EP0141507A3 - Procédé et appareillage pour la métallisation sans courant - Google Patents

Procédé et appareillage pour la métallisation sans courant Download PDF

Info

Publication number: EP0141507A3
Authority: EP; European Patent Office
Prior art keywords: article; electroless plating; plating; plating solution; electrical
Prior art date: 1983-09-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP84306103A

Other languages

German (de)

English (en)

Other versions

EP0141507A2 (fr

Inventor

Serge Leroy

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Chemetall Ltd

Original Assignee

Brent Chemicals International PLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-09-08

Filing date

1984-09-06

Publication date

1985-07-10

1984-09-06 Application filed by Brent Chemicals International PLC filed Critical Brent Chemicals International PLC

1985-05-15 Publication of EP0141507A2 publication Critical patent/EP0141507A2/fr

1985-07-10 Publication of EP0141507A3 publication Critical patent/EP0141507A3/fr

Status Withdrawn legal-status Critical Current

Links

238000007772 electroless plating Methods 0.000 title abstract 2
238000000034 method Methods 0.000 title abstract 2
238000007747 plating Methods 0.000 abstract 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
239000003638 chemical reducing agent Substances 0.000 abstract 1
238000009713 electroplating Methods 0.000 abstract 1
TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical compound OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 abstract 1
239000002184 metal Substances 0.000 abstract 1
229910052751 metal Inorganic materials 0.000 abstract 1
229910052759 nickel Inorganic materials 0.000 abstract 1
230000003334 potential effect Effects 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)

EP84306103A 1983-09-08 1984-09-06 Procédé et appareillage pour la métallisation sans courant Withdrawn EP0141507A3 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
GB838324060A GB8324060D0 (en)	1983-09-08	1983-09-08	Apparatus for electroless plating
GB8324060		1983-09-08

Publications (2)

Publication Number	Publication Date
EP0141507A2 EP0141507A2 (fr)	1985-05-15
EP0141507A3 true EP0141507A3 (fr)	1985-07-10

Family

ID=10548476

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP84306103A Withdrawn EP0141507A3 (fr)	1983-09-08	1984-09-06	Procédé et appareillage pour la métallisation sans courant

Country Status (2)

Country	Link
EP (1)	EP0141507A3 (fr)
GB (1)	GB8324060D0 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4659605A (en) *	1984-05-16	1987-04-21	Richardson Chemical Company	Electroless deposition magnetic recording media process and products produced thereby
CN115369463B (zh) *	2022-07-28	2024-12-13	江苏甬金金属科技有限公司	一种用于电池外壳的高耐蚀不锈钢带的加工工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2837445A (en) *	1956-04-06	1958-06-03	Gen Am Transport	Continuous processes of chemical nickel plating
US3264199A (en) *	1962-06-25	1966-08-02	Ford Motor Co	Electroless plating of metals
US3303111A (en) *	1963-08-12	1967-02-07	Arthur L Peach	Electro-electroless plating method
DE1278188B (de) *	1964-08-18	1968-09-19	Siemag Siegener Maschb Ges Mit	Verfahren zur Herstellung von UEberzuegen unedler Metalle auf edleren Metallen durch chemische Reduktion von in Wasser geloesten Metallsalzen
US3485725A (en) *	1965-10-08	1969-12-23	Ibm	Method of increasing the deposition rate of electroless solutions
US3864148A (en) *	1971-10-14	1975-02-04	Kuraray Co	Process for production of metal-plated fibers

1983
- 1983-09-08 GB GB838324060A patent/GB8324060D0/en active Pending
1984
- 1984-09-06 EP EP84306103A patent/EP0141507A3/fr not_active Withdrawn

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2837445A (en) *	1956-04-06	1958-06-03	Gen Am Transport	Continuous processes of chemical nickel plating
US3264199A (en) *	1962-06-25	1966-08-02	Ford Motor Co	Electroless plating of metals
US3303111A (en) *	1963-08-12	1967-02-07	Arthur L Peach	Electro-electroless plating method
DE1278188B (de) *	1964-08-18	1968-09-19	Siemag Siegener Maschb Ges Mit	Verfahren zur Herstellung von UEberzuegen unedler Metalle auf edleren Metallen durch chemische Reduktion von in Wasser geloesten Metallsalzen
US3485725A (en) *	1965-10-08	1969-12-23	Ibm	Method of increasing the deposition rate of electroless solutions
US3864148A (en) *	1971-10-14	1975-02-04	Kuraray Co	Process for production of metal-plated fibers

Also Published As

Publication number	Publication date
EP0141507A2 (fr)	1985-05-15
GB8324060D0 (en)	1983-10-12

Legal Events

Date	Code	Title	Description
1985-03-16	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1985-05-07	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
1985-05-15	AK	Designated contracting states	Designated state(s): BE DE FR GB IT NL
1985-07-10	AK	Designated contracting states	Designated state(s): BE DE FR GB IT NL
1986-07-18	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
1986-09-03	18D	Application deemed to be withdrawn	Effective date: 19860310
2007-08-08	RIN1	Information on inventor provided before grant (corrected)	Inventor name: LEROY, SERGE

Publication	Publication Date	Title
US6071398A (en)	2000-06-06	Programmed pulse electroplating process
CA1127994A (fr)	1982-07-20	Electrodeposition sur l'aluminium
HUT46083A (en)	1988-09-28	Process and equipment for electroplating copper foil
ES8205021A1 (es)	1982-05-16	Un procedimiento para el pretratamiento de un sustrato sus- tancialmente no conductor
GB2192642B (en)	1990-12-19	Process for the deposition of bearing alloys
US3649491A (en)	1972-03-14	Electrolytic stripping composition
LU90640B1 (en)	2002-05-23	Method for electroplating a strip of foam
ATE10862T1 (de)	1985-01-15	Verfahren zur galvanischen abscheidung von bleilegierungen.
US2451340A (en)	1948-10-12	Electroplating
GB1272536A (en)	1972-05-03	Electroplating solutions and process for electroplating using such solutions
KR830002066A (ko)	1983-05-21	구리이온이 함유되어 있는 욕(浴)에서 구리이온을 제거하는 방법
US3920526A (en)	1975-11-18	Process for the electrodeposition of ductile palladium and electroplating bath useful therefor
Honma et al.	1983	Applications of ductile electroless copper deposition on printed circuit boards
EP0141507A3 (fr)	1985-07-10	Procédé et appareillage pour la métallisation sans courant
GB1462001A (en)	1977-01-19	Method of electrolytically nodularizing a metal surface
US3445351A (en)	1969-05-20	Process for plating metals
US4297179A (en)	1981-10-27	Palladium electroplating bath and process
US2799636A (en)	1957-07-16	Processing of separable fastener stringers
Leroy	1985	Method and Apparatus for Electroless Plating
US3769181A (en)	1973-10-30	Method of simultaneously electroplating and machining a metal surface
KR860001221A (ko)	1986-02-24	스테인레스강의 금속도금 방법
JPS57145969A (en)	1982-09-09	Chemical plating method
ES8402368A1 (es)	1984-02-01	Metodo para producir un articulo resistente a la corrosion chapado electroliticamente con zinc-niquel.
JPS5760086A (en)	1982-04-10	Cathode for electrolyzing water and its manufacture
Sutter	1984	The Use of Pulsed Current in Electroplating