EP0180090A3 - Système et procédé pour la surveillance et la maintenance automatique des concentrations désirées dans les bains métalliques de plaquage - Google Patents

Système et procédé pour la surveillance et la maintenance automatique des concentrations désirées dans les bains métalliques de plaquage Download PDF

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Publication number
EP0180090A3
EP0180090A3 EP85113091A EP85113091A EP0180090A3 EP 0180090 A3 EP0180090 A3 EP 0180090A3 EP 85113091 A EP85113091 A EP 85113091A EP 85113091 A EP85113091 A EP 85113091A EP 0180090 A3 EP0180090 A3 EP 0180090A3
Authority
EP
European Patent Office
Prior art keywords
tank
plating
sensing
cell
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP85113091A
Other languages
German (de)
English (en)
Other versions
EP0180090A2 (fr
Inventor
Gary Vincent Arbach
Perminder Singh Bindra
David Noel Light
David Lee Rath
Judith Marie Roldan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0180090A2 publication Critical patent/EP0180090A2/fr
Publication of EP0180090A3 publication Critical patent/EP0180090A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
  • Control Of Non-Electrical Variables (AREA)
EP85113091A 1984-10-30 1985-10-15 Système et procédé pour la surveillance et la maintenance automatique des concentrations désirées dans les bains métalliques de plaquage Withdrawn EP0180090A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66651284A 1984-10-30 1984-10-30
US666512 1984-10-30

Publications (2)

Publication Number Publication Date
EP0180090A2 EP0180090A2 (fr) 1986-05-07
EP0180090A3 true EP0180090A3 (fr) 1987-03-18

Family

ID=24674376

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85113091A Withdrawn EP0180090A3 (fr) 1984-10-30 1985-10-15 Système et procédé pour la surveillance et la maintenance automatique des concentrations désirées dans les bains métalliques de plaquage

Country Status (2)

Country Link
EP (1) EP0180090A3 (fr)
JP (1) JPS61110799A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110863237B (zh) * 2019-11-06 2021-05-11 江门荣信电路板有限公司 一种电镀液自动添加的防呆系统及其使用方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
ES2039403T3 (es) * 1986-10-31 1993-10-01 Amp-Akzo Corporation (A Delaware Corp.) Metodo para depositar sin electricidad cobre de alta calidad.
US5296123A (en) * 1992-09-16 1994-03-22 Hughes Aircraft Company In-tank electrochemical sensor
AU3778999A (en) * 1998-05-01 1999-11-23 Dj Parker Company, Inc. Chemical mixing, replenishment, and waste management system
US6746589B2 (en) * 2000-09-20 2004-06-08 Ebara Corporation Plating method and plating apparatus
US6746579B2 (en) 2001-11-21 2004-06-08 Hitachi Kyowa Engineering Co., Ltd. Electrolytic gold plating method and apparatus therefor
US7851222B2 (en) 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
ES2353706B1 (es) * 2008-11-21 2012-01-25 Universidad Politecnica De Valencia Celda electroquímica de generación de gases para el análisis de procesos electroquímicos.
JP5509120B2 (ja) * 2011-02-28 2014-06-04 メルテックス株式会社 無電解ニッケルめっき液の硫黄化合物濃度測定方法
JP5443409B2 (ja) * 2011-02-28 2014-03-19 トヨタ自動車株式会社 硫黄系化合物の管理方法及びその管理システム
CN102998353B (zh) * 2011-09-15 2016-08-10 上海宝钢工业技术服务有限公司 镀锡板镀层中铅测定样品处理自动试验装置
JP6373157B2 (ja) * 2014-10-14 2018-08-15 日置電機株式会社 電気化学センサおよび電気化学測定装置
CN107227468A (zh) * 2017-07-31 2017-10-03 赣州市恒源科技股份有限公司 一种稀土金属自动电解设备
CN112030196B (zh) * 2020-08-20 2021-09-14 中南大学 一种精密电铸系统及控制方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2371522B1 (fr) * 1976-11-22 1980-02-15 Kollmorgen Tech Corp
DE2911073A1 (de) * 1979-03-21 1980-10-02 Siemens Ag Badfuehrungsgeraet fuer ein bad zum stromlosen abscheiden von kupfer
US4406249A (en) * 1979-11-14 1983-09-27 C. Uyemura & Co., Ltd. Apparatus for controlling electroless plating bath

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2371522B1 (fr) * 1976-11-22 1980-02-15 Kollmorgen Tech Corp
DE2911073A1 (de) * 1979-03-21 1980-10-02 Siemens Ag Badfuehrungsgeraet fuer ein bad zum stromlosen abscheiden von kupfer
US4406249A (en) * 1979-11-14 1983-09-27 C. Uyemura & Co., Ltd. Apparatus for controlling electroless plating bath

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOURNAL OF ELECTROCHEMICAL SOCIETY, vol. 127, no. 2, February 1980, pages 365-369; M. PAUNOVIC "An electrochemical control system for electroless copper bath" *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110863237B (zh) * 2019-11-06 2021-05-11 江门荣信电路板有限公司 一种电镀液自动添加的防呆系统及其使用方法

Also Published As

Publication number Publication date
JPS61110799A (ja) 1986-05-29
EP0180090A2 (fr) 1986-05-07

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Inventor name: BINDRA, PERMINDER SINGH

Inventor name: ARBACH, GARY VINCENT

Inventor name: LIGHT, DAVID NOEL

Inventor name: RATH, DAVID LEE

Inventor name: ROLDAN, JUDITH MARIE