EP0154201A1 - Procédé pour le traitement postérieur de couches d'oxyde d'aluminium avec solutions aqueuses contenant du silicate de métal alcalin et leur utilisation pour la fabrication de supports pour plaques d'impression offset - Google Patents
Procédé pour le traitement postérieur de couches d'oxyde d'aluminium avec solutions aqueuses contenant du silicate de métal alcalin et leur utilisation pour la fabrication de supports pour plaques d'impression offset Download PDFInfo
- Publication number
- EP0154201A1 EP0154201A1 EP85101402A EP85101402A EP0154201A1 EP 0154201 A1 EP0154201 A1 EP 0154201A1 EP 85101402 A EP85101402 A EP 85101402A EP 85101402 A EP85101402 A EP 85101402A EP 0154201 A1 EP0154201 A1 EP 0154201A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- aftertreatment
- aqueous solution
- alkaline earth
- earth metal
- electrochemically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 239000007864 aqueous solution Substances 0.000 title claims abstract description 29
- 229910052910 alkali metal silicate Inorganic materials 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 238000007645 offset printing Methods 0.000 title claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title 3
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000000243 solution Substances 0.000 claims abstract description 19
- 238000011282 treatment Methods 0.000 claims abstract description 19
- 229910001420 alkaline earth metal ion Inorganic materials 0.000 claims abstract description 11
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- -1 alkaline earth metal salts Chemical class 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 11
- 238000007788 roughening Methods 0.000 claims description 11
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 6
- 239000011575 calcium Substances 0.000 claims description 5
- 239000008139 complexing agent Substances 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052791 calcium Inorganic materials 0.000 claims description 2
- 150000004679 hydroxides Chemical class 0.000 claims description 2
- 150000002823 nitrates Chemical class 0.000 claims description 2
- 159000000008 strontium salts Chemical class 0.000 claims description 2
- 239000011888 foil Substances 0.000 abstract description 3
- 238000007639 printing Methods 0.000 description 26
- 239000003513 alkali Substances 0.000 description 14
- 239000000975 dye Substances 0.000 description 14
- 238000001179 sorption measurement Methods 0.000 description 14
- 239000003792 electrolyte Substances 0.000 description 12
- 239000012876 carrier material Substances 0.000 description 10
- 230000005855 radiation Effects 0.000 description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Natural products OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000011734 sodium Substances 0.000 description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000012954 diazonium Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- JOOXCMJARBKPKM-UHFFFAOYSA-N 4-oxopentanoic acid Chemical compound CC(=O)CCC(O)=O JOOXCMJARBKPKM-UHFFFAOYSA-N 0.000 description 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000007859 condensation product Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000001850 reproductive effect Effects 0.000 description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 150000001989 diazonium salts Chemical class 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229940040102 levulinic acid Drugs 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- LXFQSRIDYRFTJW-UHFFFAOYSA-M 2,4,6-trimethylbenzenesulfonate Chemical compound CC1=CC(C)=C(S([O-])(=O)=O)C(C)=C1 LXFQSRIDYRFTJW-UHFFFAOYSA-M 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 description 1
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- DMBHHRLKUKUOEG-UHFFFAOYSA-N N-phenyl aniline Natural products C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000274 adsorptive effect Effects 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- 125000005137 alkenylsulfonyl group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 125000003096 carboxylic acid amide acetal group Chemical group 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical class [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LRMHFDNWKCSEQU-UHFFFAOYSA-N ethoxyethane;phenol Chemical compound CCOCC.OC1=CC=CC=C1 LRMHFDNWKCSEQU-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 159000000011 group IA salts Chemical class 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- DAONPBQTUWQEQJ-UHFFFAOYSA-N n-(oxomethylidene)prop-1-ene-1-sulfonamide Chemical compound CC=CS(=O)(=O)N=C=O DAONPBQTUWQEQJ-UHFFFAOYSA-N 0.000 description 1
- RIBSIXLJGIEVSH-UHFFFAOYSA-N n-phenyl-n-phenyldiazenylaniline Chemical compound C1=CC=CC=C1N=NN(C=1C=CC=CC=1)C1=CC=CC=C1 RIBSIXLJGIEVSH-UHFFFAOYSA-N 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical class [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/038—Treatment with a chromium compound, a silicon compound, a phophorus compound or a compound of a metal of group IVB; Hydrophilic coatings obtained by hydrolysis of organometallic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/20—Electrolytic after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
Definitions
- the invention relates to an aftertreatment process for roughened and anodically oxidized aluminum, in particular of support materials for offset printing plates with aqueous solutions containing alkali metal silicate.
- Carrier materials for offset printing plates are provided either by the consumer directly or by the manufacturer of pre-coated printing plates on one or both sides with a radiation (light) sensitive layer (reproduction layer), with the help of which a printing image of a template is generated by photomechanical means.
- the layer support carries the image points which will guide the color during later printing and at the same time forms the hydrophilic background for the lithographic printing process at the non-image points (non-image points) during later printing.
- Aluminum is used in particular as the base material for such substrates. It is roughened according to known methods by dry brushing, wet brushing, sandblasting, chemical and / or electrochemical treatment. In order to increase the abrasion resistance, the roughened substrate can also be subjected to an anodization step to build up a thin oxide layer.
- the carrier materials in particular anodically oxidized carrier materials based on aluminum, are often a further treatment step to improve the layer adhesion, to increase the hydrophilicity and / or to facilitate the developability of the radiation-sensitive layers before the application of a radiation-sensitive layer subjected to, for example, the following methods:
- the object of the present invention is to propose a method for the aftertreatment of flat aluminum, which can be carried out in addition to anodic oxidation of the aluminum and leads to a surface on the aluminum oxide thus produced, which in particular meets the practical requirements of a high-performance printing plate described at the outset and already known Silikalmaschinesclar improved in effect.
- the invention is based on the known process for the production of plate, film or tape-shaped materials based on electrochemically or mechanically and electrochemically roughened and anodically oxidized aluminum or one of its alloys, the aluminum oxide layers of which are post-treated with a solution containing aqueous alkali metal silicate.
- the process according to the invention is then characterized in that the electrochemical roughening is carried out in an aqueous solution containing nitric acid and the aftertreatment is carried out in an aqueous solution containing alkali metal silicate and alkaline earth metal ions.
- water-soluble alkaline earth metal salts preferably calcium or strontium salts
- the compounds which provide alkaline earth metal ions which also includes hydroxides in addition to the acid-derived compounds, in particular nitrates.
- the aqueous solution in the aftertreatment contains 0.5 to 30% by weight, in particular 1 to 15% by weight, of alkali metal silicate (such as sodium metasilicate or the sodium and tetrasilicates contained in the "water glass"). and 0.001 to 0.5% by weight, in particular 0.005 to 0.3% by weight of alkaline earth metal ions (such as Ca 2+ or Sr 2+ ).
- this aqueous solution can also contain at least one complexing agent for alkaline earth metal ions such as hydroxycarboxylic acids, aminocarboxylic acids, hydroxyl or carboxyl-containing nitrogen compounds or phenols (for example levulinic acid, ethylenediaminetetraacetic acid or salts thereof).
- at least one complexing agent for alkaline earth metal ions such as hydroxycarboxylic acids, aminocarboxylic acids, hydroxyl or carboxyl-containing nitrogen compounds or phenols (for example levulinic acid, ethylenediaminetetraacetic acid or salts thereof).
- the aftertreatment can be carried out as an immersion treatment or also electrochemically, the latter procedure often bringing about a further increase in the alkali resistance and / or improvement in the adsorption behavior of the material.
- the electrochemical process variant is carried out in particular with direct or alternating current, trapezoidal, rectangular or triangular current or overlapping forms of these types of current; the current density is generally 0.1 to 10 A / dm 2 and / or the voltage is 1 to 100 V, the rest of the parameters depend on z. B. from electrode spacing or the electrolyte composition.
- Post-treatment of the materials can be discounted be carried out nuously or continuously in modern belt systems, the treatment times are expediently in the range from 0.5 to 120 sec and the treatment temperatures are from 15 to 80 ° C., in particular from 20 to 75 ° C. It is assumed that the Pores of the aluminum oxide layer forms a firmly adhering cover layer, which protects the oxide from attacks.
- the procedure used changes the previously generated surface topography (such as roughness and oxide pores) practically not or only insignificantly, so that the method according to the invention is particularly suitable for the treatment of materials in which the retention of this topography plays a major role, for example for printing plate support materials.
- Suitable base materials for the material to be treated according to the invention include those made of aluminum or one of its alloys, which have, for example, a content of more than 98.5% by weight of Al and proportions of Si, Fe, Ti, Cu and Zn.
- These aluminum support materials can also be roughened mechanically (for example by brushing with wire or nylon brushes and / or with abrasive treatments), if necessary after pre-cleaning, before the electrochemical stage. All process steps can be carried out discontinuously with plates or foils, but they are preferably carried out continuously with tapes.
- the process parameters in particular in the case of continuous process control, in the electrochemical roughening stage are in the following ranges: the temperature of the aqueous electrolyte, in particular 0.3 to 3.0% by weight of nitric acid (HNO 3 ), between 20 and 60 ° C. the current density between 3 and 200 A / dm 2 , the residence time of a material point to be roughened in the electrolyte between 3 and 100 sec and the electrolyte flow rate at the surface of the material to be roughened between 5 and 100 cm / sec; in the batchwise process, the required current densities tend to be in the lower part and the dwell times are in the upper part of the ranges specified, and the flow of the electrolyte can also be dispensed with.
- HNO 3 nitric acid
- alternating current with a frequency of 50 to 60 Hz is used as the type of current, but modified types of current such as alternating current with different amplitudes of the current strength for the anode and cathode current, lower frequencies, current interruptions or superimposition of two currents of different frequency and waveform are also possible.
- the average roughness depth R of the roughened surface is in the range from 1 to 15 ⁇ m, in particular from 1.5 to 8.0 ⁇ m.
- aluminum ions in the form of aluminum salts in particular Al (N0 3 ) 3
- Al (N0 3 ) 3 can also be added to the aqueous electrolyte; the addition of certain other acids and salts such as boric acid or borates or of corrosion inhibitors such as amines is also known.
- the post-treatment according to the invention is surprisingly effective based on HN0 3 only after the roughening in the aqueous electrolyte, but not, for example, after the roughening in an electron trol y th on the basis of HCl.
- Pre-cleaning includes, for example, treatment with aqueous NaOH solution with or without degreasing agent and / or complexing agents, trichlorethylene, acetone, methanol or other commercially available aluminum stains.
- the roughening or, in the case of several roughening stages, also between the individual stages, an abrasive treatment can additionally be carried out, in particular a maximum of 2 g / m 2 being removed (up to 5 g / m 2 between the stages);
- aqueous solutions of alkali metal hydroxide or aqueous solutions of alkaline salts or aqueous acid solutions based on HN0 3 , H 2 SO 4 or H 3 PO 4 are used as abrasive solutions.
- non-electrochemical treatments are also known which essentially only have a rinsing and / or cleaning effect and, for example, for removing deposits formed during roughening ("Schmant") or simply for Serve removal of electrolyte residues; For example, dilute aqueous alkali hydroxide solutions or water are used for these purposes.
- anodic oxidation of the aluminum follows in a further process step, for example to improve the abrasion and adhesion properties of the surface of the carrier material.
- the usual electrolytes such as H 2 S0 4 , H 3 P0 4 , H 2 C 2 0 4 , amidosulfonic acid, sulfosuccinic acid, sulfosalicylic acid or mixtures thereof can be used for anodic oxidation; in particular, H 2 S0 4 and H 3 P0 4 are used alone, in a mixture and / or in a multi-stage anodizing process.
- the oxide layer weights are generally in particular between 1 and 8 g / m 2 (corresponding to about 0.3 to 2.5 ⁇ m layer thickness).
- the materials produced according to the invention are preferably used as supports for offset printing plates, i. H. a radiation-sensitive coating is applied to one or both sides of the carrier material either by the manufacturer of presensitized printing plates or directly by the consumer.
- a radiation-sensitive coating is applied to one or both sides of the carrier material either by the manufacturer of presensitized printing plates or directly by the consumer.
- all layers are suitable as radiation (light) sensitive layers which, after irradiation (exposure), optionally with subsequent development and / or fixation, provide an imagewise surface from which printing can take place.
- the suitable layers also include the electrophotographic layers, ie those which contain an inorganic or organic photoconductor.
- these layers can of course also other components such.
- B. contain resins, dyes or plasticizers.
- the following light-sensitive compositions or compounds can be used in the coating of the carrier materials produced by the process according to the invention:
- o-quinonediazides in particular o-naphthoquinonediazides such as naphthoquinone- (1,2) -diazid- (2) -sulfonic acid esters or amides, which can be of low or higher molecular weight, as a photosensitive compound-containing reproduction layers, for example in the DE-C 854 890, 865 109, 879 203, 894 959, 938 233, 1 109 521, 1 144 705, 1 118 606, 1 120 273, 1 124 817 and 2 331 377 and EP-A 0 021 428 and 0 055 814; negative working reproduction layers with condensation products from aromatic diazonium salts and bonds with active carbonyl groups, preferably condensation products from diphenylamine diazonium salts and formaldehyde, which are described, for example, in DE-C 596 731, 1 138 399, 1 138 400, 1 138 401, 1 142 871
- Reproductive layers containing negative-working, mixed condensation products of aromatic diazonium compounds for example according to DE-C 20 65 732, the products with at least one unit each of a) a condensable aromatic diazonium salt compound and b) a condensable compound such as a phenol ether or an aromatic thioether, connected by have a double bonded intermediate derived from a condensable carbonyl compound such as a methylene group;
- positive-working layers according to DE-A 26 10 842, DE-C 27 18 254 or DE-A 29 28 636, which contain a compound which cleaves off on irradiation, a monomeric or polymeric compound which has at least one C-cleavable by acid -0-C group (z. B. an orthocarboxylic acid ester group or a carboxylic acid amide acetal group) and optionally contain a binder;
- the monomers used here are, for example, acrylic and methacrylic acid esters or reaction products of diisocyanates with partial esters of polyhydric alcohols, as described, for example, in US Pat. Nos. 2,760,863 and 3,060,023 and DE-A 20 64 079 and 23 61 041;
- Negative-working layers according to DE-A 30 36 077, which contain a diazonium salt polycondensation product or an organic azido compound as a photosensitive compound and a high molecular weight polymer with pendant alkenylsulfonyl or cycloalkenylsulfonylurethane groups as a binder.
- photo-semiconducting layers such as e.g. in DE-C 11 17 391, 15 22 497, 15 72 312, 23 22 046 and 23 22 047 are described, are applied to the carrier materials produced according to the invention, thereby producing highly light-sensitive, electrophotographic printing plates.
- coated offset printing plates obtained from the carrier materials produced according to the invention are converted into the desired printing form in a known manner by imagewise exposure or irradiation and washing out of the non-image areas with a developer, preferably an aqueous developer solution.
- offset printing plates the base support materials of which have been post-treated by the process according to the invention, are distinguished from those in which the same base material has been post-treated with aqueous solutions containing only alkali metal silicates, by improved hydrophilicity of the non-image areas, a lower tendency to form color fog and improved alkali resistance .
- a plate piece provided with the radiation-sensitive layer is exposed, developed and then half is treated with a correction agent.
- the values 0 to 5 mean no (0), very weak (1) to strong (5) dye adsorption, only half steps are given.
- the alkali resistance of the surface is determined by immersing a piece of plate not provided with a radiation-sensitive layer in an aqueous dilute NaOH solution for a certain period of time (for example 30 minutes) and then visually assessing the oxide layer.
- the values a to e mean no (a) to strong (e) oxide layer attack, only whole steps are given.
- An aluminum strip is electrochemically roughened in an aqueous solution containing 1.4% of HN0 3 and 6% of Al (N0 3 ) 3 using alternating current (115 A / dm 2 at 35 ° C.) and in an aqueous H 2 S0 4 and containing Al 3+ ions Anodized solution with direct current.
- the untreated oxide layer is rated 3 in dye adsorption and a in alkali resistance.
- V 1 The procedure of V 1 is followed, but roughened in an aqueous solution containing 0.9% of HCl; dye adsorption is rated 5 and alkali resistance a.
- V 1 The procedure of V 1 is followed, but test pieces of the tape are after-treated in an aqueous solution containing 4% of Na 2 Si0 3 for 30 seconds at 40 ° C. by dipping; the post-treated oxide layer is rated 3.5 in dye adsorption and a in alkali resistance.
- test pieces of the strip are after-treated in an aqueous solution containing 4% of Na 2 Si0 3 for 30 seconds at 40 ° C. by dipping; the post-treated oxide layer is rated 3 in dye adsorption and a in alkali resistance.
- test pieces of the strip are aftertreated electrochemically (40 V DC) for 30 seconds at 25 ° C. in an aqueous solution containing 4% of Na 2 Si0 3 ; the post-treated oxide layer is 1 in the dye adsorption and in the Alka Resistance to rated with a.
- test pieces of the strip are aftertreated electrochemically (40 V DC) for 30 seconds at 25 ° C. in an aqueous solution containing 4% of Na 2 Si0 3 ; the post-treated oxide layer is rated 1.5 in dye adsorption and a in alkali resistance.
- test pieces of the tape are in an aqueous solution containing 4% of Na 2 Si0 3 for 30 seconds at 40 ° C. in the first stage and in a 0.1% Sr 2 + ion [in the form aftertreated by Sr (N0 3 ) 21 in aqueous solution in the second stage for 10 seconds at 25 ° C. by dipping; the two-stage post-treated oxide layer is rated 2.5 in dye adsorption and a in alkali resistance.
- the procedure is according to V 7, but in one stage in an aqueous, 4% of Na 2 SiO 3 , 0.1% of Sr 2 + ions [in the form of Sr (OH) 2 ] and additionally 0.1% solution containing levulinic acid after 30 seconds at 40 ° C by dipping; the oxide layer aftertreated according to the invention is rated 1 in dye adsorption and a in alkali resistance.
- Example 1 The procedure of Example 1 is followed, but aftertreatment is electrochemically (40 V DC) at 25 ° C. for 30 seconds; the oxide layer aftertreated according to the invention is rated 0.5 in dye adsorption and a in alkali resistance.
- Example 1 The procedure of Example 1 is followed, but the electrochemical roughening step is carried out in aqueous HCl solution; the post-treated oxide layer is rated 4 in dye adsorption and a in alkali resistance.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3406102 | 1984-02-21 | ||
| DE19843406102 DE3406102A1 (de) | 1984-02-21 | 1984-02-21 | Verfahren zur nachbehandlung von aluminiumoxidschichten mit alkalimetallsilikat enthaltenden waessrigen loesungen und deren verwendung bei der herstellung von offsetdruckplattentraegern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0154201A1 true EP0154201A1 (fr) | 1985-09-11 |
| EP0154201B1 EP0154201B1 (fr) | 1987-08-19 |
Family
ID=6228287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP85101402A Expired EP0154201B1 (fr) | 1984-02-21 | 1985-02-09 | Procédé pour le traitement postérieur de couches d'oxyde d'aluminium avec solutions aqueuses contenant du silicate de métal alcalin et leur utilisation pour la fabrication de supports pour plaques d'impression offset |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0154201B1 (fr) |
| JP (1) | JPS60194095A (fr) |
| BR (1) | BR8500702A (fr) |
| DE (2) | DE3406102A1 (fr) |
| ZA (1) | ZA851217B (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1398172A1 (fr) * | 2002-09-13 | 2004-03-17 | Fuji Photo Film Co., Ltd. | Support pour plaque d'impression lithographique, procédé de fabrication du support et plaque présensibilisée |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3717757A1 (de) * | 1986-05-26 | 1987-12-03 | Fuji Photo Film Co Ltd | Verfahren zur herstellung eines traegers fuer die verwendung in der herstellung einer lithografischen druckplatte |
| JP2639693B2 (ja) * | 1988-06-17 | 1997-08-13 | 富士写真フイルム株式会社 | 感光性平版印刷版の現像処理方法 |
| JP2538793B2 (ja) * | 1988-07-29 | 1996-10-02 | 富士写真フイルム株式会社 | 感光性平版印刷版の現像液 |
| ES2036127B1 (es) * | 1991-05-16 | 1994-02-01 | Sers S A | Plancha para la impresion y procedimiento para su fabricacion. |
| DE4417907A1 (de) * | 1994-05-21 | 1995-11-23 | Hoechst Ag | Verfahren zur Nachbehandlung von platten-, folien- oder bandförmigem Material, Träger aus derartigem Material und seine Verwendung für Offsetdruckplatten |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB764442A (en) * | 1954-02-04 | 1956-12-28 | Polychrome Corp | Photographically pre-sensitized planographic printing plate |
| EP0095581A2 (fr) * | 1982-05-27 | 1983-12-07 | Hoechst Aktiengesellschaft | Procédé de post traitement de couches d'oxyde d'aluminium avec des solutions aqueuses contenant silicate alcalin et son application dans la fabrication de supports de plaques d'impression offset |
| DE3232485A1 (de) * | 1982-09-01 | 1984-03-01 | Hoechst Ag, 6230 Frankfurt | Verfahren zur nachbehandlung von aluminiumoxidschichten mit alkalisilikat enthaltenden waessrigen loesungen und dessen verwendung bei der herstellung von offsetdruckplattentraegern |
-
1984
- 1984-02-21 DE DE19843406102 patent/DE3406102A1/de not_active Withdrawn
-
1985
- 1985-02-09 DE DE8585101402T patent/DE3560489D1/de not_active Expired
- 1985-02-09 EP EP85101402A patent/EP0154201B1/fr not_active Expired
- 1985-02-14 BR BR8500702A patent/BR8500702A/pt not_active IP Right Cessation
- 1985-02-18 ZA ZA851217A patent/ZA851217B/xx unknown
- 1985-02-21 JP JP60031684A patent/JPS60194095A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB764442A (en) * | 1954-02-04 | 1956-12-28 | Polychrome Corp | Photographically pre-sensitized planographic printing plate |
| EP0095581A2 (fr) * | 1982-05-27 | 1983-12-07 | Hoechst Aktiengesellschaft | Procédé de post traitement de couches d'oxyde d'aluminium avec des solutions aqueuses contenant silicate alcalin et son application dans la fabrication de supports de plaques d'impression offset |
| DE3232485A1 (de) * | 1982-09-01 | 1984-03-01 | Hoechst Ag, 6230 Frankfurt | Verfahren zur nachbehandlung von aluminiumoxidschichten mit alkalisilikat enthaltenden waessrigen loesungen und dessen verwendung bei der herstellung von offsetdruckplattentraegern |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1398172A1 (fr) * | 2002-09-13 | 2004-03-17 | Fuji Photo Film Co., Ltd. | Support pour plaque d'impression lithographique, procédé de fabrication du support et plaque présensibilisée |
| US7087361B2 (en) | 2002-09-13 | 2006-08-08 | Fuji Photo Film Co., Ltd. | Support for lithographic printing plate, method of preparing the support and presensitized plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60194095A (ja) | 1985-10-02 |
| DE3560489D1 (en) | 1987-09-24 |
| DE3406102A1 (de) | 1985-08-22 |
| BR8500702A (pt) | 1985-10-08 |
| EP0154201B1 (fr) | 1987-08-19 |
| ZA851217B (en) | 1985-10-30 |
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