EP0079975A1 - Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante - Google Patents

Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante Download PDF

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Publication number
EP0079975A1
EP0079975A1 EP19810109802 EP81109802A EP0079975A1 EP 0079975 A1 EP0079975 A1 EP 0079975A1 EP 19810109802 EP19810109802 EP 19810109802 EP 81109802 A EP81109802 A EP 81109802A EP 0079975 A1 EP0079975 A1 EP 0079975A1
Authority
EP
European Patent Office
Prior art keywords
copper
colloid
palladium
metallic
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19810109802
Other languages
German (de)
English (en)
Other versions
EP0079975B1 (fr
Inventor
William Robert Brasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Priority to DE8181109802T priority Critical patent/DE3177050D1/de
Priority to EP19810109802 priority patent/EP0079975B1/fr
Publication of EP0079975A1 publication Critical patent/EP0079975A1/fr
Application granted granted Critical
Publication of EP0079975B1 publication Critical patent/EP0079975B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
EP19810109802 1981-11-20 1981-11-20 Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante Expired EP0079975B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE8181109802T DE3177050D1 (en) 1981-11-20 1981-11-20 Copper colloid and method of activating insulating surfaces for subsequent electroplating
EP19810109802 EP0079975B1 (fr) 1981-11-20 1981-11-20 Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19810109802 EP0079975B1 (fr) 1981-11-20 1981-11-20 Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante

Publications (2)

Publication Number Publication Date
EP0079975A1 true EP0079975A1 (fr) 1983-06-01
EP0079975B1 EP0079975B1 (fr) 1989-05-10

Family

ID=8188024

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19810109802 Expired EP0079975B1 (fr) 1981-11-20 1981-11-20 Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante

Country Status (2)

Country Link
EP (1) EP0079975B1 (fr)
DE (1) DE3177050D1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2169925A (en) * 1985-01-16 1986-07-23 Canning W Materials Ltd Process for providing a metal coating on a polymer surface
WO2010026243A1 (fr) * 2008-09-08 2010-03-11 Alchimer Procédé de réparation de couches de barrière de diffusion du cuivre sur un substrat solide semi-conducteur et nécessaire de réparation pour mettre en œuvre ce procédé
CN104264137A (zh) * 2014-10-13 2015-01-07 无锡长辉机电科技有限公司 一种胶体铜活化液的制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse
US4042730A (en) * 1976-03-29 1977-08-16 Bell Telephone Laboratories, Incorporated Process for electroless plating using separate sensitization and activation steps
US4048354A (en) * 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
US4153746A (en) * 1976-12-30 1979-05-08 International Business Machines Corporation Method of sensitizing copper surfaces with sensitizing solution containing stannous ions, precious metal ions and EDTA
US4180600A (en) * 1975-10-23 1979-12-25 Nathan Feldstein Process using activated electroless plating catalysts
US4273804A (en) * 1975-10-23 1981-06-16 Nathan Feldstein Process using activated electroless plating catalysts
US4293591A (en) * 1975-10-23 1981-10-06 Nathan Feldstein Process using activated electroless plating catalysts

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse
US4048354A (en) * 1975-10-23 1977-09-13 Nathan Feldstein Method of preparation and use of novel electroless plating catalysts
US4131699A (en) * 1975-10-23 1978-12-26 Nathan Feldstein Method of preparation and use of electroless plating catalysts
US4180600A (en) * 1975-10-23 1979-12-25 Nathan Feldstein Process using activated electroless plating catalysts
US4273804A (en) * 1975-10-23 1981-06-16 Nathan Feldstein Process using activated electroless plating catalysts
US4293591A (en) * 1975-10-23 1981-10-06 Nathan Feldstein Process using activated electroless plating catalysts
US4042730A (en) * 1976-03-29 1977-08-16 Bell Telephone Laboratories, Incorporated Process for electroless plating using separate sensitization and activation steps
US4153746A (en) * 1976-12-30 1979-05-08 International Business Machines Corporation Method of sensitizing copper surfaces with sensitizing solution containing stannous ions, precious metal ions and EDTA

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2169925A (en) * 1985-01-16 1986-07-23 Canning W Materials Ltd Process for providing a metal coating on a polymer surface
WO2010026243A1 (fr) * 2008-09-08 2010-03-11 Alchimer Procédé de réparation de couches de barrière de diffusion du cuivre sur un substrat solide semi-conducteur et nécessaire de réparation pour mettre en œuvre ce procédé
FR2935713A1 (fr) * 2008-09-08 2010-03-12 Alchimer Procede de reparation de couches barrieres a la diffusion du cuivre sur substrat solide semi-conducteur ; kit de reparation pour la mise en oeuvre de ce procede
US8524512B2 (en) 2008-09-08 2013-09-03 Alchimer Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method
CN104264137A (zh) * 2014-10-13 2015-01-07 无锡长辉机电科技有限公司 一种胶体铜活化液的制备方法

Also Published As

Publication number Publication date
EP0079975B1 (fr) 1989-05-10
DE3177050D1 (en) 1989-06-15

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