Vorrichtung, Apparat und Verfahren zur electrolytischen Behandlung eines Metallbandes

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP79301546A Expired EP0008875B1 (de) 1978-08-31 1979-08-01 Vorrichtung, Apparat und Verfahren zur electrolytischen Behandlung eines Metallbandes

Country Status (3)

Country Link
US (1) US4183799A (de)
EP (2) EP0030227A3 (de)
JP (1) JPS5534698A (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1165271A (en) * 1979-03-21 1984-04-10 Richard C. Avellone Apparatus and method for plating one or both sides of metallic strip
US4364328A (en) * 1979-06-01 1982-12-21 Nippon Kokan Kabushiki Kaisha Apparatus for continuous dip-plating on one-side of steel strip
US4267024A (en) * 1979-12-17 1981-05-12 Bethlehem Steel Corporation Electrolytic coating of strip on one side only
AU525633B2 (en) * 1980-03-07 1982-11-18 Nippon Steel Corporation Metal strip treated by moving electrolyte
DE3017079A1 (de) * 1980-05-03 1981-11-05 Thyssen AG vorm. August Thyssen-Hütte, 4100 Duisburg Vorrichtung zum elektroplattieren
JPS5751289A (en) * 1980-09-10 1982-03-26 Fuji Photo Film Co Ltd Electrolytic treating device for belt-like metallic plate
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
JPS57101692A (en) * 1980-12-16 1982-06-24 Nippon Steel Corp Horizontal electroplating method by insoluble electrode
US4514266A (en) * 1981-09-11 1985-04-30 Republic Steel Corporation Method and apparatus for electroplating
SE429765B (sv) * 1982-02-09 1983-09-26 Jouko Korpi Sett vid elektropletering
AU540287B2 (en) * 1982-02-10 1984-11-08 Nippon Steel Corporation Continuous electrolytic treatment of metal strip using horizontal electrodes
US4374719A (en) * 1982-03-19 1983-02-22 United States Steel Corporation System for electrolytic cleaning of metal wire in loop form
JPS59125973U (ja) * 1983-02-15 1984-08-24 株式会社山田メッキ工業所 メツキ装置
DE3317970A1 (de) * 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen Vorrichtung und verfahren zur galvanischen abscheidung von metallen
EP0142010B1 (de) * 1983-11-10 1987-12-23 Hoesch Aktiengesellschaft Verfahren und Vorrichtung zum elektrolytischen Abscheiden von Metallen
LU85086A1 (fr) * 1983-11-11 1985-07-17 Cockerill Sambre Sa Dispositif pour le depot electrolytique d'une couche d'un metal de recouvrement sur une bande metallique
EP0310401B1 (de) * 1987-10-01 1994-04-20 Furukawa Circuit Foil Co., Ltd. Unlösliche Elektrode
JP2000504375A (ja) * 1996-01-23 2000-04-11 ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー 金属を基板に電気めっきする装置及び方法
US6086731A (en) * 1996-10-24 2000-07-11 Honda Giken Kogyo Kabushiki Kaisha Composite plating apparatus
US6344106B1 (en) 2000-06-12 2002-02-05 International Business Machines Corporation Apparatus, and corresponding method, for chemically etching substrates
US20020185065A1 (en) * 2001-06-07 2002-12-12 Jason Ko Electrolyte-spraying casing for an electroplating apparatus
US7252714B2 (en) * 2002-07-16 2007-08-07 Semitool, Inc. Apparatus and method for thermally controlled processing of microelectronic workpieces
US6811669B2 (en) * 2002-08-08 2004-11-02 Texas Instruments Incorporated Methods and apparatus for improved current density and feature fill control in ECD reactors
JP4594672B2 (ja) * 2004-08-10 2010-12-08 ディップソール株式会社 錫−亜鉛合金電気めっき方法
US20060163078A1 (en) * 2005-01-25 2006-07-27 Hutchinson Technology Incorporated Single pass, dual thickness electroplating system for head suspension components
KR100661456B1 (ko) * 2005-08-03 2006-12-27 한국생산기술연구원 Ｆｃｃｌ 필름 제조 장치 및 ｆｃｃｌ 필름 제조 방법
JP2009074126A (ja) * 2007-09-20 2009-04-09 Dowa Metaltech Kk めっき方法およびその装置
US9725817B2 (en) 2011-12-30 2017-08-08 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts
CN105590987B (zh) * 2014-10-20 2022-06-14 苏州易益新能源科技有限公司 一种水平电化学沉积金属的方法
JP6895927B2 (ja) * 2018-05-28 2021-06-30 三菱電機株式会社 半導体装置の製造装置および半導体装置の製造方法
TR2023007545A2 (tr) * 2023-06-23 2025-01-21 Tusas Tuerk Havacilik Ve Uzay Sanayii Anonim Sirketi Bir kaplama sistemi.

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Also Published As

Publication number Publication date
JPS5754559B2 (de) 1982-11-18
EP0008875B1 (de) 1982-11-10
EP0030227A3 (de) 1981-09-23
JPS5534698A (en) 1980-03-11
EP0008875A1 (de) 1980-03-19
US4183799A (en) 1980-01-15

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