EP0181886A1 - Puits thermique plan multiple - Google Patents

Puits thermique plan multiple

Info

Publication number
EP0181886A1
EP0181886A1 EP19850902399 EP85902399A EP0181886A1 EP 0181886 A1 EP0181886 A1 EP 0181886A1 EP 19850902399 EP19850902399 EP 19850902399 EP 85902399 A EP85902399 A EP 85902399A EP 0181886 A1 EP0181886 A1 EP 0181886A1
Authority
EP
European Patent Office
Prior art keywords
heat sink
plate
base plate
planar
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19850902399
Other languages
German (de)
English (en)
Inventor
Alfred G. Ocken
Raymond J. Kowieski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of EP0181886A1 publication Critical patent/EP0181886A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Definitions

  • the present invention relates to electronic component heat sinks and a method for manufacturing the same. More particularly, the invention relates to a heat sink having a plurality of planar surfaces with electronic devices mounted thereon.
  • U.S. patent 4,321,664 discloses a heat sink utilized to hold diodes in a rectifier assembly.
  • the heat sink is shown to comprise a sheet metal piece that is bent along two axes to form a U-shaped member.
  • the diodes forming the rectifier circuit are placed or soldered in openings in the center base section of the heat sink. Such assembly of diodes is well known, with all diodes placed in a single plane of the heat sink.
  • an electronic component heat sink assembly wherein the assembly can be quickly and easily manufactured. Further, in view of the limited space available in the final use environment for the assembly, it is desirable that the assembly can be of as small a size as possible while providing acceptable heat absorption.
  • the heat sink assembly should also be able to be formed in a variety of configurations to adapt the sink to its final environment while taking up a minimal amount of space in such environment.
  • An example of such an application is an alternator in an automobile having an attached rectifier.
  • Such rectifiers employ button, micro-button and chip diodes in order to reduce the overall size of the alternator.
  • Such types of diodes must be soldered to a heat sink.
  • the soldering is preferably done in a flow soldering technique, which must be performed along a single planar surface. Once such diodes are connected, the heat sink can be formed to the desired final shape. Accordingly, it is an object of the present invention to provide an improved electronic component heat sink assembly and a method of manufacturing the same. Summary of the Invention
  • the present invention provides an electronic component heat sink assembly and a method of manufacturing the same.
  • Such assembly comprises a metal plate structure capable of having electronic components flow soldered to it while the heat sink is in a single plane configuration.
  • the heat sink should then be capable of being formed into a multi-planar arrangement wherein the electronic components affixed thereto maintain flush contact with one of the planes of the heat sink.
  • the electronic components need not be in a single planar face of the assembly, but rather can be distributed as deemed best about the various planar faces of the heat sink.
  • the method is further adaptable to provide for forming of the heat sink assembly after the initial bending of the heat sink to best accommodate the heat sink assembly in its final environment.
  • the heat sink usually comprises a metal, usually of an aluminum base, plate formed into a plurality of planes.
  • the electronic components remain flushly mounted to the planar surfaces.
  • the metal plate could be of a steel composition to permit ready soldering thereto if steel would provide sufficient heat dissipation.
  • the base plate is of an aluminum base, it is usually necessary to coat the area to which the electronic components are to be flow soldered with a copper or brass deposit to permit the device to be flow soldered thereto. Such deposit could be done by a plasma arc depositing process.
  • the present invention provides a method of manufacturing an electronic component-heat sink assembly including the steps of affixing one or more electronic components to a single planar metal plate and forming said plate into a plurality of planes such that one or more electronic component remains flushly mounted to at least two of said planes.
  • the present invention also provides an electronic component heat sink comprising a metallic base plate having a plurality of generally planar surfaces, with one or more electronic components mounted to at least two of said planar surfaces.
  • the first heat sink with mounted electronic components may be combined with a second heat sink having radiating fins for additional cooling capacity.
  • this assembly would be done after the heat sink assembly with mounted electronic components was formed into its final configuration.
  • the second heat sink itself would be manufactured usually in an extrusion process in a similar configuration with planar surfaces corresponding to those of the first heat sink.
  • the second heat sink would normally be of a metallic, usually above 99% by weight aluminum, composition and would comprise a base plate structure having a plurality of fins protruding from one side of the base plate. The other side of the base plate would remain flat to insure good contact against the first heat sink on the side opposite the side to which the electronic components are affixed.
  • Such fins would usually be in groups to allow the base plate to be initially extruded or further bent into a configuration similar to the first base plate.
  • Figure 1 is a side view of a first embodiment of the present invention
  • Figure 2 is a side view of the embodiment of Figure 1 with an additional joined heat sink;
  • Figure 3 is a side view of a second embodiment of the present invention.
  • Figure 4 is a side view of the embodiment of Figure 3 with an additional finned heat sink;
  • Figure 5 is a side view of a third embodiment of the present invention.
  • Figure 6 is a side view of the embodiment of Figure 5 with an additional finned heat sink;
  • Figure 7 is a side view of a fourth embodiment of the present invention
  • Figure 8 is a side view of the embodiment of Figure 7 with additional finned heat sinks
  • Figure 9 is a side view of a fifth embodiment of the present invention.
  • a metal base plate is shown generally at 10 with button type diodes 18, 20 and 22 soldered thereto while base plate 10 is in a single planar configuration.
  • base plate 10 is formed or bent to comprise a multiple planar arrangement having planar surfaces 12, 14 and 16.
  • base plate 10 has been press fitted and joined with an additional finned heat sink 24.
  • Finned heat sink 24 comprises three planar surfaces 26, 28 and 30 which flushly contact, respectively, corresponding planar surfaces 12, 14 and 16 of base plate 10.
  • a planar base metal plate 40 is shown having outer planar surfaces 42, 44 and 46.
  • Electronic components shown as button diodes 48, 50 and 52 are mounted on the opposite sides of these planar surfaces. Preferrably such mounting is accomplished by a flow soldering operation while base metal plate 40 is in a single planar configuration.
  • base plate 40 is formed by bending into the three planar configuration shown.
  • Metal base plate 40 shown in Figure 4 is identical to base plate 40 shown in Figure 3. However, in the embodiment of the invention shown in Figure 4, base plate 40 has been press fitted into finned heat sink assembly 52.
  • Finned heat sink assembly 52 is usually of a metal composition, usually an aluminum extrusion.
  • Heat sink 52 includes planar surfaces 55, 57 and 59 which are flush mounted against corresponding planar surfaces 42, 44 and 46 of base plate 40. Separate groups of fins 54, 56 and 58 extend from heat sink 52 from the sides opposite planar surfaces, respectively, 59, 57 and 55.
  • base plate 40 and heat sink 52 are manufactured prior to their combination.
  • U-shaped base metal plate 62 and 64 are joined at their central planar portions 68 and 80 by a connection member 60.
  • Base plate 62 is comprised of three planar sections 66, 68 and 70.
  • Three electronic components shown as button diodes 72, 74 and 76 are affixed to the interior surface opposite outer faces 66, 68 and 70 of base plate 62.
  • Generally U-shaped base plate 64 is comprised of three planar surfaces 78, 80 and 82.
  • Electronic components shown as button diodes 84, 86 and 88 are affixed to the interior surfaces opposite base plate surfaces 78, 80 and 82.
  • Both base plate 62 and 64 initially comprised a single planar surface to which the electronic components are flow soldered. After such flow soldering, base plate 62 and 64 are bent to form their U-shaped configuration. After such forming, center section 60 is affixed, usually by soldering, to center sections 6a and 80 of, respectively, base plate 62 and 64.
  • Heat sink 92 comprises a generally U-shaped configuration having a plurality of fins 94 and 96 extending from the leg portions. Interior surfaces 98, 100 and 102 form a cavity to receive base plate 62. Guter surfaces 66, 68 and 70 of base plate 62 are in flush contact with the inner surfaces 98, 100 and 102 of the cavity of heat sink 92.
  • Heat sink 103 is of a general U-shape having interior surfaces 108, 110 and 112 forming a cavity therein.
  • a group of fins 104 protrudes from the leg portion of heat sink 103 opposite interior side 108, and a group of fins 106 protrudes from the leg portion of heat sink 103 opposite interior surface 112.
  • Interior surfaces 108, 110 and 112 of heat sink 103 are in flush contact with exterior faces 78, 80 and 82 of base plate 64.
  • Center structural component 61 is affixed to the exterior base wall 114 of heat sink 103 and exterior base surface 116 of heat sink 92 thereby joining base plate heat sink combination 62, 92 and base plate heat sink combination 64 and 103.
  • Base plate section 120 is comprised of outer surfaces 122, 124 and 126.
  • Electronic components shown as button diodes 128, 130 and 132 are soldered to the opposite sides of base plate surfaces, respectively, 122, 124 and 126.
  • the electronic components are flow soldered on to base plate 120 when the base plate is in a single planar configuration, with base plate 120 then being bent to form the three planar surfaces 122, 124 and 126.
  • the edges of surfaces 122 and 126 are affixed to sides of center section 134, usually by a soldering operation.
  • Center section 134 is shown as further comprising electronic components 136, 138 and 140.
  • the heat dissipation of base plates 120 and 142 is useful to transfer the heat from the electronic components mounted to center section 134.
  • U-shaped base plate section 142 is comprised of three planar surfaces 144, 146 and 148.
  • Electronic components shown as button diodes 150, 152 and 154 are affixed to the interior surfaces of base plate section 142 opposite, espectively, surfaces 144, 146 and 148.
  • Such components are flow soldered onto such surfaces when base plate section 142 is in a single planar arrangement, with base plate section 142 being bent to form planar sections 144, 146 and 148 after the affixing of the electronic components on the interior surface thereof.
  • the end edges of surfaces 144 and 148 are affixed, usually by soldering, to a side of center section 134.
  • FIG. 8 a combined heat sink and base plate assembly is shown generally at 155.
  • Such assembly includes base plates 120 and 142 joined by center section 134 as described above with reference to Figure 7.
  • a generally U-shaped heat sink 156 comprises leg sections 158 and 162 joined by center section 160.
  • Such sections form a cavity which is fitted around base plate section 120 such that base plate section 120 outer surfaces 122, 124 and 126 are in flush contact with the interior surface of leg sections 158 and 162 and center section 160 of heat sink 156.
  • Multiple fins 159 , 161 and 163 protrude from the exterior surfaces of, respectively, leg section 158, center section 160 and leg section 162 of heat sink 156.
  • Such heat sink 156 provides additional heat disipation for base plate 120 and the electronic components affixed thereto.
  • U-shaped heat sink 164 comprising leg sections 166 and 170 joined by center section 168 is also provided. These sections form a center cavity which is press fitfted such that the exterior surfaces 144, 146 and 148 of base plate section 142 are in flush contact with the interior surfaces of sections 166, 168 and 170.
  • a plurality of fins 167, 169 and 171 protrude from the exterior surfaces of leg section 166, center section 168 and leg section 170 of heat sink 164.
  • the fitting of heat sink 164 about base plate 142 provides additional heat dissipation for the electronic components connected to base plate 142.
  • a base plate 180 is of a general channel shape having legs 184 and 186 joined by a center section which includes a recessed portion 182.
  • Electronic components shown as button diodes 188, 190 and 192 are connected, respectively, to the interior surface of recessed section 182, leg section 184 and leg section 186.
  • Such electronic components are normally connected to base plate 180 when the base plate comprises a single planar configuration as such connection is done by a flow soldering technique.
  • Base plate 180 is then bent at about 90 degree angles to form end leg sections 184 and 186, and is further formed with two 90 degree bends near its center to form recess section 182. Shown within the cavity formed by legs 184 and 186 of base late 180 is base plate 200.
  • Base plate 200 is of a general U-shaped comprising leg sections 204 and 206 joined by a center section including recess portion 202.
  • Electronic components shown as button diodes 208, 210 and 212 are affixed to the interior surfaces of, respectively, recessed center section 202, leg section 204 and leg section 206.
  • the arrangement has shown in Figure 9 is to minimize the space taken by the six diode assembly, which is frequently connected to a single device such as an alternator to provide a rectifier circuit.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un puits thermique de composants électroniques comprend une plaque métallique de base (10) sur laquelle un ou plusieurs composants électroniques (18, 20 et 22) sont fixés. La plaque de base (10) se compose d'une pluralité de surfaces planes (12, 14 et 16) de sorte que chaque composant électronique (18, 20 et 22) est monté dans le même plan sur l'une des surfaces planes (12, 14 et 16). Les composants électroniques (12, 14 et 16) sont en général soudés à la plaque de base (10) lorsque celle-ci se trouve dans un seul plan. La plaque (10) est ensuite courbée pour former plusieurs surfaces (12, 14 et 16). Une seconde plaque (24) peut être montée dans le même plan contre la plaque de base (10). La seconde plaque (24) possède des surfaces planes (26, 28 et 30) correspondant à celles de la plaque de base formée (10). En général, la seconde plaque (24) possède également plusieurs ailettes (32, 34 et 36) qui s'étendent depuis son côté opposé au côté en contact avec l a plaque de base (10).
EP19850902399 1984-05-25 1985-05-06 Puits thermique plan multiple Withdrawn EP0181886A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61416684A 1984-05-25 1984-05-25
US614166 1984-05-25

Publications (1)

Publication Number Publication Date
EP0181886A1 true EP0181886A1 (fr) 1986-05-28

Family

ID=24460113

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19850902399 Withdrawn EP0181886A1 (fr) 1984-05-25 1985-05-06 Puits thermique plan multiple

Country Status (2)

Country Link
EP (1) EP0181886A1 (fr)
WO (1) WO1985005756A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8782850B2 (en) 2006-02-28 2014-07-22 Lg Electronics Inc. Vacuum cleaner

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5103375A (en) * 1990-02-05 1992-04-07 Motorola, Inc. Electronic module assembly and method of manufacture
JPH0564450A (ja) * 1991-08-30 1993-03-12 Mitsubishi Electric Corp 車両用交流発電機の整流装置
US5179501A (en) * 1992-02-24 1993-01-12 Motorola, Inc. Laminated electronic module assembly
US5406451A (en) * 1993-06-14 1995-04-11 Comaq Computer Corporation Heat sink for a personal computer
US5748445A (en) * 1996-08-27 1998-05-05 General Resources Corporation Heat sink and circuit enclosure for high power electronic circuits
DE10148668A1 (de) * 2001-10-02 2003-05-08 Bosch Gmbh Robert Gleichrichtereinrichtung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3187812A (en) * 1963-02-11 1965-06-08 Staver Co Heat dissipator for electronic circuitry
US3778650A (en) * 1972-10-10 1973-12-11 Briggs & Stratton Corp Battery charging regulator-rectifier module
JPS5565891A (en) * 1978-11-14 1980-05-17 Matsushita Electric Ind Co Ltd Radiating apparatus
DE2856194A1 (de) * 1978-12-27 1980-07-10 Bosch Gmbh Robert Lagereinrichtung fuer gleichrichterdioden bei elektrischen maschinen
GB2059569B (en) * 1979-09-12 1983-04-13 Racal Communications Equip Cooling apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO8505756A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8782850B2 (en) 2006-02-28 2014-07-22 Lg Electronics Inc. Vacuum cleaner

Also Published As

Publication number Publication date
WO1985005756A1 (fr) 1985-12-19

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Inventor name: OCKEN, ALFRED, G.

Inventor name: KOWIESKI, RAYMOND, J.