EP0064181A1 - Matériau de contact d'un alliage de cuivre et méthode pour sa fabrication - Google Patents

Matériau de contact d'un alliage de cuivre et méthode pour sa fabrication Download PDF

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Publication number
EP0064181A1
EP0064181A1 EP82103118A EP82103118A EP0064181A1 EP 0064181 A1 EP0064181 A1 EP 0064181A1 EP 82103118 A EP82103118 A EP 82103118A EP 82103118 A EP82103118 A EP 82103118A EP 0064181 A1 EP0064181 A1 EP 0064181A1
Authority
EP
European Patent Office
Prior art keywords
alloy
content
atom
germanium
contact material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP82103118A
Other languages
German (de)
English (en)
Other versions
EP0064181B1 (fr
Inventor
Manfred Dr. Wilhelm
Günther Dipl.-Ing. Rauter
Ludwig Dr. Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to AT82103118T priority Critical patent/ATE11840T1/de
Publication of EP0064181A1 publication Critical patent/EP0064181A1/fr
Application granted granted Critical
Publication of EP0064181B1 publication Critical patent/EP0064181B1/fr
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/025—Composite material having copper as the basic material

Definitions

  • the invention relates to a contact material made of a low-alloy copper alloy, in particular for low-voltage and installation switching devices.
  • the invention further relates to a method for producing this contact material.
  • Materials for electrical contacts must conduct well both electrically and thermally to prevent excessive heating. Your mechanical properties such as Hardness, strength, elastic behavior must be optimally adapted to the respective application. In addition, their susceptibility to corrosive media should be low. In general, tarnish and scale layers and thus high contact resistances can only be avoided on relatively noble materials. In addition, contact materials must neither stick nor weld when switching, and their burn-up and material migration should be low.
  • silver, its alloys and silver-based composites meet these and other requirements for good contact materials to such an extent that these materials have been widely used in low-voltage technology.
  • silver is a relatively expensive material, so efforts are being made to use other, less expensive materials Copper and its alloys are suitable (see e.g. A.Keil: “Materials for electrical contacts”, Springer-Verlag, Berlin 1960, especially pages 122 to 143, or D. Stöckel and others: “Materials for electrical contacts” , Kunststoff & participate Bd. 43, Expert Verlag, 7031 Grafenau 1 / Württ., 1980).
  • No other contact material achieves the high electrical and thermal conductivity of the copper, combined with favorable mechanical properties, affordable costs and generally good procurement options. Because of its less noble compared to silver character, especially his Oxidationsfreudtechnik, but this material can often does not protect in pure form for the production of contact pieces, in particular for low-voltage switchgear and installation switching devices, such as for contactors, auxiliary 11, circuit breaker or circuit breakers are used. Although it is possible by alloying loading 'certain elements, the material properties of these materials such as to improve the oxidation behavior. However, contacts made of copper alloys with known alloy partners made of inexpensive materials generally have a relatively high contact resistance after only a few circuits, so that they are usually not suitable for low-voltage switching devices or installation switching devices.
  • a relatively low contact resistance should ensure accomplishes.
  • the alloy partner of the copper is at least one element from the group of antimony, gallium, germanium, the antimony content between 0.01 and 7 atom% or the gallium content between 0.5 and 20 atom% or the germanium content is between 0.5 and 10 atom%.
  • the alloy partners mentioned have a finite solubility in solid copper.
  • the advantages achieved with the invention can be seen in particular in that the alloying of the substances mentioned to the copper increases the corrosion resistance of the contact material on the one hand and on the other hand contacts with these alloy materials show a tolerable contact resistance in switching tests. Since these contact materials are generally less expensive than the known silver alloys, they can thus advantageously serve as a replacement for the known contact materials based on silver alloys.
  • the copper alloy can also contain at least one further alloy partner.
  • This can be one or more elements from the group cadmium, chromium, cobalt, palladium, silicon, the cadmium content between 0.1 and 2 atom%, the chromium content between 0.01 and 0.8 atom% %, the cobalt content between 0.1 and 1.8 atom%, the palladium content between 0.1 and 3 atom% and the silicon content between 0.5 and 10 atom%.
  • the proportion of the further alloy partner should at most be equal to the proportion of antimony or gallium or germanium.
  • FIG. 1 shows frequency curves of the contact voltages of some binary alloys according to the invention.
  • FIG. 2 shows contact voltages for special copper-germanium alloys and the diagram of FIG. 3 shows frequency curves of the contact voltages of some ternary alloys according to the invention.
  • the table below gives information about the scale and corrosion behavior of some binary copper alloys according to the invention compared to pure copper.
  • the alloys mentioned can be melted using chemically pure starting materials under argon in a graphite crucible and annealed at temperatures between 600 ° C and 950 ° C to avoid segregation. the.
  • the homogeneous bodies made of these alloys can be processed into sheet metal, wires and contact pieces using conventional forming processes such as rolling, hammering or wire drawing. Corresponding sheets were used to test the corrosion resistance.
  • the weight increase ⁇ m of the individual materials, measured in micrograms per square centimeter in the table, can be obtained after oxidation in air after a 24-hour heat treatment at 250 ° C.
  • the contact voltage U k is given in millivolts on the abscissa, while the ordinate shows the cumulative frequency W of the contact voltage measured at a contactor contact in accordance with the so-called Weibull statistics.
  • the embodiment of the figure is based on a contactor with contacts that were switched about 2000 times under an average load of 45 A at 110 V AC under an ohmic load.
  • the frequency curves of contact voltages on contacts made of copper alloys according to the invention lie in the area of the diagram denoted by I.
  • the proportion of alloy in antimony, gallium and germanium, respectively, is approximately between 1.75 and 7 atom%.
  • II Plotted curve which indicates the frequency of contact voltages on pure copper contacts.
  • the frequency curve labeled III results for contacts from a common contact material based on silver, here for silver-cadmium oxide with a cadmium oxide content of 15% by volume.
  • contact voltages are indicated in a diagram, which are to be measured on contacts made of binary copper-germanium alloys with different germanium concentrations.
  • the germanium concentration in atomic% is plotted on the abscissa and the contact voltage U k in mV on the ordinate for a frequency of 50%.
  • the exemplary embodiment of the figure is based on contact voltages on contacts at 45 A and 110 V AC under ohmic load after 2000 switching of the contacts.
  • the contact voltages and therefore the contact resistances are particularly low, particularly at germanium concentrations between 3 and 7 atom%, preferably around 5 atom%.
  • contact materials based on a binary copper alloy were used. stand. If necessary, further elements can be added to these alloys so that, for example, ternary or quaternary alloys are then formed. This can be used to further improve, for example, the corrosion behavior or the contact resistance compared to the binary alloys.
  • the following materials are particularly suitable as such additional alloy components: cadmium with a content between 0.1 and 2 atom% or chromium with a content between 0.01 and 0.8 atom% or cobalt with a content between 0.1 and 1.8 atom% or palladium with a content between 0.1 and 3 atom% or silicon with a content between 0.5 and 10 atom%.
  • an element from the group of antimony, gallium, germanium can also be selected as the third alloy component within the limits of the alloy proportions mentioned in connection with the binary alloys.
  • the proportion of the additional, third and / or fourth alloy constituents stated in atomic% is generally less than or at most equal to the second alloy constituent of antimony or gallium or germanium.
  • contact materials three special cuge 3-x X x x alloys thereof with at% as exemplary embodiments, namely: CuGe2,5Co0,5 (curve a), CuGe2,5Sb0,5 (curve b) and CuGe2,9Cr0,1 (curve c).
  • the binary CuGe3.0 (curve d) and also a known silver-based contact material, namely AgCd0 (curve e), are also listed for comparison. From the course of the curves a to c in the diagram it can be seen that ternary copper alloys also have contact resistances which are easily in the order of magnitude of contact materials based on silver.
  • the alloys with cobalt as a third partner have a particularly low contact resistance (curve a).

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Contacts (AREA)
  • Conductive Materials (AREA)
  • Catalysts (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Manufacture Of Switches (AREA)
EP82103118A 1981-04-27 1982-04-13 Matériau de contact d'un alliage de cuivre et méthode pour sa fabrication Expired EP0064181B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT82103118T ATE11840T1 (de) 1981-04-27 1982-04-13 Kontaktwerkstoff aus einer kupferlegierung und verfahren zu deren herstellung.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813116680 DE3116680A1 (de) 1981-04-27 1981-04-27 Kontaktwerkstoff aus einer kupferlegierung und verfahren zu seiner herstellung
DE3116680 1981-04-27

Publications (2)

Publication Number Publication Date
EP0064181A1 true EP0064181A1 (fr) 1982-11-10
EP0064181B1 EP0064181B1 (fr) 1985-02-13

Family

ID=6130913

Family Applications (1)

Application Number Title Priority Date Filing Date
EP82103118A Expired EP0064181B1 (fr) 1981-04-27 1982-04-13 Matériau de contact d'un alliage de cuivre et méthode pour sa fabrication

Country Status (11)

Country Link
EP (1) EP0064181B1 (fr)
JP (1) JPS57181348A (fr)
AT (1) ATE11840T1 (fr)
DE (2) DE3116680A1 (fr)
DK (1) DK184382A (fr)
ES (1) ES511703A0 (fr)
FI (1) FI820583L (fr)
GR (1) GR75432B (fr)
NO (1) NO821339L (fr)
PT (1) PT74797B (fr)
ZA (1) ZA822858B (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995014112A1 (fr) * 1993-11-15 1995-05-26 Apecs Investment Castings Pty. Ltd. Compositions d'alliages d'argent
WO2001090428A1 (fr) * 2000-05-23 2001-11-29 JUDINA, Olena Matiere de contact a base de cuivre, piece de contact et procede de fabrication de la piece de contact

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58130748A (ja) * 1982-01-29 1983-08-04 Tanaka Kikinzoku Kogyo Kk 直流小型モータの整流子用すり接点材料
JPS58144557A (ja) * 1982-02-19 1983-08-27 Tanaka Kikinzoku Kogyo Kk すり接点材料
JPS58145008A (ja) * 1982-02-23 1983-08-29 田中貴金属工業株式会社 直流小型モータの整流子用すり接点材料
DE3523935A1 (de) * 1985-07-04 1987-01-15 Rau Gmbh G Verfahren zur herstellung eines kontaktformstuecks und kontaktformstueck hierzu

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1084351A (fr) *
DE1289991B (de) * 1957-08-01 1969-02-27 Siemens Ag Kontaktwerkstoff
FR2294527A1 (fr) * 1974-12-10 1976-07-09 Plessey Handel Investment Ag Materiau pour contacts electriques et son procede de preparation
FR2428904A1 (fr) * 1978-06-16 1980-01-11 Nippon Telegraph & Telephone Materiau pour contact electrique et procede pour sa preparation

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE755481C (de) * 1936-11-13 1954-12-20 Deutsche Edelstahlwerke Ag Legierung fuer Schweisselektroden und Schalterkontakte
DE1159740B (de) * 1959-10-20 1963-12-19 Rca Corp Lot zum vakuumdichten Verloeten von Metall- und/oder Isolierteilen und Verfahren dazu
GB1106706A (en) * 1964-07-25 1968-03-20 Eugen Durrwachter A material for electrical sliding contacts
AT271918B (de) * 1966-05-11 1969-06-25 Olin Mathieson Verfahren zur Herstellung einer hochoxydationsbeständigen Legierung auf Kupferbasis
US3475227A (en) * 1966-10-04 1969-10-28 Olin Mathieson Copper base alloys and process for preparing same
DD100106A1 (fr) * 1972-10-26 1973-09-05
FR2277156A1 (fr) * 1974-07-02 1976-01-30 Olin Corp Procede pour ameliorer la resistance au fluage et la resistance a la detente des tensions des alliages a base de cuivre
US4047978A (en) * 1975-04-17 1977-09-13 Olin Corporation Processing copper base alloys
CH603797A5 (fr) * 1976-01-16 1978-08-31 Bbc Brown Boveri & Cie
US4025367A (en) * 1976-06-28 1977-05-24 Olin Corporation Process for treating copper alloys to improve thermal stability
US4110132A (en) * 1976-09-29 1978-08-29 Olin Corporation Improved copper base alloys

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1084351A (fr) *
DE1289991B (de) * 1957-08-01 1969-02-27 Siemens Ag Kontaktwerkstoff
FR2294527A1 (fr) * 1974-12-10 1976-07-09 Plessey Handel Investment Ag Materiau pour contacts electriques et son procede de preparation
FR2428904A1 (fr) * 1978-06-16 1980-01-11 Nippon Telegraph & Telephone Materiau pour contact electrique et procede pour sa preparation

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, Band 86, 1977, Seite 671, Nr. 149659e, Columbus, Ohio, USA & JP - A - 77 20288 (TANAKA KIKINZOKU KOGYO K.K.) 16-02-1977 *
CHEMICAL ABSTRACTS, Band 87, 1977, Seite 262, Nr. 57137a, Columbus, Ohio, USA & JP - A - 77 30217 (TANAKA KIKINZOKU KOGYO K.K.) 07-03-1977 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995014112A1 (fr) * 1993-11-15 1995-05-26 Apecs Investment Castings Pty. Ltd. Compositions d'alliages d'argent
WO2001090428A1 (fr) * 2000-05-23 2001-11-29 JUDINA, Olena Matiere de contact a base de cuivre, piece de contact et procede de fabrication de la piece de contact

Also Published As

Publication number Publication date
ES8304213A1 (es) 1983-02-16
FI820583A7 (fi) 1982-10-28
JPS57181348A (en) 1982-11-08
ATE11840T1 (de) 1985-02-15
DK184382A (da) 1982-10-28
NO821339L (no) 1982-10-28
GR75432B (fr) 1984-07-17
EP0064181B1 (fr) 1985-02-13
ES511703A0 (es) 1983-02-16
ZA822858B (en) 1983-03-30
PT74797A (de) 1982-05-01
DE3116680A1 (de) 1982-11-18
FI820583L (fi) 1982-10-28
DE3262286D1 (en) 1985-03-28
PT74797B (de) 1983-11-07

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