EP0124593A4 - Modulzusammenbaueinheit. - Google Patents
Modulzusammenbaueinheit.Info
- Publication number
- EP0124593A4 EP0124593A4 EP19830903743 EP83903743A EP0124593A4 EP 0124593 A4 EP0124593 A4 EP 0124593A4 EP 19830903743 EP19830903743 EP 19830903743 EP 83903743 A EP83903743 A EP 83903743A EP 0124593 A4 EP0124593 A4 EP 0124593A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- module
- members
- insulating member
- section
- accordance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- KKEBXNMGHUCPEZ-UHFFFAOYSA-N 4-phenyl-1-(2-sulfanylethyl)imidazolidin-2-one Chemical compound N1C(=O)N(CCS)CC1C1=CC=CC=C1 KKEBXNMGHUCPEZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
Definitions
- Each quadrilateral member 111 has one side formed with a ledge 1110 having a row of slots 1111 intended to receive first contacts 101 of electrical conducting members 10. Adjacent quadrilateral members 111 are joined together by cornerpost sections 112 to form a chamber 110 for receiving module 2 so that the edges of module 2 lie on ledges 1110 with terminals 20 thereof aligned with corresponding ones of slots 1111.
- Biasing spring 1123 is a generally u-shaped spring member wherein one side has a serrated section 11231 extended and formed over at a right angle into a support section 11231 extended and formed over at a right angle into a support section 11232 and wherein the opposite side is formed into a curved section 11232 for engaging module 2.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US43938982A | 1982-11-05 | 1982-11-05 | |
| US439389 | 1982-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0124593A1 EP0124593A1 (de) | 1984-11-14 |
| EP0124593A4 true EP0124593A4 (de) | 1987-01-29 |
Family
ID=23744520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19830903743 Withdrawn EP0124593A4 (de) | 1982-11-05 | 1983-11-01 | Modulzusammenbaueinheit. |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0124593A4 (de) |
| WO (1) | WO1984001859A1 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4814857A (en) * | 1987-02-25 | 1989-03-21 | International Business Machines Corporation | Circuit module with separate signal and power connectors |
| US4755146A (en) * | 1987-06-04 | 1988-07-05 | Molex Incorporated | Heat-dissipating socket connector for leaded modules |
| US4768973A (en) * | 1987-07-02 | 1988-09-06 | Amp Incorporated | Removable retaining plate |
| US4934944B1 (en) * | 1988-11-07 | 1994-07-19 | Methode Electronics Inc | Chip carrier socket with open aperture |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0146242A2 (de) * | 1983-10-31 | 1985-06-26 | Amp Incorporated | Elektrischer Verbinder für einen Chipträger |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3663920A (en) * | 1970-07-27 | 1972-05-16 | Burndy Corp | Mounting for integrated circuits |
| US3877064A (en) * | 1974-02-22 | 1975-04-08 | Amp Inc | Device for connecting leadless integrated circuit packages to a printed-circuit board |
| US4050755A (en) * | 1976-04-02 | 1977-09-27 | E. I. Du Pont De Nemours And Company | Electrical connector |
| DE2731050C2 (de) * | 1976-07-07 | 1982-04-15 | Minnesota Mining and Manufacturing Co., 55133 Saint Paul, Minn. | Vorrichtung zum getrennten elektrischen Verbinden von Leiterbahnen einer Leiterplatte mit Kontaktflächen eines elektrischen Bauteils |
| US4142287A (en) * | 1976-12-27 | 1979-03-06 | Amp Incorporated | Electrical devices such as watches and method of construction thereof |
| FR2380629A1 (fr) * | 1977-02-10 | 1978-09-08 | Itt Produits Ind | Relais miniaturise embrochable |
| US4093330A (en) * | 1977-05-16 | 1978-06-06 | Industrial Electronic Hardware | Circuit chip receptacle |
| US4130327A (en) * | 1977-05-27 | 1978-12-19 | Bunker Ramo Corporation | Electrical connector having a resilient cover |
| US4155615A (en) * | 1978-01-24 | 1979-05-22 | Amp Incorporated | Multi-contact connector for ceramic substrate packages and the like |
| US4222622A (en) * | 1978-06-12 | 1980-09-16 | Gte Products Corporation | Electrical connector for circuit board |
| US4193654A (en) * | 1978-09-08 | 1980-03-18 | Amp Incorporated | Electrical connector receptacles |
| US4278311A (en) * | 1979-04-06 | 1981-07-14 | Amp Incorporated | Surface to surface connector |
| US4220383A (en) * | 1979-04-06 | 1980-09-02 | Amp Incorporated | Surface to surface connector |
| US4395084A (en) * | 1981-07-06 | 1983-07-26 | Teledyne Industries, Inc. | Electrical socket for leadless integrated circuit packages |
| US4410223A (en) * | 1981-08-03 | 1983-10-18 | Bell Telephone Laboratories, Incorporated | Module mounting assembly |
-
1983
- 1983-11-01 EP EP19830903743 patent/EP0124593A4/de not_active Withdrawn
- 1983-11-01 WO PCT/US1983/001692 patent/WO1984001859A1/en not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0146242A2 (de) * | 1983-10-31 | 1985-06-26 | Amp Incorporated | Elektrischer Verbinder für einen Chipträger |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO8401859A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0124593A1 (de) | 1984-11-14 |
| WO1984001859A1 (en) | 1984-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Designated state(s): DE FR GB |
|
| 17P | Request for examination filed |
Effective date: 19841011 |
|
| A4 | Supplementary search report drawn up and despatched |
Effective date: 19870129 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
| 18W | Application withdrawn |
Withdrawal date: 19870319 |
|
| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: STRAUTZ, MICHAEL, GABRIEL Inventor name: BAKER, PAUL, ABNER |