EP0105408B1 - Indicateur électroluminescent - Google Patents
Indicateur électroluminescent Download PDFInfo
- Publication number
- EP0105408B1 EP0105408B1 EP19830109358 EP83109358A EP0105408B1 EP 0105408 B1 EP0105408 B1 EP 0105408B1 EP 19830109358 EP19830109358 EP 19830109358 EP 83109358 A EP83109358 A EP 83109358A EP 0105408 B1 EP0105408 B1 EP 0105408B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- thin film
- cover sheet
- layer
- electroluminescent display
- protective cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 27
- 230000001681 protective effect Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000374 eutectic mixture Substances 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 210000002858 crystal cell Anatomy 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000001017 electron-beam sputter deposition Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- PEUPCBAALXHYHP-UHFFFAOYSA-L zinc;selenite Chemical group [Zn+2].[O-][Se]([O-])=O PEUPCBAALXHYHP-UHFFFAOYSA-L 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Definitions
- independent claims 1 and 11 are based in their preamble part on GB-A-2 020 684 disclosing an electroluminescent display and a methodforform- ing a hermetic seal between a base substrate and a cover sheet of such an electroluminescent display.
- the known display includes a hermetic seal in the form of an adhesive, for example a photo-curing resin bonding a counter-substrate and a plane substrate.
- the hermetic seal comprises a protective liquid which is filled in the space between the substrates and the pin holes of the dielectric layers.
- the protective liquid prevents the electroluminescent panel from being damaged by increasing the small thermally-damaged area.
- the protective liquid also shuts any moisture out of the electroluminescent panel.
- the present invention provides an economical method for easily manufacturing a reliable seal for a thin film display device which is compatible with thin film processes.
- the seal of the display according to the present invention provides substantially total protection against penetration of water, vapour and other contaminants even at high temperatures without requiring a complicated arrangement and without requiring the provision of an additional protective liquid.
- the sealing is provided by means of a eutectic (solder) metal, or combinations of metal, preferably disposed in a picture frame configuration about the periphery of the display substrate.
- the cover sheet which may be glass, ceramic or other material, is typically a flat element lying in a plane lying in parallel to the substrate and separated from the substrate by the aforementioned picture frame seal.
- the cover sheet may carry leads, drive chips, or other ancillary components.
- a thin film dielectric insulating layer which covers the area on the substrate and cover sheet over which the electrical leads pass and upon which the metallic seal is formed. This insulating layer extends beyond the seal area to provide a safety margin.
- the back electrode pattern 24 may be formed by the deposition of a metal such as aluminum.
- the transparent front electrode pattern may be formed by the deposition of a doped tin oxide.
- the front electrode pattern may also be constructed by depositing an indium-tin oxide.
- FIG. 1 shows the aluminum lead-ins 50 extending to the transparent electrode terminal pads 23.
- the fabrication of the electroluminescent device be carried out in a dry box or other controlled environment.
- a dry box the parts are inserted, mated, and heated to reflow the seal material.
- an additional layer of the metallic seal material may be used between the sealing elements on the substrate and cover sheet.
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Claims (13)
1. Ecran électroluminescent comprenant un substrat formant base (20) sur lequel sont déposées plusieurs couches de films fins (22, 24, 32, 34, 36, 38, 40) comportant des conducteurs électriques en forme de films fins (50), et une feuille de protection formant couvercle (70) disposée au-dessus des couches de films fins (22, 24, 32, 34, 36, 38, 40) et comprenant un moyen de scellement hermétique (60, 62) joignant la feuille formant couvercle (70) et le substrat formant base (20), caractérisé en ce que le dit moyen de scellement hermétique comprend une couche d'un film fin électriquement isolant (60) disposé pour scellement sur les conducteurs en forme de films fins (50), et une couche de soudure métallique (62) sur la couche de film fin isolant (60), de façon à réaliser un joint entre la feuille formant couvercle (70) et le substrat formant base (20) sans provoquer de court-circuit entre les conducteurs (50).
2. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la dite couche de film fin isolant (60) et la dite couche de soudure métallique (62) sont disposées en trame d'image.
3. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la dite feuille de protection formant couvercle (70) comprend une plaque de verre.
4. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la dite feuille de protection formant couvercle (70) comprend une plaque de céramique.
5. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la couche de soudure métallique (62) comprend de l'étain.
6. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la couche de film fin électriquement isolant (60) comprend du nitrure de silicium.
7. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la couche de film fin électriquement isolant (60) comprend de l'oxyde de silicium.
8. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la couche de film fin électriquement isolant (60) comprend du bioxyde de silicium.
9. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la zone couverte par la couche de film fin isolant (60) est plus grande que la couche de soudure métallique, de manière à déterminer une marge de sécurité interdisant tout court-circuit entre les conducteurs (50).
10. Ecran électroluminescent selon la revendication 1 caractérisé en ce que la dite couche de soudure métallique (62) est constituée par un mélange eutectique.
11. Procédé de réalisation d'un scellement hermétique (60, 62) entre un substrat formant base (20) et une feuille de protection formant couvercle (70) d'un écran électroluminescent, comprenant les étapes suivantes:
caractérisé en ce que l'étape consistant à faire le dit scellement hermétique (60, 62) comporte l'étape de dépôt pour scellement d'une couche électriquement isolante (60) sur les conducteurs en forme de films fins (50), et de dépôt d'une couche de soudure métallique (62) sur la couche isolante et la feuille de protection formant couvercle (70).
disposer plusieurs couches de films fins (22, 24, 32, 34, 36, 38, 40) sur le dit substrat formant base (20), les dites couches de films fins incluant des conducteurs électriques en forme de films fins (50);
déposer une feuille de protection formant couvercle (70) sur les couches de films fins;
faire un scellement hermétique entre le substrat formant base (20) et la feuille de protection formant couvercle (70);
caractérisé en ce que l'étape consistant à faire le dit scellement hermétique (60, 62) comporte l'étape de dépôt pour scellement d'une couche électriquement isolante (60) sur les conducteurs en forme de films fins (50), et de dépôt d'une couche de soudure métallique (62) sur la couche isolante et la feuille de protection formant couvercle (70).
12. Procédé selon la revendication 11 caractérise par l'étape d'assemblage du dit substrat formant base (20) et de la dite feuille de protection formant couvercle (70) avec les couches de soudure déposées respectivement en alignement avec eux, et l'application de chaleur pour joindre le substrat formant base (20) à la feuille de protection formant couvercle (70) et former un scellement hermétique entre eux.
13. Procédé selon la revendication 12 caractérisé par l'étape de dépôt des couches de soudure sous forme d'une pâte.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43195482A | 1982-09-30 | 1982-09-30 | |
| US431954 | 1982-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0105408A1 EP0105408A1 (fr) | 1984-04-18 |
| EP0105408B1 true EP0105408B1 (fr) | 1988-01-07 |
Family
ID=23714152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19830109358 Expired EP0105408B1 (fr) | 1982-09-30 | 1983-09-20 | Indicateur électroluminescent |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0105408B1 (fr) |
| JP (1) | JPS59131975A (fr) |
| CA (1) | CA1229905A (fr) |
| DE (1) | DE3375273D1 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0917810B1 (fr) * | 1997-05-22 | 2003-08-27 | Koninklijke Philips Electronics N.V. | Dispositif electroluminescent organique |
| JP5080838B2 (ja) | 2007-03-29 | 2012-11-21 | 富士フイルム株式会社 | 電子デバイスおよびその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3330982A (en) * | 1964-08-14 | 1967-07-11 | Sylvania Electric Prod | Hermetically encased electroluminescent display device |
| DE2735493C2 (de) * | 1977-08-05 | 1981-10-15 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung einer Flüssigkristallzelle und danach hergestellte Flüssigkristallzelle |
| JPS54122990A (en) * | 1978-03-16 | 1979-09-22 | Sharp Corp | Manufacture for thin film el panel |
| US4297004A (en) * | 1978-09-20 | 1981-10-27 | Technical Research of Citizen Watch Co., Ltd. | Liquid crystal display cell |
| US4357557A (en) * | 1979-03-16 | 1982-11-02 | Sharp Kabushiki Kaisha | Glass sealed thin-film electroluminescent display panel free of moisture and the fabrication method thereof |
| DE3144151A1 (de) * | 1981-11-06 | 1983-05-19 | Robert Bosch Gmbh, 7000 Stuttgart | Lcd-anzeigevorrichtung |
-
1983
- 1983-08-25 CA CA000435332A patent/CA1229905A/fr not_active Expired
- 1983-09-20 DE DE8383109358T patent/DE3375273D1/de not_active Expired
- 1983-09-20 EP EP19830109358 patent/EP0105408B1/fr not_active Expired
- 1983-09-27 JP JP58177166A patent/JPS59131975A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| EP0105408A1 (fr) | 1984-04-18 |
| DE3375273D1 (en) | 1988-02-11 |
| CA1229905A (fr) | 1987-12-01 |
| JPS59131975A (ja) | 1984-07-28 |
| JPH0380314B2 (fr) | 1991-12-24 |
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