EP0224937B1 - Aufbau eines Wärmetintendüsen-Druckkopfes - Google Patents

Aufbau eines Wärmetintendüsen-Druckkopfes Download PDF

Info

Publication number
EP0224937B1
EP0224937B1 EP19860116956 EP86116956A EP0224937B1 EP 0224937 B1 EP0224937 B1 EP 0224937B1 EP 19860116956 EP19860116956 EP 19860116956 EP 86116956 A EP86116956 A EP 86116956A EP 0224937 B1 EP0224937 B1 EP 0224937B1
Authority
EP
European Patent Office
Prior art keywords
ink
thin film
film resistor
heater elements
elongated slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP19860116956
Other languages
English (en)
French (fr)
Other versions
EP0224937A2 (de
EP0224937A3 (en
Inventor
Samuel A. Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25193745&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP0224937(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0224937A2 publication Critical patent/EP0224937A2/de
Publication of EP0224937A3 publication Critical patent/EP0224937A3/en
Application granted granted Critical
Publication of EP0224937B1 publication Critical patent/EP0224937B1/de
Expired legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17503—Ink cartridges
    • B41J2/17513—Inner structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14024—Assembling head parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14145—Structure of the manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14387—Front shooter

Definitions

  • This invention relates to a thermal ink jet print head assembly and a method for making the same.
  • a plurality of electrically resistive elements is provided on a common thin film substrate for the purpose of heating a corresponding plurality of adjacent ink reservoirs during the ink ejection and printing process.
  • the adjacent ink reservoirs are typically provided as cavities in a barrier layer above the substrate for properly concentrating thermal energy emanating from the resistive elements to predefined volumes of ink.
  • a plurality of ink ejection orifices are provided above these cavities and provide exit paths for ink during the printing process.
  • a further disadvantage of using a plurality of ink flow channels in a common substrate is that they normally require a special routing of conductive leads on the substrate surface. In addition to the added costs associated with this special routing, this requirement also greatly reduces the achievable packing density because of the surface area required to accomodate such special routing schemes.
  • the general problem of this invention is to provide a new and improved ink jet printhead assembly and a method for fabricating the same, which eliminate the above problems associated with the use of drilled holes through a common printhead substrate member particularly to avoid different pressure drops in the ink flow paths.
  • a single elongated slot is cut in the substrate and provides ink flow to a plurality of ink reservoirs associated with resistive heater elements formed above the top surface of the substrate. These heater elements are spaced around the periphery of the slot at predetermined distances therefrom.
  • Conductive leads are provided on the substrate between each resistive heater element and external electrical connections, and a barrier layer and orifice plate member covers all of the resistive heater elements and defines a plurality of individual ink reservoirs repectively above each of the resistive heater elements.
  • the above described slotted geometry structure greatly increases the packing density of heater resistors on the common printhead substrate.
  • This increase in packing density is partially a result of the fact that, in the prior art multiple hole printhead structures, the conductive traces to the individual resistor elements had to be routed around the holes, thus increasing the required substrate area.
  • a packing density increase of 8:1 to 10:1 may be achieved.
  • the substrate is die bonded to a header manifold member.
  • This manifold member has an elongated slot therein for passing ink from a well section of the header manifold and through the substrate slot to the individual reservoirs of the barrier layer and orifice plate member.
  • An important advantage of a printhead assembly of the present invention is an improved packing density for the heater resistors and their associated ink jet orifices and reservoirs.
  • Another advantage is that according to the method of the invention the printhead assembly is realized by using latest state-of-the-art semiconductor processing techniques.
  • Still a further advantage of this invention is the provision of improved control of ink flow pressures from a common ink supply source and through a single slot in a thin film resistor structure and then through a common ink flow path simultaneously to a plurality of ink reservoirs in the printhead assembly.
  • Figure 1A is an isometric view of the slotted thin film resistor die (substrate) used in a preferred embodiment of the invention.
  • Figure 2 is an exploded view showing the die placement, the external lead attachment, and the orifice plate attachment steps used in fabricating the complete thermal ink jet printhead assembly in a preferred embodiment of the invention.
  • Figures 3A and 3B are fragmented and greatly enlarged plan and cross section views respectively, of the novel slot and lateral ink feed sections of the above printhead structure.
  • FIG. 1 there is shown a thin film resistor substrate 10 for a thermal ink jet printer and including a metal orifice plate 12 thereon.
  • the orifice plate 12 is typically constructed of nickel and includes a plurality of ink ejection openings or nozzles 14 spaced uniformly around the edges of an ink feed slot 16 indicated by the dotted lines in Figure 1.
  • the thin film resistor substrate 10 will be mounted on the top, I-beam shaped surface 18 of a header manifold 20.
  • the header manifold 20 will include an ink reservoir (not shown) within the confines thereof which communicates with an ink feed slot 22.
  • the slot 22 is aligned with the ink feed slot 16 in the thin film resistor substrate 10.
  • the header manifold 20 further includes contoured walls 24 which have been shaped to match corresponding contoured walls of an ink jet printer carriage assembly (not shown) for receiving the printhead structure of Figure 2 when completely assembled.
  • the thin film resistor substrate 10 is positioned directly on the upper surface 18 of the header 20, and a flexible, tape automated bond (TAB) circuit 26 is brought into electrical contact with conductive traces on the top surface of the thin film resistor substrate 10.
  • TAB tape automated bond
  • a plurality of thin conductive leads 28 overlie the contoured side walls 24 of the header 20, and the interior leads 30 of the tab bond flex circuit 26 are thermocompression bonded to conductive traces on the thin film resistor substrate 10.
  • the orifice plate 12 will be brought into alignment with the thin film resistor substrate 10 by means of an orifice plate and barrier layer manufacturing process.
  • the thin film resistor substrate 10 will typically include a silicon substrate 32 upon which is deposited a thin layer 34 of silicon dioxide for passivating and insulating the surface of the silicon substrate 32.
  • a plurality of heater resistors 36 and 38 are formed on the upper surface of the silicon dioxide layer 34 and will typically be either tantalum aluminum or tantalum pentoxide and fabricated using known photolithographic masking and etching techniques.
  • Aluminum trace conductors 40 make electrical contact to the heater resistors 36 and 38 for providing electrical pulses thereto during an ink jet printing operation, and these conductors are formed from a layer of aluminum previously evaporated on the upper surface of the silicon layer 34 using conventional metal evaporation processes.
  • a surface barrier layer 42 typically of silicon carbide or silicon nitride, is deposited over the upper surfaces of the conductors 40 and the heater resistors 36 and 38 to protect these members from cavitation wear and the ink corrosion which would otherwise be caused by the highly corrosive ink located in the reservoirs directly above these heater resistors.
  • the silicon carbide layer 42, as well as the previously identified S i O2 surface layer 34, resistors 36 and 38 and aluminum conductors 40 are all formed using semiconductor processes well known to those skilled in thermal ink jet and semiconductor processing arts and for that reason are not described in detail herein. However, for a further detailed discussion of such processes, reference may be made to the above Hewlett Packard Journal , Volume 36, Number 5, May 1985.
  • a nickel orifice plate 44 is positioned as shown on top of the silicon carbide layer 42 and includes ink reservoir areas 46 and 48 located directly above the heater resistors 36 and 38 for receiving ink therein by way of the horizontal slot 16.
  • These ink reservoirs 46 and 48 extend vertically upward of the substrate 10 as shown and merge into the output ink ejection orifices defined by the convergent contoured walls 50 and 52.
  • These contoured walls 50 and 52 have been designed to reduce cavitational wear and prevent "gulping" during an ink jet printing operation as described in more detail in the above identified copending Chan et al. application.
  • ink will flow along the path indicated by the arrow 54 and laterally along the path 56 and into the ink flow ports 58, 60, 62, 64, 66 and 68 as identified on the left-hand portion of the structure of Figures 3A and 3B.
  • ink will enter the ink flow ports 70 , 72, 74, 76, 78 and 80 on the right-hand portion of the structure of Figure 3B.

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (7)

  1. Dynamische Tintenstrahldruckkopf-Anordnung mit
    a) einem Unterlagenteil (10; 32) mit einem langgestreckten Schlitz (16) zum Aufnehmen von Tinte über ein gemeinsames Tintenreservoir, wobei das Unterlagenelement (10) zum Schaffen einer Tintenspeisung an einem Kopfteil (20) mit einem Tintenspeiseschlitz (22) angebracht ist, der mit dem langgestreckten Schlitz (16) des Unterlagenteiles (10; 32) zum Schaffen einer Tintenströmung zum langgestreckten Schlitz (16) ausgerichtet ist,
    b) mehreren Widerstandsheizelementen (36, 38), die um den Umfang des langgestreckten Schlitzes (16) in vorbestimmten Abständen davon gruppiert und mit einer entsprechenden Zahl von Leitern (40) oberhalb der Oberfläche des Unterlagenteils verbunden sind, und
    c) einer Sperrschicht- und Düsenöffnungs-Platte (12; 44), welche oberhalb der Leiter (40) angeordnet ist und eine Vielzahl von Tintenstrahlreservoiren (46, 48) zum Aufnehmen von Tinte aus dem langgestreckten Schlitz (16) aufweist, wobei die Reservoire (46, 48) auf die Widerstandsheizelemente (36, 38) ausgerichtet und mit einer Vielzahl von Düsenaustrittsöffnungen (14; 50, 52) versehen sind, welche Wärmeenergie aus den Heizelementen (36, 38) aufnehmen und Tinte auf ein gewähltes Druckmedium aussprühen, wobei die Reservoire (46, 48) sämtlich um vorbestimmte Tintenströmungsweg-Abstände von dem langgestreckten Schlitz (16) entfernt gelegen sind, wodurch die Druckverluste der Flüssigkeitsströmung zwischen den Reservoiren (46, 48) und dem Schlitz (16) ausgeglichen werden.
  2. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß
    a) das Unterlagenteil als Dünnfilm-Widerstandselement (10; 32) gestaltet ist, wobei sich der langgestreckte Schlitz (16) darin von einer Hauptfläche zur anderen erstreckt und die Widerstandsheizelemente (36, 38) gleichförmig um den Umfang des langgestreckten Schlitzes (16) erstrecken;
    b) ein leitendes Leiterrahmenteil (26) gleichförmig auf das Dünnfilm-Widerstandselement (10; 32) gebondet ist, um elektrische Verbindungen zu den Widerstandsheizelementen (36, 38) herzustellen, wobei sich das Leiterrahmenteil seitlich von den Widerstandsheizelementen (36, 38) in gleicher Ebene weg erstreckt,
    c) die Düsenöffnungsplatte (12; 44) auf dem Dünnfilmwiderstandselement (10; 32) befestigt ist, wobei die Tintenreservoire (46, 48) und Düsenaustrittsöffnungen (14; 50, 52) mit den Widerstandsheizelementen (36, 38) zur Aufnahme von Wärmeenergie von diesen bei einem Tintenstrahldruckvorgang ausgerichtet sind, und
    d) das Kopfteil ein isolierendes Kopfelement (20) aufweist, wobei der darin vorgesehene langgestreckte Schlitz (22) gleiche Breiten- und Längenabmessungen wie diejenigen des langgestreckten Schlitzes (16) im Dünnfilmwiderstandselement (10) aufweist, wobei die genannten Elemente so miteinander verklebt sind daß die langgestreckten Schlitze (16, 22) im Dünnfilm-Widerstandselement und im Kopfelement aufeinander ausgerichtet sind und einen Tintenströmungsweg von einer gemeinsamen Tintenquelle zu den Reservoiren (46, 48) in der Düsenöffnungsplatte (12) schaffen und die leitenden Leiterbahnen (30) des Leiterrahmens (26) entsprechend der Oberflächengestalt des Kopfteiles (20) konturiert sind wodurch die Packungsdichte der Widerstandsheizelemente (36, 38) auf dem Dünnfilm-Widerstandselement maximiert ist.
  3. Verfahren zum Herstellen einer thermischen Tintenstrahldruckkopfanordnung mit einem Dünnfilm-Widerstandselement (10) enthaltend mehrere Tintenreservoire (46, 48) und zugeordnete Dünnfilm-Widerstandsheizelementen (36, 38) zum thermischen Treiben der Reservoire sowie einer Düsenöffnungsplatte (12) auf dem genannten Element (10) zum Austreiben von Tinte bei Aufnahme von Wärmeenergie von den Widerstandsheizelementen (36, 38), dadurch gekennzeichnet, daß ein langgestreckter Schlitz (16) in dem Dünnfilm-Widerstandselement (10) benachbart den Reservoiren (46, 48) eingebracht wird, um Tinte von einer gemeinsamen Tintenquelle (22) und durch den Schlitz (16) sowie über einen gemeinsamen Tintenströmungsweg (54, 56) zu allen Reservoiren gleichzeitig strömen zu lassen.
  4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß
    die besagten Widerstandsheizelemente (36, 38) gleichförmig mit vorbestimmten Abständen um den langgestreckten Schlitz (16) gruppiert werden,

    elektrische Kontakte zu den Widerstandsheizelementen (36, 38) hergestellt werden und

    das Dünnfilm-Widerstandselement (10) auf einem isolierenden Kopfteil (20) mit einem fluchtenden Tintenspeiseschlitz (22) befestigt ist, um Tinte zu dem langgestreckten Schlitz (16) in dem Dünnfilm-Widerstandselement (10) zu speisen.
  5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, daß

    elektrische Kontakte durch Bonden mehrerer leitender Leiterbahnen (28) in elektrischem Kontakt mit den Widerstandsheizelementen (36, 38) in der Ebene der Elemente an der Oberfläche des Dünnfilm-Widerstandselementes (10) hergestellt werden, und

    das Dünnfilm-Widerstandselement (10) auf das isolierende Kopfteil (20) gebondet wird, wobei der Tintenspeiseschlitz (22) Breiten- und Längenabmessungen gleich denjenigen des langgestreckten Schlitzes (16) in dem Dünnfilm-Widerstandselement (10) aufweist.
  6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, daß die leitenden Leiterbahnen (28) längs abfallender Oberflächen des isolierenden Kopfteils (20) weitergeführt werden.
  7. Verfahren nach einem der Ansprüche 3 bis 6, dadurch gekennzeichnet, daß der Schlitz (16) durch Schneiden eines Siliziumsubstrates (10) mittels eines Diamantsägeblattes hergestellt wird.
EP19860116956 1985-12-06 1986-12-05 Aufbau eines Wärmetintendüsen-Druckkopfes Expired EP0224937B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80629485A 1985-12-06 1985-12-06
US806294 1985-12-06

Publications (3)

Publication Number Publication Date
EP0224937A2 EP0224937A2 (de) 1987-06-10
EP0224937A3 EP0224937A3 (en) 1988-11-17
EP0224937B1 true EP0224937B1 (de) 1991-11-21

Family

ID=25193745

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19860116956 Expired EP0224937B1 (de) 1985-12-06 1986-12-05 Aufbau eines Wärmetintendüsen-Druckkopfes

Country Status (5)

Country Link
EP (1) EP0224937B1 (de)
JP (1) JPH0773915B2 (de)
CA (1) CA1278949C (de)
DE (1) DE3682569D1 (de)
SG (1) SG77492G (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2671300B2 (ja) * 1986-03-17 1997-10-29 セイコーエプソン株式会社 インクジエツト記録装置
JP2638780B2 (ja) * 1986-04-30 1997-08-06 セイコーエプソン株式会社 インクジェット記録ヘッド
DE3717294C2 (de) * 1986-06-10 1995-01-26 Seiko Epson Corp Tintenstrahlaufzeichnungskopf
JP2661016B2 (ja) * 1986-06-24 1997-10-08 セイコーエプソン株式会社 インクジェット記録ヘッド
IT1234800B (it) * 1989-06-08 1992-05-27 C Olivetti & C Spa Sede Via Je Procedimento di fabbricazione di testine termiche di stampa a getto d'inchiostro e testine cosi' ottenute
US5274400A (en) * 1992-04-28 1993-12-28 Hewlett-Packard Company Ink path geometry for high temperature operation of ink-jet printheads
US6447088B2 (en) 1996-01-16 2002-09-10 Canon Kabushiki Kaisha Ink-jet head, an ink-jet-head cartridge, an ink-jet apparatus and an ink-jet recording method used in gradation recording
US6137510A (en) * 1996-11-15 2000-10-24 Canon Kabushiki Kaisha Ink jet head
US6017112A (en) * 1997-11-04 2000-01-25 Lexmark International, Inc. Ink jet printing apparatus having a print cartridge with primary and secondary nozzles
US5984455A (en) * 1997-11-04 1999-11-16 Lexmark International, Inc. Ink jet printing apparatus having primary and secondary nozzles
JP5679665B2 (ja) * 2009-02-06 2015-03-04 キヤノン株式会社 インクジェット記録ヘッド
JP5532227B2 (ja) * 2010-03-25 2014-06-25 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
JP6272002B2 (ja) * 2013-12-18 2018-01-31 キヤノン株式会社 液体吐出ヘッド及び液体吐出装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188635A (en) * 1977-10-03 1980-02-12 International Business Machines Corporation Ink jet printing head
JPS5764563A (en) * 1980-10-07 1982-04-19 Fuji Xerox Co Ltd Ink particle jet apparatus of multi-nozzle ink jet printer
US4500895A (en) * 1983-05-02 1985-02-19 Hewlett-Packard Company Disposable ink jet head
DE3480183D1 (en) * 1984-05-18 1989-11-23 Siemens Ag Device for fastening and contacting for cylindrical piezo-electrical transducers
JPS61125441U (de) * 1985-01-25 1986-08-07

Also Published As

Publication number Publication date
EP0224937A2 (de) 1987-06-10
SG77492G (en) 1992-10-02
CA1278949C (en) 1991-01-15
EP0224937A3 (en) 1988-11-17
DE3682569D1 (de) 1992-01-02
JPH0773915B2 (ja) 1995-08-09
JPS62134268A (ja) 1987-06-17

Similar Documents

Publication Publication Date Title
US4683481A (en) Thermal ink jet common-slotted ink feed printhead
US4680859A (en) Thermal ink jet print head method of manufacture
US6997540B2 (en) Substrate for fluid ejection devices
US5635966A (en) Edge feed ink delivery thermal inkjet printhead structure and method of fabrication
US4899181A (en) Large monolithic thermal ink jet printhead
US5638101A (en) High density nozzle array for inkjet printhead
AU715596B2 (en) Large array heater chips for thermal ink jet printheads
US6543880B1 (en) Inkjet printhead assembly having planarized mounting layer for printhead dies
US5103246A (en) X-Y multiplex drive circuit and associated ink feed connection for maximizing packing density on thermal ink jet (TIJ) printheads
EP0224937B1 (de) Aufbau eines Wärmetintendüsen-Druckkopfes
US5619236A (en) Self-cooling printhead structure for inkjet printer with high density high frequency firing chambers
US5648805A (en) Inkjet printhead architecture for high speed and high resolution printing
US6523940B2 (en) Carrier for fluid ejection device
US5604519A (en) Inkjet printhead architecture for high frequency operation
EP0430692A1 (de) Herstellungsverfahren eines Druckkopfes
EP0244214A1 (de) Thermischer Tintenstrahldruckkopf
US5594481A (en) Ink channel structure for inkjet printhead
JPH04229279A (ja) インクジェット印字ヘッドのチャンネル板を製造する方法
US6079819A (en) Ink jet printhead having a low cross talk ink channel structure
US6464333B1 (en) Inkjet printhead assembly with hybrid carrier for printhead dies
US4835553A (en) Thermal ink jet printhead with increased drop generation rate
US6880246B2 (en) Method of forming substrate with fluid passage supports
EP0110534B1 (de) Monolithische Tintenstrahldüsenöffnungsplatten/Widerstandskombination
US5410340A (en) Off center heaters for thermal ink jet printheads
US6231165B1 (en) Inkjet recording head and inkjet apparatus provided with the same

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB IT

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB IT

17P Request for examination filed

Effective date: 19881019

17Q First examination report despatched

Effective date: 19900808

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB IT

ITF It: translation for a ep patent filed
REF Corresponds to:

Ref document number: 3682569

Country of ref document: DE

Date of ref document: 19920102

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

REG Reference to a national code

Ref country code: FR

Ref legal event code: TP

REG Reference to a national code

Ref country code: FR

Ref legal event code: CL

REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20051130

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20051216

Year of fee payment: 20

REG Reference to a national code

Ref country code: GB

Ref legal event code: PE20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20051229

Year of fee payment: 20

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20060131

Year of fee payment: 20

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION

Effective date: 20061204