EP0076681B1 - Lötvorrichtung und Verfahren - Google Patents

Lötvorrichtung und Verfahren Download PDF

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Publication number
EP0076681B1
EP0076681B1 EP82305261A EP82305261A EP0076681B1 EP 0076681 B1 EP0076681 B1 EP 0076681B1 EP 82305261 A EP82305261 A EP 82305261A EP 82305261 A EP82305261 A EP 82305261A EP 0076681 B1 EP0076681 B1 EP 0076681B1
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EP
European Patent Office
Prior art keywords
flux
solder
accordance
heat
recoverable
Prior art date
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Expired
Application number
EP82305261A
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English (en)
French (fr)
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EP0076681A1 (de
Inventor
Edward Antoni Cydzik
Tamar G. Gen
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Raychem Corp
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Raychem Corp
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Filing date
Publication date
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Priority to DE8484201861T priority Critical patent/DE3278715D1/de
Priority to AT82305261T priority patent/ATE18365T1/de
Priority to DE8484201862T priority patent/DE3278805D1/de
Publication of EP0076681A1 publication Critical patent/EP0076681A1/de
Application granted granted Critical
Publication of EP0076681B1 publication Critical patent/EP0076681B1/de
Expired legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C61/00—Shaping by liberation of internal stresses; Making preforms having internal stresses; Apparatus therefor
    • B29C61/06—Making preforms having internal stresses, e.g. plastic memory
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C61/00—Shaping by liberation of internal stresses; Making preforms having internal stresses; Apparatus therefor
    • B29C61/06—Making preforms having internal stresses, e.g. plastic memory
    • B29C61/0608—Making preforms having internal stresses, e.g. plastic memory characterised by the configuration or structure of the preforms
    • B29C61/0666—Making preforms having internal stresses, e.g. plastic memory characterised by the configuration or structure of the preforms comprising means indicating that the shrinking temperature is reached
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • G01K11/12—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance
    • G01K11/16—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in colour, translucency or reflectance of organic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H01R4/72—Insulation of connections using a heat shrinking insulating sleeve
    • H01R4/723—Making a soldered electrical connection simultaneously with the heat shrinking

Definitions

  • This invention relates to a heat-recoverable soldering device, to methods of soldering using such a device and to the use of such compositions in soldering.
  • Heat-recoverable soldering devices are known in the art. See, for example, U.S. Patents Nos. 3,239,125 to Sherlock, 3,305,625 to Ellis, 3,316,343 to Brass. 3,396,460 to Wetmore and 3,396,894 to Ellis.
  • Such heat-recoverable devices generally comprise a heat-shrinkable polymeric sleeve haing a fusible insert comprising solder.
  • Elongate substrates, such as a pair of wires are inserted into the sleeve and heat is applied causing the sleeve to shrink into contact with the substrates. The heat also causes the solder to melt and flow around the substrates. Upon cooling, a solid solder joint is formed between the substrates.
  • the temperature required to melt the solder is higher than the temperature required to shrink the sleeve.
  • visual observation that the sleeve has completely recovered does not necessarily mean that the temperature necessary for soldering has been reached. There is, therefore, no visible indication during the soldering process that enough heat has been applied. Further, in the event that a soldered joint so formed fails during use, there is no way of subsequently inspecting the joint to determine whether the failure was due to inadequate heating during the soldering process.
  • US Patent No. 3,451,609 describes a heat-shrinkable soldering device wherein the heat-shrinkable plastic tube of the device is provided with a heat-sensitive pigmented paint applied as a coating to the interior surface of the plastic tube.
  • the heat-sensitive pigment-containing paint can be incorporated throughout the body of the plastic tube. When the device is heated the paint changes from one colour to another colour.
  • thermochromic material Another method of soldering metal pipes together is disclosed in Japanese Patent Kokai No. 53-15243.
  • the pipes to be soldered are butted together and solder is wrapped around the butt area.
  • a heat-shrinkable sleeve, the inner surface of which is coated with thermochromic material, is positioned over this butt area and is heated. The heat causes the thermochromic material to change colour at the melting temperature of the solder.
  • a first aspect of this invention provides a soldering device comprising a substantially transparent heat-recoverable polymeric member, a fusible solder insert positioned within said member and a solder flux composition which is associated with said solder insert characterised in that the flux composition undergoes a visible colour change at a critical temperature.
  • the polymeric member is substantially transparent to the extent that the visible colour change of the solder flux can be seen through the member. This device thus advantageously provides a clear visible indication that a solder joint or connection has reached the correct soldering temperature.
  • a second aspect of this invention provides a method of soldering at least two solderable substrates which comprises positioning said substrates within a heat-recoverable soldering device according to the first aspect of the present invention, and heating said device, thereby causing said heat-recoverable member to recover into contact with said substrates and causing the solder to melt and flow and solder the substrates together, characterised in that heating the recoverable member also causes said flux to undergo a visible colour change.
  • the device is arranged such that the heating step causes the heat-recoverable member to recover into contact with the substrates before the flux undergoes a visible. colour change.
  • the substrates are generally elongate.
  • solder flux composition comprises solder flux and a reactive component, the flux composition undergoing a chemical reaction resulting in a visible colour change at a critical temperature.
  • the heat-recoverable member of the device of the present invention is capable of undergoing a change in its dimensional configuration on applicatio.n of heat. This change in dimensional configuration is usually toward an original shape from which it has previously been deformed, but the term "Heat-recoverable”, as used herein, also includes a member which, on heating, adopts a new configuration, even it it has not been previously deformed.
  • the heat-recoverable member of the device according to said first aspect of the present invention generally comprises a heat-shrinkable sleeve made from a polymeric material exhibiting the property of elastic or plastic memory as described, for example, in U.S. Patents Nos. 2,027,962 and 3,086,242.
  • the original dimensionally heat-stable form may be a transient form in a continous process in which, for example, an extruded tube is expanded, while hot, to a dimensionally heat-unstable form but, in other methods of preparation, a preformed dimensionally heat-stable article is deformed to a dimensionally heat unstable form in a separate stage.
  • the polymeric material is generally cross-linked.
  • One manner of producing a heat-recoverable article comprises shaping the polymeric material into the desired heat-stable form, subsequently cross-linking the polymeric material, heating the article to a temperature above the crystalline melting point, or for amorphous materials the softening point, of the polymer, deforming the article and cooling the article while in the deformed state so that the deformed state of the article is retained. In use, application of heat will cause the article to dimensionally recover from the deformed state to the original heat-stable shape.
  • an elastomeric member such as an outer tubular member is held in a stretched state by a second member, such as an inner tubular member, which, upon heating weakens and thus allows the elastomeric member to recover.
  • polymers used in the manufacture of heat-recoverable articles include polyolefins, e.g. polyethylene and copolymers of ethylene with ethylenically unsaturated monomers, such as ethylene/ethyl arcylate, ethylene/vinyl acetate copolymers, polyvinyl chloride, elastomers, silicones, polytetrafluoroethylene, polyvinylidene fluoride, polyurethanes, and ionomers.
  • the polymer can be cross-linked either by radiation or chemical means.
  • the heat-recovery temperature of crystalline polymers is generally a temperature slightly above the crystalline melting temperature.
  • the wall thickness of the member is preferably in the range of from about 0.0005 inch (0.0127mm) to about 0.05 inch (1.2700mm) and is especially preferably from about 0.0008 inch (0.0203mm) to about 0.01 inch (0.2540mm).
  • the solder insert may be positioned within the heat-recoverable member by coating solder onto the surface of the recoverable member.
  • a solder perform of the desired configuration may be produced and this then inserted into the heat-recoverable member.
  • the solder is positioned such that when two solderable substrates are positioned within the device and the device is heated, the solder is forced into intimate contact with the substrates by the recovery of the heat-recoverable member.
  • the heat-recoverable member is in the form of a heat-shrinkable sleeve
  • the solder is preferably in the shape of a ring on the inner surface of the sleeve.
  • solder flux aids the flow of the solder or cleans the surfaces of the substrates to be joined or both.
  • Various solder flux compositions are known and are commercially available. Widely used as solder fluxes are. compositions based on natural rosin. Other fluxes include, for example, inorganic and organic acids.
  • the solder flux melts, flows and covers the substrate surface at a temperature below the melting point of the solder.
  • Any solder flux can be used in accordance with this invention.
  • the flux comprises a temperature indicating component and the particular flux and the appropriate temperature indicating component to be used in a particular application can be readily ascertained by one skilled in the art without undue experimentation.
  • the temperature indicating component is preferably one that is compatible with the flux and does not interfere with the normal functioning of the flux.
  • the solder flux is associated with the solder of the heat-recoverable soldering device. Any of the conventional means for associating flux with solder can be used. For example, a solder preform can be coated with flux by spraying, dipping, brushing or the like, usually before it has been positioned within the heat-recoverable device.
  • the solder flux can also be used in soldering operations such as hand soldering, in which a heat-recoverable device is not employed. In this event, the flux can be coated on the solder or can be positioned within the solder, for example, in the form of a core which can be in various configurations as is well known in the art. The flux must be visible during the soldering process to detect the colour change in the flux when it reaches the appropriate temperature.
  • the solder flux composition contains a temperature indicator such that the flux undergoes a colour change when heated to the appropriate soldering temperature.
  • the colour change is preferably an irreversible colour change, that is a colour change that does not reverse, for example, when the solder and flux cool and solidify.
  • Such an irreversible change provides a continuing indication and permanent means for determining whether the soldered joint was heated to the required temperature during soldering. Thus improperly formed terminations can be detected by visual inspection after the soldered connection is completed and cooled.
  • the colour change of the flux is preferably from a coloured state to a substantially colourless one.
  • the completed solder joint is thus visible for inspection through the flux. In this way, the joint itself can be inspected to check for adequate soldering and to detect improperly formed terminations, as well as to check for application of sufficient heat during the soldering process by the change in colour of the flux.
  • the flux composition changes colour at a critical temperature.
  • the desired critical temperature varies depending on the particular solder used.
  • the critical temperature is that temperature which is required to effect a solder connection with the particular solder, that is the temperature required to cause the solder to melt, flow and wet the substrates so that on cooling the solder makes a mechanical and electrical bond between the substrates being soldered.
  • the particular solder to be used varies depending on the substrates being joined and the material of the heat-recoverable member.
  • the temperature required to effect the solder termination is generally above the temperature required to cause recovery of the heat-recoverable member.
  • the temperature indicating component of the flux composition varies depending on the solder used.
  • the flux composition undergoes a colour change in the temperature range of from about 150°C to about 450°C, especially preferably from about 200°C to about 240°C.
  • the temperature of the colour change is preferably in the range of from about 20°C to about 60°C above the melting point of the solder. Preferably, it is about 20°C to about 30°C above the melting point of a low temperature solder and about 30°C to about 60°C above the melting point of a high temperature solder.
  • the flux composition contains a temperature indicator such that at a critical temperature the flux composition undergoes a colour change.
  • Various temperature indicators can be used, for example, azo dyes such as Pigment Red 73 (an azo dye prepared from 2-nitro-p-toluidine and 2-napthol, CI 12120, acid- base indicators such as Thymol blue, diazo dyes such as Acid Red 73 (a diazo dye derived from p-phenylazoaniline and 2-naphthol-6,8-disulfonic acid, CI 27290), and the like.
  • any dye which is compatible with the flux and which undergoes a colour change at a critial temperature can be used.
  • the flux composition contains a temperature indicator that is a chemically reactive component which undergoes a chemical reaction with the solder flux at a critical temperature to produce a colour change.
  • a temperature indicator that is a chemically reactive component which undergoes a chemical reaction with the solder flux at a critical temperature to produce a colour change.
  • Particularly preferred are flux compositions in which, at a critical temperature, the reactive component causes the. flux composition to become colourless since this allows the soldered joint to be readily inspected.
  • Suitable chemically reactive components are, for example, Bromocresol Green Basic Fuchsine or Thymol Blue..
  • the temperature indicator may be incorporated into a solder flux composition by known techniques.
  • the amount of temperature indicator incorporated into the flux is preferably in the range of from about 0.01 to about 5 parts per 100 parts of flux and is especially preferably from about 0.05 to about 2 parts per 100 parts of flux. The amount added depends on the intensity of colour. Sufficient temperature indicator should be added to provide a flux composition which is clearly visible during the soldering operation.
  • the flux composition may also contain additives, for example, dispersing aids such as water, alcohol or a surfactant or emulsifier, buffers, such as an acid or salt to maintain the desired pH, for example, oxalic acid, lactic acid, maleic acid, tartaric acid, fumaric acid or citric acid, and stabilizers.
  • a heat-recoverable device comprises a heat-recoverable member in the form of a tubular sleeve 3 having a solder insert 4.
  • the sleeve 3 is a heat-shrinkable tube of radiation cross-linked ethylene-tetrafluoroethylene copolymer containing fusible thermoplastic inserts 5 toward each end of the tube.
  • the solder insert 4 Prior to being positioned within the sleeve 3 the solder insert 4 is coated with a temperature indicating flux. The coated flux is dark blue in colour and thus obscures the grey colour of the solder insert.
  • the unrecovered sleeve 3 is positioned over a coaxial cable 1 having a portion of the outer insulation removed to expose the underlying shield.
  • the end region of a ground wire 2 with the insulation being removed from the end region lies adjacent the exposed shield of the cable 1.
  • the sleeve 3 is then heated causing it to shrink into contact with the cable and ground wire and to cause the solder to melt and flow.
  • the flux changes colour at a temperature above the melting point of the solder becoming colourless. Heating is discontinued at this point.
  • the thermoplastic inserts 5 melt and seal the sleeve to the cable.
  • the resulting product is shown in Figure 2.
  • Temperature indicating solder flux compositions were prepared by dispersing various dyes in a Milros #611, a commercially available rosin-based flux comprising 37% of a mixture of rosin isomers in 63% isopropyl alcohol.
  • the dyes used and the concentrations of dye in the resulting temperature indicating flux compositions are listed in Table 1.
  • Additives, as listed in Table 1, were added as appropriate to aid in dissolution of the pigment or to buffer the solution to maintain the desired pH.
  • the dyes used are:
  • Pigment Red 3 (commercially available as Atlasol Spirit Red-3) an azo dye prepared from 2-nitro-p-toluidine and 2-naphthol. (Cl 12120).
  • Thymol Blue commercially available and also referred to as thymolsulphonphthalien.
  • Pigment Red 52 (commercially available as Garnet Toner #2), an azo dye derived from 2-amino-5-chloro-p-toluenesulphonic acid and 3-hydroxy-2-naphthoic acid. (Cl 15860).
  • Bromocresol Green also known as 3', 3", 5', 5"-tetrabromo-m-cresolsulphonphthalein.
  • Solvent Red 24 (commercially available as Atlasol Red 4B) an azo dye derived from 4-0-tolylazo-o-toluidine and 2-naphthol (Cl 26105).
  • Pigment Yellow 5 (also known as Lithol Fast Yellow Y) an azo dye derived from o-nitroaniline and acetoacetanilide. (Cl 11660).
  • Basic Violet 14 also known as Basic Fuchsine, and derived from aniline and toluidine.
  • Pigment Orange 2 commercially available as Ozark Orange X-1481
  • an azo dye derived from o-nitroaniline and 2-naphthol.
  • the flux composition was coated onto a solder perform which was then positioned within a heat-shrinkable sleeve made from cross-linked polyvinylidene fluoride.
  • a solderable substrate specifically an insulated wire with insulation removed from a segment, was inserted into the sleeve so that the uninsulated segment was positioned inside the sleeve.
  • the sleeve was then heated causing the sleeve to shrink down onto the wire.
  • the initial colour of the flux composition, the temperature at which the flux composition changed colour and the final colour of the flux are recorded in Table 1.
  • the use of the temperature indicating solder flux composition of this invention has been described above with reference to its use in a soldering device of the heat-recoverable sleeve- type.
  • the novel temperature indicating flux composition can be used in other soldering methods, for example, hand soldering.
  • the temperature indicating flux can be applied in the same manner as flux as usually applied in the particular soldering method, and will change colour at the critial temperature.
  • the flux can be coated onto a solder preform or incorporated into the solder. It is also possible to apply the flux to the substrate(s) to be soldered.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Cable Accessories (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)

Claims (16)

1. Lötvorrichtung, enthaltend: ein im wesentlichen transparentes in der Wärme rückstellbares polymeres Teil (3); eine schmelzbare Lotmitteleinlage (4), die in dem Teil angeordnet ist; und eine Flußmittelzusämmensetzung für das Lömittel, die zusammen mit der Lötmitteleinlage (4) vorliegt, dadurch gekennzeichnet daß Flußmittelzusammensetzung eine sichtbare Farbänderung bein einer kritischen Temperatur eingeht.
2. Vorrichtung nach Anspruch 1, bei der das polymere Teil (3) eine Hülse aus vernetztem polymerem Material umfasst.
3. Vorrichtung.nach Anspruch 1 order 2, in der die Lötmitteleinlage (4) in der Form eines Ringes an der inneren Oberfläche des polymeren Teils (3) vorliegt.
4. Vorrichtung nach einem der vorhergehenden Ansprüche, bei der die Flußmittelzusammensetzung auf die Oberfläche der Lötmitteleinlage aufgetragen ist.
5. Vorrichtung nach einem der vorhergehenden Ansprüche, bei der die Flußmittelzusammensetzung ein Flußmittel auf Kolophoniumbasis umfasst.
6. Vorrichtung nach einem der vorhergehenden Ansprüche, in der die Flußmittelzusammensetzung einen Azofarbstoff enthält, der von p-Phenoxyazoanilin und 2-Naphthol-6,8-disulfonsäure stammt, oder einen Azofarbstoff, der von 2-Nitro-p-toluidin und 2-Naphthol stammt, oder einen Azofarbstoff, der von 2-Amino-5-chlor-p-toluolsulfonsäure und 3-Hydroxy-2-naphthoesäure stammt, oder einen Azofarbstoff, der von 4-O-Tolyazo-o-toluidin und 2-Naphthol stammt, oder einen Azofarbstoff, der von o-Nitroanilin und Acetoacetanilid stammt, oder einen Azofarbstoff, der von o-Nitroanilin und 2-Naphthol stammt.
7. Vorrichtung nach einem der vorhergehenden Ansprüche, in der die Flu-mittelzusammensetzung Flußmittel für das Lötmittel und eine chemisch reaktive Komponente umfasst, wobei die Flußmittelzusammensetzung eine chemische Reaktion eingeht, die zu einer sichtbaren Farbänderung bei einer kritischen Temperatur führt.
8. Vorrichtung nach Anspruch 7, in der das Flußmittel eine Farbänderung durch chemische Reaktion zwischen dem Flußmittel und der reaktiven Komponente bei der kritischen Temperatur eingeht.
9. Vorrichtung nach Anspruch 7 oder 8, bei der das Flußmittel für das Lötmittel ein Flußmittel auf Kolophoniumbasis für Lötmittel umfasst.
10. Vorrichtung nach einem der Ansprüche 7 bis 9, bei der das Flußmittel eine Farbänderung von einem gefärbten Zustand zu einem im wesentlichen farblosen Zustand eingeht.
11. Vorrichtung nach einem der Ansprüche 7 bis 10, bei der die chemisch reaktionsfähige Komponente Thymol-sulfonphthalein ofer 3', 3", 5', 5"-Tetrabrom-m-kresolsulfonphthalein oder einen Azofarbstoff, der von Anilin und Toluidin stammt, umfasst.
12. Vorrichtung nach einem der vorhergehenden Ansprüche, bei der das Flußmittel für das Lötmittel eine Farbänderung bein einer Temperatur im Bereich von etwa 150°C bis etwa 450°C, vorzugsweise im Bereich von etwa 200°C bis etwa 240°C eingeht.
13. Vorrichtung nach einem der vorhergehenden Ansprüche, bei der das Flußmittel für das Lötmittel eine Farbänderung von einem gefärbten Zustand zu einem im wesentlichen farblosen Zustand eingeht.
14. Vorrichtung nach einem der vorhergehenden Ansprüche, bei der die Farbänderung in der Flußmittelzusammensetzung für das Lötmittel irreversibel ist.
15. Verfahrem zum Löten von mindestens zwei lötbaren, vorzugsweise langen Substraten (1) und (2), das umfasst: Einlegen der Substrate (1) und (2) in eine in der Wärme rückstellbare Lötvorrichtung gemäß einem der vorhergehenden Ansprüche, Erwärmen des in der Wärme rückstellbaren Teils (3) zur Rückstellung in Kontakt mit den Substraten (1) und (2), und Schmelzen und Fließen lassen des Lötmittels, und Verlöten der Substrate miteinander, dadurch gekennzeichnet, daß das Erwärmen des in der Wärme rückstellbaren Teils (3) auch dazu führt, daß das Flußmittel eine sichtbare Farbänderung eingeht.
16. Verfahren nach Anspruch 15, bei dem die Vorrichtung so angeordnet ist, daß die Erwärmungsstufe zu einer Rückstellung des in der Wärme rückstellbaren Teils (3) in Kontakt mit den Substraten (1) und (2) führt, bevor das Flußmittel eine sichtbare Farbänderung eingeht.
EP82305261A 1981-10-05 1982-10-04 Lötvorrichtung und Verfahren Expired EP0076681B1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE8484201861T DE3278715D1 (de) 1981-10-05 1982-10-04 Flux composition
AT82305261T ATE18365T1 (de) 1981-10-05 1982-10-04 Loetvorrichtung und verfahren.
DE8484201862T DE3278805D1 (en) 1981-10-05 1982-10-04 Soldering device and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/308,867 US4505421A (en) 1981-10-05 1981-10-05 Soldering methods and devices
US308867 1981-10-05

Related Child Applications (2)

Application Number Title Priority Date Filing Date
EP84201862.4 Division-Into 1984-12-14
EP84201861.6 Division-Into 1984-12-14

Publications (2)

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EP0076681A1 EP0076681A1 (de) 1983-04-13
EP0076681B1 true EP0076681B1 (de) 1986-03-05

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EP82305261A Expired EP0076681B1 (de) 1981-10-05 1982-10-04 Lötvorrichtung und Verfahren
EP84201862A Expired EP0160752B1 (de) 1981-10-05 1982-10-04 Lötvorrichtung und Verfahren
EP84201861A Expired EP0164456B1 (de) 1981-10-05 1982-10-04 Flussmittelzusammensetzung

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EP84201862A Expired EP0160752B1 (de) 1981-10-05 1982-10-04 Lötvorrichtung und Verfahren
EP84201861A Expired EP0164456B1 (de) 1981-10-05 1982-10-04 Flussmittelzusammensetzung

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Also Published As

Publication number Publication date
GB2152954B (en) 1986-06-25
GB2109418B (en) 1986-07-23
EP0164456B1 (de) 1988-06-29
DE3269653D1 (en) 1986-04-10
CA1254112C (de) 1989-05-16
ATE35389T1 (de) 1988-07-15
GB2109418A (en) 1983-06-02
EP0076681A1 (de) 1983-04-13
EP0160752A1 (de) 1985-11-13
JPH0417746B2 (de) 1992-03-26
ATE35926T1 (de) 1988-08-15
EP0160752B1 (de) 1988-07-27
IL66930A0 (en) 1983-02-23
EP0164456A1 (de) 1985-12-18
US4505421A (en) 1985-03-19
GB2152954A (en) 1985-08-14
GB8501723D0 (en) 1985-02-27
JPS5874275A (ja) 1983-05-04
CA1245953A (en) 1988-12-06

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