Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
  • H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor

Definitions

• the field of art to which this invention pertains is mica containing laminate material.
• Mica containing articles have been used for many years as electrical insulation structures or for thermal insulation.
• such mica articles are structures formed by bonding mica sheeting with a bonding agent such as a nonsilicone or a silicone material.
• Such articles have good dielectric strength, heat stability and are relatively inexpensive.
• Such articles are used as supporting insulation, high temperature thermostats, control devices, strip heaters and baseboard heaters. In addition, they are also used for gaskets and spacers in other electrical appliances.
• these mica products are susce p t-ible to attack by moisture, do not offer the flexibility or conformability required for certain applications and in the past when the products were ribbed or corrugated, they lost a significant amount of their dielectric strength making them virtually unacceptable as electric insulating materials.
• the present invention is directed toward a relatively high density, corrugated, flexible, mica sheet comprising one or more mica papers layers which are impregnated with about 5 percent to about 25 percent by weight of a flexible, methyl-phenyl p olysi- loxane or likely flexible methyl polysiloxane binder which contains an organic monoalkoxy or neoalkoxy titanate and a metal naphthenate and which has been formed such that the density of the mica sheet is greater than about 1.5 g/cc.
• Such mica sheet is more moisture resistant, thermally stable, dimensionally stable,and stronger than prior corrugated mica products and retains substantially all of the dielectric strength the mica laminate possessed prior to corrugation.
• such a material is conformable and has improved machinability and punchability qualities.
• Another aspect of the invention is a method of forming such corrugated laminates by impregnating mica paper with about 5 percent to about 25 percent by weight of a flexible, methyl-phenyl polysiloxane or flexible methyl silicone binder which contains an organic, alkoxy or neoalkoxy titanate and a metal naphthenate, placing the impregnated paper or papers on top of each other and densifying and gelling to B-stage the binder under pressure and temperature to form a laminate or sheet which is then processed through a corrugating machine, resulting in a corrugated, highly flexible article which possesses high dielectric strength.
• the mica paper used to practice this invention may comprise any continuous, thin mica paper, however, those made from muscovite or phlogopite mica are preferred. Which material is selected depends on the properties desired in the end product. Typically, where high dielectric properties are desired, muscovite will be used, whereas, if high temperature properties are desired, the phlogopite is generally selected.
• the mica paper is typically in the form of conventional water-disintegrated, integrated mica paper which may be prepared using conventional techniques. The thickness of the mica paper characteristically ranges from about 1 mil to about 20 mils with about 5 mils being preferred.
• the binder which is used to form the mica laminate comprises any of the thermally cross-linkable flexible, methyl-phenyl silicone or methyl silicone polymer systems which are used to form other mica laminates.
• the selection of which system to use depends on the properties desired in the final laminate. Since many of the mica laminates find uses in high temperature environments above 359°F (180°C), it is preferred that the binder system used be thermally stable at these elevated temperatures.
• the preferred systems are the polysiloxane polymers which are conventionally used in this field.
• methyl-phenyl polysiloxane or flexible methyl polysiloxane which are available from Dow Corning Corporation, Midland, Michigan, as Dow Corning 997, Dow Corning 994 and General Electric resins SR-224, SR-165 and SR-32. It should be noted that the polysiloxane system used to practice this invention should not condense or outgas excessively while curing or gelling, for this may cause the formation of a defective laminate through the formation of blisters or voids in the laminate.
• Any compatible organic alkoxy or neoalkoxy titanate may be mixed with the polymer system in the range from about 1 percent to about 4 percent by weight of polymer solids with about 2 percent being preferred.
• the alkoxy titanates which are most useful are those which are soluble in the polymer system, i.e. methyl polysiloxane, and do not promote rapid cross-linking of the polymer which will shorten the shelf life of the system. Whether a particular alkoxy titanate causes too rapid cross-linking or not is dependent on the manufacturing process which is used to form the laminates. A manufacturing process which is fast, may tolerate a faster cross-linking process while a slower process will produce an inferior product.
• neoalkoxy titanates and neoalkoxy titanates are listed in Table I, with the preferred neoalkoxy titanate being neoalkoxy, tri(dioctylpyrophosphato) titanate and the preferred monoalkoxy titanate being Isopropyl tri(dioctylpyrophosphato) titanate.
• metal naphthenate driers are added to the base polymer in concentrations from about 0.5 percent to about 2 percent, by weight of the polymer, with about 1 percent being preferred.
• metallic soap driers are manganese naphthenate, zinc naphthenate, tin naphthenate, cobalt naphthenate, etc. It is believed that the addition of these naphthenate driers coupled with the titanate are what give these mica laminates their superior moisture resistant properties and the superior bonding of the mica platelets resulting in a structure which can be corrugated without severe loss of dielectric strength.
• a binder solution containing the above constituents to be applied to the mica paper is typically prepared as follows:
• Solvent is placed in a container in which the binder will be prepared.
• solvents are typically aromatic hydrocarbons in which all of the constituents are compatible such as toluene or xylene.
• the amount of solvent is not critical and is typically in the range of from about 40 percent to about 60 percent of the total weight of the solution.
• the titanate is then added to the solvent and is stirred until the titanate is dissolved and the solution is clear. Typically, this is done at ambient temperatures about 50°F (15°C) to about 85°F (30°C). While the stirring continues, the naphthenate drier is added to the solution and stirred until dissolved. Again, this is done at ambient temperatures. To this solution is then added the polysiloxane and the mixture is stirred until homogenous, typically for about one-hour to one hour at ambient temperatures. The polysiloxane is added in quantities such that the titanate and naphthenate will be in the proper concentrations of the final binder chemistry.
• the mica paper is removed from the roll and placed on a flat surface, i.e. a table, conveyer belt, etc., and the paper is impregnated with the binder by any conventional technique, i.e. dripping.
• the amount of the binder applied is such that the final laminate contains about 5 percent to about 25 percent by weight binder with the preferred being 5 to 15 percent and the application should be such that the binder is evenly distributed throughout the laminate.
• Other conventional impregnation techniques may be used to apply the binder to the paper such as dipping, or roll soaking, spraying, brushing, etc., and in certain processes, it may be desirable to coat both sides of the paper.
• the aromatic solvent present in the binder is then removed by exposing the impregnated paper to temperatures high enough to cause the solvent to evaporate, but not so high as to cause the polymer to polymerize. Typically, these temperatures are about 250°F (121°C) to about 275°F (135°C). Typically, this is done by passing the paper through an oven or exposing it to r d diant heat, etc.
• the solvent free paper is then cut into the desired size and stacked one on top of the other to the desired thickness.
• a single sheet of impregnated paper may be used if desired.
• Such thicknesses will typically vary from about 5 mils to about 62 mils or more.
• the number of layers required to achieve a given thickness will, of course, vary depending on the thickness of the mica paper, as well as the curing pressures.
• these precured laminates are made to allow for a loss in thickness after densification of about 10 percent to about 20 percent or possibly higher.
• the orientations of the sheets may be in any direction and is not critical.
• the stack is then placed in a press which is capable of generating pressures of between 50 psi to 1,000 psi or higher, and temperatures above about 300 * F (148.9° C ), wherein the heat and pressure uniformly distributes the resin throughout the laminate and also advances the cure of the resin system.
• the laminate is then cooled to about 100"F (37.8°C) while still under pressure and then removed from the press.
• the time required to advance the cure to an acceptable extent ranges from about fifteen minutes to several hours depending on the particular resin system used. It is not the object of this step to totally cure or cross-link the resin system, as this makes the laminate very stiff.
• a separator sheet typically of Teflon@ coated glass, is inserted between the stacks as they are placed in the press.
• a separator sheet typically of Teflon@ coated glass
• the preferred technique is to heat the platens through either electrical, steam, hot oil or other means to the desired temperature. It is desirable to have a release sheet or coating between the platens and the laminates to ensure an easy removal of the densified laminates from the press after curing.
• the process will entail slowly raising the laminate to the maximum densification conditions which will allow for any outgassing of the material prior to final densification. This can be done in a step-wise manner or by gradually increasing the temperature and pressure.
• the cycle should not allow the polysiloxane binder to B-stage prematurely, preventing the laminate from being fully densified, resulting in an inferior product.
• these parameters can be controlled by conventional electrical or computer control systems which would interface with the press.
• the B-staged laminates are then passed through a conventional corrugating machine to corrugate the laminate and thereby add the flexibility desired in these products.
• These machines can be typical paper or cardboard corrugating machines with conventional corrugating rollers.
• One precaution that should be noted is that the corrugations should not be so deep as to sever or nearly sever the mica laminate thereby weakening it, and reducing not ony its structural integrity but its moisture resistance and dielectric strength as well.
• the particular corrugation equipment used to prepare these samples contains two pinch rollers having corrugating rows about 0.086 to about 0.090 inch apart and about 0.070 of an inch deep.
• the process and products should not be so limited. For instance, with thicker laminates, it may be desirable to space the corrugations wider and possibly deeper than with a thinner product.
• the mica laminates formed using the present invention typically range in thicknesses from about 10 mils to about 1/4 inch and have densities of about 1.5 g/cc to about 2.0 g/cc.
• a typical mica laminate was prepared from two sheets of 5 mils muscovite mica paper which had been impregnated with 10 percent of the polysiloxane binder GE SR-224 containing 2 percent of monoalkoxy, isopropyl tri(dioctylpyrophosphato) titanate and 1 percent zinc naphthenate containing 8 percent zinc (Nuodex Products Div.).
• the impregnated paper was then stacked, two plies of 5 mils one on top of the other, placed between release sheets in the press, and B-staged for fifteen minutes at 350°F (177°C) and 100 psi.
• the laminate was then allowed to cool to below 100°F (37.8 * C) while under pressure and then removed from the press.
• the release sheets were then removed from the laminate and the laminate was then passed through a corrugating machine affixed with rollers having 92 rows of ridges 0.086 inch apart and making indentations about .067 inch deep.
• the mica laminates prepared using the present method have remarkable and surprisingly different properties than other corrugated mica laminates produced in the past.
• the present laminates are well bonded and have significantly greater mechanical and dielectric strength.
• Such novel laminates again, will allow for their use in many new and novel applications,as well as those conventional applications described earlier in the Background.

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• Chemical & Material Sciences (AREA)
• Inorganic Chemistry (AREA)
• Laminated Bodies (AREA)
• Insulating Bodies (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

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Cited By (2)

Citations (3)

• 1986
  • 1986-09-29 EP EP19860630149 patent/EP0217726A1/de not_active Withdrawn
  • 1986-09-29 BR BR8604682A patent/BR8604682A/pt unknown
  • 1986-09-30 JP JP23313186A patent/JPS6287336A/ja active Pending

Patent Citations (3)

Non-Patent Citations (1)

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