EP0082051A2 - Verfahren zur Herstellung einer Kühlvorrichtung - Google Patents

Verfahren zur Herstellung einer Kühlvorrichtung Download PDF

Info

Publication number: EP0082051A2
Authority: EP; European Patent Office
Prior art keywords: turns; base support; mandrels; support; frame
Prior art date: 1981-12-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP82402215A

Other languages

English (en)

French (fr)

Other versions

EP0082051A3 (en

EP0082051B1 (de

Inventor

René Dassonville

Philippe Bauchet

Eugène Borget

Gildas Laudren

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Thales SA

Original Assignee

Thomson CSF SA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-12-11

Filing date

1982-12-03

Publication date

1983-06-22

1982-12-03 Application filed by Thomson CSF SA filed Critical Thomson CSF SA

1982-12-03 Priority to AT82402215T priority Critical patent/ATE24818T1/de

1983-06-22 Publication of EP0082051A2 publication Critical patent/EP0082051A2/de

1984-01-11 Publication of EP0082051A3 publication Critical patent/EP0082051A3/fr

1987-01-07 Application granted granted Critical

1987-01-07 Publication of EP0082051B1 publication Critical patent/EP0082051B1/de

Status Expired legal-status Critical Current

Links

Images

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins

Definitions

the present invention relates to a method for producing a cooling device with filiform elements.
the cooling device obtained by this process ensures good thermal coupling between a member to be cooled and the ambient environment and applies in particular to electrical components with high heat dissipation.
cooling devices are associated with a forced air generator which increases cooling by forced convection.
the cooling of a traveling wave tube is a typical example of an application using such means.
the known cooling devices used for such applications are generally so-called "studded" radiators and include a flat base support on which numerous small cylindrical elements are arranged perpendicular to this support.
alloys with good thermal conductivity generally have poor flowability, which leads to a reduction in the length of the pins and their distribution density, thereby limiting the contact surface with the cooling fluid.
the molten metal tends to cool before reaching the bottom of the mold cavities if they are deep and of small section; moreover, during the demoulding, certain pins break and remain inside the mold.
the need to be able to demold limits the forms that a radiator can have, the base of which is, therefore, generally planar, the pins being perpendicular to this base. To these drawbacks are added the high cost of a mold and the difficulties encountered in obtaining modifications of the characteristics of the radiator.
Milling in the mass introduces a significant loss of material and requires a relatively long execution time.
the pins have tendency to bend in the direction that the tool attacks metal; to limit this deflection, the pins must be short, of large section and consequently few in number, which limits the performance of the device.
the milling technique is also ill-suited to mass production.
each spike is placed in a blind hole made in the support, the pins and the support being previously tinned. The whole is brought to the melting temperature of the tin and then cooled. The pins are thus welded to the support.
the assembly technique requires a long execution time and is not compatible with the requirements of mass production.
the invention proposes a production method which makes it possible to overcome the aforementioned drawbacks of the known art while improving the performance level of the pin radiators.
the method according to the invention proposes to replace the pins of the known art with filiform elements, generally turns, made of wire of good thermal conductivity and welded on a base support.
the invention also relates to the cooling device obtained by this process.
FIG. 1 illustrates an example of a radiator with pins according to the known art, as it could be obtained by a molding or assembly technique.
the pins 2 secured to a flat base support 1 are, for the clarity of the figure shown with a low density of distribution.
the edge to edge distance between two pins and the diameter of said pins are of the same order of magnitude.
FIG. 2 represents a first variant of the device obtained by the method according to the invention.
Wire of good thermal conductivity in this example tinned copper wire, is wound with non-contiguous turns on a mandrel with rectangular section.
the rectangle constituting the section of the mandrel has, in this preferred variant, short sides of length substantially greater than the diameter of the wire and long sides of length equal to approximately fifteen times said diameter. For the clarity of the drawing these proportions are not exactly respected.
FIG. 3 represents a second variant of the device obtained by the method according to the invention.
the sets 5 of turns 6 are obtained by winding tinned copper wire on mandrels of triangular section.
Each set 5, arranged parallel to the long sides of the support 1, has its turns 6 partially engaged between the turns of the sets 5 which are adjacent to it.
For each of the turns 6, one side of the triangle ensures contact over its entire length with the base support 1.
Each turn is located in a plane perpendicular to the support 1 and fixed to the latter by a filler metal with a low melting point (tin, lead-tin alloy, etc.).
the coils being nested, the triangular section mandrels must be removed before the assemblies 5 are placed on the support 1.
the assemblies 5 are placed, in the nested position, in the cavities a positioning support before being brought closer to the base support 1.
the positioning support is removed after fixing the turns 6 on the support 1.
FIG. 4 presents a step in a method allowing two cooling devices to be produced simultaneously.
a first device is produced according to the method described for the first variant corresponding to FIG. 2.
a second base support 7 bearing on the other short side of the turns is superimposed on the first base support 1.
the second support 7 is subjected to a thermal cycle which makes it integral with the turns by melting a filler metal.
the mandrels are eliminated and FIG. 4 illustrates the device obtained at this stage.
the space between supports 1 and 7 comprising the turns is filled with wax or another product which can be solidified at room temperature. After the wax has hardened, the assembly is cut along a plane parallel to the supports 1 and 7, located midway between these two supports and represented in FIG. 4 by the two orthogonal axes 8 and 9.
the wax is eliminated by temperature rise and the two cooling devices obtained constitute so-called "pin" coolers.
the invention is not limited to the three variant embodiments which have just been described. It is indeed possible to act separately or in combinations on numerous parameters such as the nature of the wire, the shape and the value of its section, the shape and the size of the turns; the turns can, after fixing, be opened and the filiform elements take any desired configuration.
the density of distribution of the filiform elements can be modulated by varying the pitch of the turns, the distance between the sets of turns, the dimension of the turns and the cross section of the wire of each of the sets of turns in order to optimize the performances in each application case.
the material, shape and dimensions of the support can also contribute to this optimization.
the manufacturing method of the cooling device described above has the advantages of not requiring any elaborate and expensive tooling and of making it possible to obtain more efficient radiators (longer, thinner, more numerous filiform elements) than by known techniques. .
this process is suitable for the installation of filiform elements on supports of any shape (not necessarily planar) and easily lends itself to the production of radiators made "on demand" (non-standardized products). Finally, it easily lends itself to mass production and makes it possible to reduce the cost of cooling devices.

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Wire Processing (AREA)
General Induction Heating (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Thermistors And Varistors (AREA)
Apparatuses And Processes For Manufacturing Resistors (AREA)
Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Manufacture Or Reproduction Of Printing Formes (AREA)

EP82402215A 1981-12-11 1982-12-03 Verfahren zur Herstellung einer Kühlvorrichtung Expired EP0082051B1 (de)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
AT82402215T ATE24818T1 (de)	1981-12-11	1982-12-03	Verfahren zur herstellung einer kuehlvorrichtung.

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
FR8123212A FR2518357A1 (fr)	1981-12-11	1981-12-11	Procede de realisation d'un dispositif de refroidissement a elements filiformes pour composant electronique et dispositif de refroidissement ainsi obtenu
FR8123212		1981-12-11

Publications (3)

Publication Number	Publication Date
EP0082051A2 true EP0082051A2 (de)	1983-06-22
EP0082051A3 EP0082051A3 (en)	1984-01-11
EP0082051B1 EP0082051B1 (de)	1987-01-07

Family

ID=9264935

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP82402215A Expired EP0082051B1 (de)	1981-12-11	1982-12-03	Verfahren zur Herstellung einer Kühlvorrichtung

Country Status (4)

Country	Link
EP (1)	EP0082051B1 (de)
AT (1)	ATE24818T1 (de)
DE (1)	DE3275053D1 (de)
FR (1)	FR2518357A1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5212625A (en) *	1988-12-01	1993-05-18	Akzo Nv	Semiconductor module having projecting cooling fin groups
EP0542478A1 (de) *	1991-11-12	1993-05-19	AT&T Corp.	Wärmesenke mit Stiften und Strömungsverbesserung
FR2913765A1 (fr) *	2007-03-16	2008-09-19	Pierre Vironneau	Nappe de circulation de fluide, procede pour realiser une telle nappe et utilisation de telles nappes pour la realisation d'un echangeur thermique
NL2019792B1 (en) *	2017-10-24	2019-04-29	Micro Turbine Tech B V	Heat exchanger comprising a stack of cells and method of manufacturing such a heat exchanger
SE1730353A1 (sv) *	2017-12-28	2019-06-29	Andersson Inge	Kylanordning

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE19623677C2 (de) *	1996-06-14	1999-09-16	Knuerr Mechanik Ag	Geräteschrank für elektrische und elektronische Systeme
DE10140328B4 (de) *	2001-08-16	2006-02-02	Siemens Ag	Kühlanordnung zur Kühlung elektronischer Bauelemente

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB692885A (en) *	1949-12-28	1953-06-17	Brown Fintube Co	Improvements in the manufacture of heat exchangers
US2879041A (en) *	1956-10-15	1959-03-24	Rca Corp	Heat radiator
DE1132883B (de) *	1957-01-30	1962-07-12	Franciscus Roffelsen	Verfahren zum Herstellung von Waermeaustauschelementen
FR1511618A (fr) *	1966-12-19	1968-02-02	Chausson Usines Sa	Procédé pour la fabrication de dissipateurs de chaleur du type à fils et dissipateur en résultant

1981
- 1981-12-11 FR FR8123212A patent/FR2518357A1/fr active Granted
1982
- 1982-12-03 EP EP82402215A patent/EP0082051B1/de not_active Expired
- 1982-12-03 AT AT82402215T patent/ATE24818T1/de not_active IP Right Cessation
- 1982-12-03 DE DE8282402215T patent/DE3275053D1/de not_active Expired

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5212625A (en) *	1988-12-01	1993-05-18	Akzo Nv	Semiconductor module having projecting cooling fin groups
EP0542478A1 (de) *	1991-11-12	1993-05-19	AT&T Corp.	Wärmesenke mit Stiften und Strömungsverbesserung
FR2913765A1 (fr) *	2007-03-16	2008-09-19	Pierre Vironneau	Nappe de circulation de fluide, procede pour realiser une telle nappe et utilisation de telles nappes pour la realisation d'un echangeur thermique
WO2008132329A3 (fr) *	2007-03-16	2008-12-31	Pierre Vironneau	Nappe de circulation de fluide, procédé pour réaliser une telle nappe et échangeur thermique comportant une telle nappe
NL2019792B1 (en) *	2017-10-24	2019-04-29	Micro Turbine Tech B V	Heat exchanger comprising a stack of cells and method of manufacturing such a heat exchanger
WO2019083361A1 (en) *	2017-10-24	2019-05-02	Micro Turbine Technology B.V.	HEAT EXCHANGER WITH CELL STACK
US11614284B2 (en)	2017-10-24	2023-03-28	Micro Turbine Technology B.V.	Heat exchanger comprising a stack of cells
SE1730353A1 (sv) *	2017-12-28	2019-06-29	Andersson Inge	Kylanordning

Also Published As

Publication number	Publication date
EP0082051A3 (en)	1984-01-11
EP0082051B1 (de)	1987-01-07
FR2518357A1 (fr)	1983-06-17
ATE24818T1 (de)	1987-01-15
DE3275053D1 (en)	1987-02-12
FR2518357B3 (de)	1984-12-14

Legal Events

Date	Code	Title	Description
1983-04-22	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1983-06-22	AK	Designated contracting states	Designated state(s): AT BE CH DE FR GB IT LI NL SE
1983-11-08	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
1984-01-11	AK	Designated contracting states	Designated state(s): AT BE CH DE FR GB IT LI NL SE
1984-08-22	17P	Request for examination filed	Effective date: 19840615
1986-11-21	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
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1987-11-03	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
1987-11-03	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
1987-12-23	26N	No opposition filed
1991-12-31	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: NL Payment date: 19911231 Year of fee payment: 10
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1994-06-30	BERE	Be: lapsed	Owner name: THOMSON-CSF Effective date: 19931231
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1995-01-31	EUG	Se: european patent has lapsed	Ref document number: 82402215.6 Effective date: 19940710

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