EP0222276A2 - Tête de mesures ultrasoniques - Google Patents

Tête de mesures ultrasoniques Download PDF

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Publication number
EP0222276A2
EP0222276A2 EP86115116A EP86115116A EP0222276A2 EP 0222276 A2 EP0222276 A2 EP 0222276A2 EP 86115116 A EP86115116 A EP 86115116A EP 86115116 A EP86115116 A EP 86115116A EP 0222276 A2 EP0222276 A2 EP 0222276A2
Authority
EP
European Patent Office
Prior art keywords
test head
ultrasonic test
head according
sound
lamellae
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP86115116A
Other languages
German (de)
English (en)
Other versions
EP0222276A3 (fr
Inventor
Wolfgang Dr. Gebhardt
Helmut Woll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Publication of EP0222276A2 publication Critical patent/EP0222276A2/fr
Publication of EP0222276A3 publication Critical patent/EP0222276A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
    • B06B1/0685—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements

Definitions

  • the invention relates to an ultrasonic test head with an oscillating crystal arrangement, on the side of which is opposite the sound emission direction, a damping body is arranged.
  • Such an ultrasonic test head is known for example from DE-AS 22 17 472.
  • the known ultrasonic test head has a transducer made of lithium sulfate or a similar crystal and a damping body made of a hardenable synthetic resin to which metal powder has been added in order to increase the specific impedance of the casting resin.
  • the powdered heavy metal additive is tungsten.
  • the invention has for its object to provide an ultrasonic test head with a damping body, which is characterized by a high acoustic impedance and high acoustic absorption and ease of manufacture.
  • the damping body consists of a plurality of alternately packed sound-conducting and sound-absorbing lamellae, which are coupled to the oscillating crystal arrangement on one side of the lamella edges.
  • the sound-conducting lamellae consist of lead platelets with a wedge-shaped cross section, the thickness at the wedge base being approximately 1.5 mm. Teflon wedges with a thickness of 1.5 mm at the base are arranged between the lead plates, which are wedge-shaped in cross section. All layers are glued together and additionally pressed together by clamps to increase the mechanical stability. Because the sound-conducting wedges consist of lead, it is possible to solder them to the electrodes of the oscillating crystal arrangement in order to further improve the acoustic properties compared to cementing or gluing.
  • the damping body according to the invention can be designed for any conceivable geometry of the oscillating crystal arrangement, in particular also for array ultrasound probes.
  • the test head shown in simplified perspective in FIG. 1 without its housing has a piezo plate 1 as an oscillating crystal arrangement, which can be excited to oscillate with the aid of high-frequency electrical signals.
  • the electrical lines for supplying the excitation voltage are not shown in FIG. 1, just like the electrode surfaces provided on both sides of the piezo plate 1 in the usual way.
  • a damping body 2 is fixed by gluing, kitting or soldering, which has a high specific acoustic impedance in order to achieve that the difference in acoustic impedances of the piezo plate 1 and the damping body 2 is as small as possible is to a big band to achieve the width of the ultrasonic probe.
  • the damping body 2 is also highly absorbent, in order to ensure that a wave which starts from the piezo plate 1 and runs into it does not produce any disturbing echoes.
  • the damping body 2 consists of several sound-conducting lamellae 3, which are glued, cemented or soldered along their narrow sides 4 to the top of the piezo plate 1.
  • Sound-absorbing slats 5 are provided as damping layers between the sound-conducting slats 3 made of lead, steel, brass, zinc or another metal.
  • the sound-absorbing lamellae 5 consist of Teflon, silicone rubber, rubber, PVC, casting resin or a plastic adhesive.
  • Typical dimensions for the damping body 2 are 1 to 4 cm for the thickness, 1 to 6 cm for the length and 1 to 4 cm for the width.
  • the thickness of the sound-conducting lamellae 3 is 0.5 to 5 mm and in particular approximately 1.5 mm.
  • the thickness of the sound-absorbing slats 5 is in the same range.
  • the sound-conducting lamellae 3 and the sound-absorbing lamellae 5 can be held together to increase the mechanical stability in a manner not shown in the drawing with the aid of a clamp-like clamping device.
  • the clamp-like clamping device can, for example, consist of two plates, which form the lower and the upper plate for the stack of the lamellae 3, 5 and which with the aid of Threaded rods are screwed together.
  • the entire arrangement can be cast into a metallic housing which projects with its lower edge over the underside of the piezo plate 1.
  • the intermediate space thus formed can accommodate a protective layer, in particular a plate made of glass, in a manner also not shown in the drawing, which prevents damage to the piezo plate 1 when the ultrasonic test head is moved on a rough surface.
  • the broadband nature of the ultrasonic test head is determined by the specific acoustic impedance of the lamellae 3, 5 arranged essentially perpendicular to the piezo plate 1.
  • the impedance depends on the one hand on the lamella material and on the other hand on the lamella thickness.
  • the vibration of the piezo plate 1 excites plate waves in the sound-conducting lamellae 3, which are damped by the sound-absorbing lamellae 5.
  • a beveling of the sound-conducting fins 3 further reinforces this effect, which is why FIGS. 2, 4 and 7 represent particularly advantageous profiles for the sound-conducting fins 3.
  • the slat thickness By selecting the slat thickness, it is possible to vary the speed of sound and thus the specific acoustic impedance of the damping body 2 by almost a factor of 2. By using different lamella materials, practically any required specific acoustic impedance can be realized in order to increase the bandwidth.
  • FIG. 2 shows a damping body 2 whose sound-conducting lamellae 3 do not have a constant thickness, like the sound-conducting lamellae 3 of the exemplary embodiment according to FIG. 1, but a thickness that decreases toward the upper edge 6.
  • the damping layers or sound-absorbing slats 5 present between the sound-conducting slats 3 have a complementary shape and can in particular be produced by pouring out the intermediate spaces.
  • the spaces between the sound-conducting fins 3 can also contain sound-absorbing fins 5, in which tungsten powder is embedded.
  • Damping body 2 with the basic structure discussed above can be applied not only to the back of a piezo plate 1 serving as an individual oscillator, but also to other oscillating crystal arrangements.
  • Fig. 3 an embodiment of the invention is shown schematically in a plan view, which shows how below the damping body 2 with a plurality of sound-conducting fins 3 and a plurality of sound-absorbing fins 5 at right angles to the fins 3, 5 piezo rods 7 instead of the piezo plate 1 are arranged.
  • the piezo sticks 7 can be produced in particular by subsequent processing of the piezo plate 1.
  • Fig. 3 thus illustrates that the damping body 2 composed of lamellae 3, 5 can also be used in a linear group radiator.
  • Figures 4, 5 and 6 also show a lamellar damping body 2 in a schematic representation.
  • 4 shows sound-conducting slats 3 with a wedge-shaped cross section.
  • the sound-conducting lamellae 3 preferably made of lead, are soldered to the piezo plate 1 or another piezoceramic. While the sound-conducting slats 3 do not touch each other in the exemplary embodiments shown in FIGS. 1 to 3, this is the case at the base 8 in the exemplary embodiment shown in FIG. 4.
  • the sound-absorbing slats 5 can be Teflon wedges glued to the sound-conducting slats 3, the thickness of which is 1.5 mm at the upper edge, if the sound-conducting wedges formed by the sound-conducting slats 3 also have a thickness of 1.5 at the base mm.
  • FIG. 5 shows a side view of the damping body 2 and the piezo plate 1 in order to illustrate the geometric relationships of the damping body 2, the dimensions of which have already been given above.
  • FIG. 6 shows a schematic top view of the ultrasound probe from the top.
  • the sound-conducting slats 3 end in cutting edges 10 in order to avoid reflections as far as possible.
  • FIGS. 7, 8 and 9 A further exemplary embodiment of an ultrasound test head is shown schematically in FIGS. 7, 8 and 9, which has a damping body 2 with a lamella arrangement.
  • FIGS. 7 to 9 the same reference numerals have been used for corresponding parts as for the embodiments already discussed.
  • sawtooth-shaped sound-conducting lamellae 3 and corresponding sawtooth-shaped sound-absorbing lamellae 5 are used.
  • the sawtooth-shaped lamellae 3, 5 in cross section have a rectangular shape, as can be seen in FIG. 9, which represents a side view.
  • FIG. 8 illustrates the position of the cutting edges 10, into which the sound-conducting lamellae 3 run upwards.
  • the damping body 2 can of course be designed for any conceivable geometry of the oscillating crystal arrangement or the piezoceramic.
  • a lamellar damping body 2 is particularly well suited for mosaic-like array ultrasound probes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
EP86115116A 1985-11-15 1986-10-31 Tête de mesures ultrasoniques Withdrawn EP0222276A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3540610 1985-11-15
DE19853540610 DE3540610A1 (de) 1985-11-15 1985-11-15 Ultraschallpruefkopf

Publications (2)

Publication Number Publication Date
EP0222276A2 true EP0222276A2 (fr) 1987-05-20
EP0222276A3 EP0222276A3 (fr) 1988-09-28

Family

ID=6286117

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86115116A Withdrawn EP0222276A3 (fr) 1985-11-15 1986-10-31 Tête de mesures ultrasoniques

Country Status (4)

Country Link
US (1) US4751420A (fr)
EP (1) EP0222276A3 (fr)
JP (1) JPS62125798A (fr)
DE (1) DE3540610A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105733147A (zh) * 2014-12-26 2016-07-06 财团法人纺织产业综合研究所 可挠性吸音复合膜

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4007631A1 (de) * 1989-03-16 1990-09-20 Fraunhofer Ges Forschung Ultraschallpruefkopf
JPH0538563U (ja) * 1991-10-25 1993-05-25 株式会社トキメツク 二振動子探触子
GB9126082D0 (en) * 1991-12-06 1992-02-05 Nat Res Dev Acoustic non-destructive testing
IL105085A0 (en) * 1993-03-17 1993-08-18 S T M System Testing Materials Method and device for revealing defects in materials and their connections
US5433102A (en) * 1993-03-23 1995-07-18 Pedziwiatr; Edward A. Ultrasonic wave energy detection and identification
US5486734A (en) * 1994-02-18 1996-01-23 Seyed-Bolorforosh; Mir S. Acoustic transducer using phase shift interference
US5648942A (en) * 1995-10-13 1997-07-15 Advanced Technology Laboratories, Inc. Acoustic backing with integral conductors for an ultrasonic transducer
US5855049A (en) * 1996-10-28 1999-01-05 Microsound Systems, Inc. Method of producing an ultrasound transducer
US6043590A (en) * 1997-04-18 2000-03-28 Atl Ultrasound Composite transducer with connective backing block
US6266857B1 (en) 1998-02-17 2001-07-31 Microsound Systems, Inc. Method of producing a backing structure for an ultrasound transceiver
US6467138B1 (en) 2000-05-24 2002-10-22 Vermon Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same
DE20215843U1 (de) 2002-10-15 2003-01-16 Rammax Maschinenbau GmbH, 72555 Metzingen Bodenverdichtungsvorrichtung
US7105986B2 (en) * 2004-08-27 2006-09-12 General Electric Company Ultrasound transducer with enhanced thermal conductivity
US8127612B2 (en) * 2008-08-25 2012-03-06 Praxair Technology, Inc. System and method for ultrasonic examination of threaded surfaces
JP2010144868A (ja) * 2008-12-19 2010-07-01 Ihi Corp 弾性くさびダンパ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB869582A (en) * 1957-08-19 1961-05-31 Chirana Praha Mechanical damping member for an electroacoustic transducer
GB1086640A (en) * 1963-12-16 1967-10-11 Nat Res Dev Damping backing for piezo-electric crystal or transducer
DE2217472B2 (de) * 1972-04-12 1979-06-13 Krautkraemer, Gmbh, 5000 Koeln Verfahren zur Herstellung von Dämpfungskörpern für Ultraschall-Prüfköpfe
US3794866A (en) * 1972-11-09 1974-02-26 Automation Ind Inc Ultrasonic search unit construction
US3995179A (en) * 1974-12-30 1976-11-30 Texaco Inc. Damping structure for ultrasonic piezoelectric transducer
DE2926182A1 (de) * 1979-06-28 1981-01-22 Siemens Ag Ultraschallwandleranordnung
US4507582A (en) * 1982-09-29 1985-03-26 New York Institute Of Technology Matching region for damped piezoelectric ultrasonic apparatus
DE3483174D1 (de) * 1983-06-07 1990-10-18 Matsushita Electric Industrial Co Ltd Ultraschallsende mit einem absorbierenden traeger.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105733147A (zh) * 2014-12-26 2016-07-06 财团法人纺织产业综合研究所 可挠性吸音复合膜

Also Published As

Publication number Publication date
DE3540610C2 (fr) 1987-10-01
US4751420A (en) 1988-06-14
EP0222276A3 (fr) 1988-09-28
DE3540610A1 (de) 1987-05-21
JPS62125798A (ja) 1987-06-08

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