EP0216703A2 - Substrat conducteur et transparent pour élément photoélectrique - Google Patents
Substrat conducteur et transparent pour élément photoélectrique Download PDFInfo
- Publication number
- EP0216703A2 EP0216703A2 EP86402059A EP86402059A EP0216703A2 EP 0216703 A2 EP0216703 A2 EP 0216703A2 EP 86402059 A EP86402059 A EP 86402059A EP 86402059 A EP86402059 A EP 86402059A EP 0216703 A2 EP0216703 A2 EP 0216703A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- tin
- layer
- tin oxide
- thickness
- chlorine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 21
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910001887 tin oxide Inorganic materials 0.000 claims abstract description 21
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 16
- 239000000460 chlorine Substances 0.000 claims abstract description 16
- 150000003606 tin compounds Chemical class 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 9
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 7
- 150000002367 halogens Chemical class 0.000 claims abstract description 7
- 230000003647 oxidation Effects 0.000 claims abstract description 4
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 4
- 238000005979 thermal decomposition reaction Methods 0.000 claims abstract description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 3
- -1 HCl Chemical compound 0.000 claims description 2
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 claims description 2
- YMLFYGFCXGNERH-UHFFFAOYSA-K butyltin trichloride Chemical compound CCCC[Sn](Cl)(Cl)Cl YMLFYGFCXGNERH-UHFFFAOYSA-K 0.000 claims description 2
- PKKGKUDPKRTKLJ-UHFFFAOYSA-L dichloro(dimethyl)stannane Chemical compound C[Sn](C)(Cl)Cl PKKGKUDPKRTKLJ-UHFFFAOYSA-L 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QYFZCTDKWGVUIO-UHFFFAOYSA-N [Cl].[Sn] Chemical class [Cl].[Sn] QYFZCTDKWGVUIO-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
- H10F77/1692—Thin semiconductor films on metallic or insulating substrates the films including only Group IV materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
- C03C17/2453—Coating containing SnO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a substrate which is both conductive and transparent for a photoelectric element consisting for example of a glass plate coated with a conductive and transparent layer based on tin oxide, this element being usable in particular in cells or solar cells.
- solar cells having as photoelectric element a transparent conductive substrate coated with amorphous silicon a-Si and provided with aluminum electrodes. Such solar cells have a low photoelectric conversion rate and to improve it we have sought to make the substrate as conductive as possible by doping the tin oxide layer with fluorine.
- the present invention aims to solve this problem and to provide a transparent substrate, in particular made of glass, coated with a layer based on tin oxide, usable as a photoelectric element in particular in solar cells, and making it possible to '' achieve high photoelectric conversion rates, higher than those obtained with photoelectric elements whose tin oxide layer is doped with fluorine.
- a transparent substrate consisting of a support, in particular made of glass, coated with a conductive and transparent layer based on tin oxide obtained by thermal decomposition and oxidation in contact with the support brought to high temperature, d '' a tin compound containing chlorine but no other halogen, or a tin compound without chlorine but to which is added in addition another compound containing chlorine such as HCl, this conductive layer, based on tin oxide having a thickness at least equal to 0.7 micron.
- Tin compounds containing chlorine, and no other halogen than chlorine are however preferable to non-chlorine tin compounds to which a chlorine-containing compound such as HCl is added in addition.
- the C.V.D. method can be used. (Chemical Vapor Deposition) consisting in bringing a vapor of these compounds into contact with the heated support, the method of pyrolysis of solution consisting in spraying a solution of these compounds on the heated support, or any other method, in particular the method of pyrolysis powder.
- the C.V.D. method is preferably used, advantageous in particular for its flexibility of use and the quality of the deposit obtained.
- the transparent support, in particular the glass is then heated to a temperature of the order of 400 to 600 ° C.
- the expected thickness of the conductive layer of tin oxide is at least 0.7 micron, but preferably, to further improve the photoelectric conversion rate, it is of the order of 0.8 to 1.2 microns.
- Solar cells were produced on the one hand from conductive substrates according to the invention, on the other hand from conventional substrates and performance comparisons were made.
- soda-lime glass supports 25 mm x 30 mm, 1.1 mm thick are prepared, washed, dried and covered with a layer of silica, . then, they are coated with a transparent layer based on tin oxide to obtain the substrate according to the invention, by the CVD method, by sending on them, when they are heated to approximately 550 ° C., a gas consisting of monobutyl tin trichloride vapor (C4H9SnCl3), water vapor, oxygen and nitrogen.
- a gas consisting of monobutyl tin trichloride vapor (C4H9SnCl3), water vapor, oxygen and nitrogen.
- amorphous silicon solar cells by proceeding as follows: . a first thickness of silicon, p-type semiconductor, doped with boron (a-SiC: H) of about 0.015 micron in thickness, is deposited on the tin oxide layer, . a second thickness of silicon, of intrinsic semiconductor (a-Si: H) of approximately 0.5 micron is then deposited, .
- Si ( ⁇ C-Si) H monocrystalline of about 0.05 micron.
- a monosilane gas SiH4 is used as a raw material under a pressure of approximately 170 pa, distributed by a high frequency luminescent discharge device of the capacitive coupling type, .
- the aluminum electrodes (approximately 0.1 micron thick) are deposited, for example by the vacuum vaporization method (vacuum of the order of 10-4 pa). When these aluminum electrodes are produced, a cover is placed with holes 2 mm in diameter and solar cells with a diameter of 2 mm are thus produced.
- the batteries produced from substrates "A” have a better energy conversion rate than those manufactured from substrates "B".
- the electrical resistance is slightly lowered, due to the thickness on the one hand, and the fact that the size of the crystals formed is increased, which favorably modifies the surface condition of the layer, on the other hand.
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Surface Treatment Of Glass (AREA)
- Liquid Crystal (AREA)
Abstract
Description
- La présente invention concerne un substrat à la fois conducteur et transparent pour élément photoélectrique constitué par exemple d'une plaque de verre revêtue d'une couche conductrice et transparente à base d'oxyde d'étain, cet élément étant utilisable notamment dans des cellules ou piles solaires.
- Il existe des piles solaires ayant comme élément photoélectrique un substrat conducteur transparent revêtu de silicium amorphe a-Si et muni d'électrodes en aluminium. De telles piles solaires ont un faible taux de conversion photoélectrique et pour l'améliorer on a cherché à rendre le substrat le plus conducteur possible en dopant la couche d'oxyde d'étain à l'aide de fluor.
- On a ainsi obtenu une amélioration du rendement des piles solaires pour des épaisseurs de couches d'oxyde d'étain qui étaient classiquement inférieures à 0,6 micron.
- Pour encore abaisser la résistance électrique des couches d'oxyde d'étain dopées au fluor, on a tout logiquement augmenté leur épaisseur, mais il est apparu que le taux de conversion photoélectrique au lieu de s'améliorer encore, au contraire diminuait à partir d'une épaisseur de couche conductrice de l'ordre de 0,7 micron.
- La présente invention vise à résoudre ce problème et à fournir un substrat transparent, notamment en verre, revêtu d'une couche à base d'oxyde d'étain, utilisable en tant qu'élément photoélectrique en particulier dans des piles solaires, et permettant d'atteindre des taux de conversion photoélectrique élevés, supérieurs à ceux obtenus avec des éléments photoélectriques dont la couche d'oxyde d'étain est dopée au fluor.
- Pour cela, elle propose un substrat transparent constitué d'un support, notamment en verre, revêtu d'une couche conductrice et transparente à base d'oxyde d'étain obtenue par décomposition thermique et oxydation au contact du support porté à haute température, d'un composé d'étain contenant du chlore mais aucun autre halogène, ou d'un composé d'étain sans chlore mais auquel on ajoute en appoint un autre composé contenant du chlore tel que HCl, cette couche conductrice, à base d'oxyde d'étain ayant une épaisseur au moins égale à 0,7 micron.
- Les composés d'étain contenant du chlore, et aucun autre halogène que le chlore, sont toutefois préférables aux composés d'étain sans chlore auxquels on ajoute en appoint un composé contenant du chlore tel HCl.
- Comme composés d'étain utilisables et contenant du chlore, on peut citer :
C₄H₉SnCl₃
SnCl₄
(CH₃)₂SnCl₂ , etc... - Comme composés d'étain ne contenant pas de chlore, mais auxquels on peut adjoindre un autre composé contenant du chlore, on peut citer :
(CH2n+1)₄Sn avec n = 1, 2, 3 ou 4
(CH₃)₂SnH₂ , (C₄H₉)₃SnH
(CH₄H₉)₂Sn(COOCH₃)₂ , etc - Pour mettre ces composés d'étain en contact avec le support chauffé, et obtenir leur décomposition et leur oxydation, on peut utiliser la méthode C.V.D. (Chemical Vapor Deposition) consistant à mettre une vapeur de ces composés en contact avec le support chauffé, la méthode de pyrolyse de solution consistant à pulvériser une solution de ces composés sur le support chauffé, ou toute autre méthode, en particulier la méthode de pyrolyse de poudre.
- Parmi toutes ces méthodes, on utilise de préférence la méthode C.V.D., avantageuse en particulier pour sa souplesse d'utilisation et la qualité du dépôt obtenu. Le support transparent, notamment le verre, est alors chauffé à une température de l'ordre de 400 à 600°C.
- L'épaisseur prévue de la couche conductrice d'oxyde d'étain est au moins de 0,7 micron, mais de préférence, pour améliorer encore le taux de conversion photoélectrique, elle est de l'ordre de 0,8 à 1,2 microns.
- Un exemple de réalisation de l'invention sera maintenant décrit en détail en relation avec la figure unique jointe qui représente la variation du taux de conversion d'énergie de piles solaires à silicium amorphe utilisant des couches conductrices d'oxyde d'étain selon l'invention d'une part, classiques d'autre part, en fonction de l'épaisseur de ces couches.
- Des piles solaires ont été réalisées d'une part à partir de substrats conducteurs selon l'invention, d'autre part à partir de substrats classiques et des comparaisons de performances ont été faites.
- Pour réaliser ces piles solaires, on procède comme suit :
. on prépare des supports en verre sodo-calcique de 25 mm x 30 mm, de 1,1 mm d'épaisseur, on les lave, on les sèche et on les recouvre d'une couche de silice,
. ensuite, on les revêt d'une couche transparente à base d'oxyde d'étain pour obtenir le substrat selon l'invention, par la méthode C.V.D., en envoyant sur eux, lorsqu'ils sont chauffés à environ 550°C, un gaz constitué de vapeur de monobutyl trichlorure d'étain (C₄H₉SnCl₃), de vapeur d'eau, d'oxygène et d'azote. - En faisant varier le temps de dépôt sur 7 supports en verre, on a obtenu 7 épaisseurs différentes de couche d'oxyde d'étain : 0.20 - 0.39 - 0.59 - 0.7 - 0.8 - 0.98 et 1.15 microns. Ces supports ainsi revêtus d'une couche selon l'invention sont appelés les substrats "A".
- Pour faire des comparaisons, sur des supports en verre identiques, on dépose par C.V.D. des couches d'oxyde d'étain dopé au fluor en ajoutant au gaz utilisé pour réaliser les échantillons "A" un gaz fluoré : du 1.1-difluoroéthane.
- En faisant varier les temps de dépôt, on obtient 6 substrats "B" ayant les épaisseurs de couche d'étain dopé au fluor suivantes : 0.19 - 0.37 - 0.57 - 0.75 - 0.92 et 1.10 microns. Avec ces substrats "A" et "B" on fabrique des piles solaires au silicium amorphe en procédant comme suit :
. on dépose sur la couche d'oxyde d'étain une première épaisseur de silicium, semi-conducteur de type p, dopé au bore (a-SiC:H) de 0.015 micron d'épaisseur environ,
. on dépose ensuite une seconde épaisseur de silicium, de semi-conducteur intrinsèque (a-Si:H) de 0,5 micron environ,
. puis une troisième épaisseur dopée au phosphore, semi-conductrice de type n, Si(µC-Si):H monocristalline de 0.05 micron environ. On utilise pour cela comme matière première un gaz de monosilane SiH₄ sous une pression d'environ 170 pa, distribué par un dispositif de décharge luminescente à haute fréquence de type à couplage capacitif,
. ensuite on dépose les électrodes en aluminium (d'épaisseur environ 0.1 micron) par exemple par la méthode de vaporisation sous vide (vide de l'ordre de 10-⁴ pa). Au moment de la réalisation de ces électrodes en aluminium, on pose un cache ayant des trous de 2 mm de diamètre et on fabrique ainsi des piles solaires de 2 mm de diamètre. - En exposant les piles solaires ainsi obtenues à une lumière de 100 mW/cm² d'AM1, on mesure le taux de conversion d'énergie et on utilise ces résultats pour construire les courbes de la figure jointe.
- D'après cette figure, on remarque que lorsque l'épaisseur est supérieure à 0.7 micron, les piles fabriquées à partir des substrats "A" ont un meilleur taux de conversion de l'énergie que celles fabriquées à partir des substrats "B".
- On peut admettre que la transmission lumineuse obtenue avec des couches à base d'oxyde d'étain résultant d'un composé contenant du chlore, mais absolument aucun autre halogène et en particulier pas de fluor, soit meilleure que pour des couches d'oxyde d'étain dopées au fluor. Même si la résistance électrique d'une telle couche non dopée est plus faible que celle d'une couche dopée au fluor, du fait de la meilleure transmission de la lumière visible, le taux de conversion photoélectrique est amélioré.
- En outre pour des épaisseurs un peu élevées de la couche d'oxyde d'étain, supérieures à celles de l'ordre de 0.5 micron classiquement employées, et en particulier supérieures à 0.7 micron, la résistance électrique est un peu abaissée, du fait de l'épaisseur d'une part, et du fait que la taille des cristaux formés est augmentée, ce qui modifie de façon favorable l'état de surface de la couche, d'autre part.
Claims (6)
(CH2n+1)₄Sn avec n = 1, 2, 3 ou 4
(CH₃)₂SnH₂ , (C₄H₉)₃SnH
(CH₄H₉)₂Sn(COOCH₃)₂ .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT86402059T ATE71925T1 (de) | 1985-09-20 | 1986-09-19 | Leitfaehiges und durchsichtiges substrat fuer ein photoelektrisches element. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP208363/85 | 1985-09-20 | ||
| JP60208363A JPS6269405A (ja) | 1985-09-20 | 1985-09-20 | 光電素子用透明導電基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0216703A2 true EP0216703A2 (fr) | 1987-04-01 |
| EP0216703A3 EP0216703A3 (en) | 1989-04-26 |
| EP0216703B1 EP0216703B1 (fr) | 1992-01-22 |
Family
ID=16555049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP86402059A Expired - Lifetime EP0216703B1 (fr) | 1985-09-20 | 1986-09-19 | Substrat conducteur et transparent pour élément photoélectrique |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0216703B1 (fr) |
| JP (1) | JPS6269405A (fr) |
| AT (1) | ATE71925T1 (fr) |
| DE (1) | DE3683575D1 (fr) |
| ES (1) | ES2003352A6 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0290345A3 (en) * | 1987-05-07 | 1989-04-26 | Saint-Gobain Vitrage | Conductive layer for photovoltaic elements |
| WO1998047183A1 (fr) * | 1997-04-11 | 1998-10-22 | Robert Bosch Gmbh | Procede permettant de structurer des couches transparentes conductrices |
| US6602606B1 (en) * | 1999-05-18 | 2003-08-05 | Nippon Sheet Glass Co., Ltd. | Glass sheet with conductive film, method of manufacturing the same, and photoelectric conversion device using the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2853125B2 (ja) * | 1988-03-17 | 1999-02-03 | 日本板硝子株式会社 | 透明導電膜の製造方法 |
| CN104310790A (zh) * | 2014-09-28 | 2015-01-28 | 中国建材国际工程集团有限公司 | 大面积透明导电膜玻璃的制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5534668A (en) * | 1978-09-04 | 1980-03-11 | Toshiba Corp | Forming method for transparent conductive composite film |
| JPS59136477A (ja) * | 1982-12-23 | 1984-08-06 | Nippon Sheet Glass Co Ltd | 基体に酸化錫膜を形成する方法 |
| JPS59162269A (ja) * | 1983-03-07 | 1984-09-13 | Nippon Sheet Glass Co Ltd | 基体に酸化錫膜を形成する方法 |
-
1985
- 1985-09-20 JP JP60208363A patent/JPS6269405A/ja active Granted
-
1986
- 1986-09-19 EP EP86402059A patent/EP0216703B1/fr not_active Expired - Lifetime
- 1986-09-19 ES ES8602025A patent/ES2003352A6/es not_active Expired - Fee Related
- 1986-09-19 DE DE8686402059T patent/DE3683575D1/de not_active Expired - Fee Related
- 1986-09-19 AT AT86402059T patent/ATE71925T1/de not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0290345A3 (en) * | 1987-05-07 | 1989-04-26 | Saint-Gobain Vitrage | Conductive layer for photovoltaic elements |
| WO1998047183A1 (fr) * | 1997-04-11 | 1998-10-22 | Robert Bosch Gmbh | Procede permettant de structurer des couches transparentes conductrices |
| US6602606B1 (en) * | 1999-05-18 | 2003-08-05 | Nippon Sheet Glass Co., Ltd. | Glass sheet with conductive film, method of manufacturing the same, and photoelectric conversion device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0572686B2 (fr) | 1993-10-12 |
| ES2003352A6 (es) | 1991-03-16 |
| ATE71925T1 (de) | 1992-02-15 |
| DE3683575D1 (de) | 1992-03-05 |
| EP0216703A3 (en) | 1989-04-26 |
| EP0216703B1 (fr) | 1992-01-22 |
| JPS6269405A (ja) | 1987-03-30 |
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