EP0250940B1 - Procédé d'assemblage étanche de deux parties d'enceinte métalliques - Google Patents

Procédé d'assemblage étanche de deux parties d'enceinte métalliques Download PDF

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Publication number
EP0250940B1
EP0250940B1 EP87108254A EP87108254A EP0250940B1 EP 0250940 B1 EP0250940 B1 EP 0250940B1 EP 87108254 A EP87108254 A EP 87108254A EP 87108254 A EP87108254 A EP 87108254A EP 0250940 B1 EP0250940 B1 EP 0250940B1
Authority
EP
European Patent Office
Prior art keywords
housing parts
metal
vacuum chamber
vacuum
window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP87108254A
Other languages
German (de)
English (en)
Other versions
EP0250940A1 (fr
Inventor
Norbert Bischof
Hans Stübler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
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Filing date
Publication date
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Publication of EP0250940A1 publication Critical patent/EP0250940A1/fr
Application granted granted Critical
Publication of EP0250940B1 publication Critical patent/EP0250940B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/263—Sealing together parts of vessels specially adapted for cathode-ray tubes

Definitions

  • the present invention relates to a method according to the preamble of patent claim 1.
  • the vacuum sealing technology in the production of image intensifier wafer tubes takes place in a high vacuum chamber after the individual components of the tube, such as fluorescent screen, microchannel plate, cathode carrier etc. are connected to one another in this high vacuum chamber by soldering or cold pressing with indium as solder.
  • the soldered connection has the disadvantage that when the system is released, gases released can also degrade the vacuum in the wafer tube itself. If temperatures are used which are so low that the indium does not melt, very long processing times are required without being able to ensure that sufficient degassing has taken place. If you use higher temperatures, e.g. B. up to 400 ° C, at which the indium solder melts, alloys can occur which lead to a change in the structure, which in turn make difficulties in the subsequent cold pressing.
  • the present invention is based on the object of specifying a novel connection technique for a vacuum-tight closure of the housing parts, in particular a wafer image intensifier tube, which allows high degassing temperatures to be used and leads to tubes with an improved service life.
  • a major advantage of the invention is therein. seen that the risk of contamination within the finished tube by residual gases is largely reduced and on the other hand a secure and permanent closure is ensured.
  • the figure shows schematically a half of a substantially rotationally symmetrical wafer picture tube 9 with an input disk 10, on the inner surface 13 of which the photocathode is located and with a fiber optic output window 11, on the inner surface of which there is a phosphor layer 12.
  • a microchannel plate 14 is arranged as a secondary electron amplifier.
  • the individual components, in particular the input and output windows 10 and 11, are connected to flange-like housing parts 7 and 8 made of metal, in particular by soldering or fusing.
  • the flange-like housing parts are then connected to one another within a vacuum chamber in the manner described above. Only one window 6 of the vacuum chamber is shown.
  • the housing parts are connected after a system bake-out temperature treatment that is up to over 400 ° C.
  • the tube housing which is not yet vacuum-tight, is already in the vacuum chamber.
  • the microchannel plate and the entrance and exit windows are already connected to the individual metal housing parts.
  • the annular flange-like metal housing parts 7 and 8 preferably consist of an iron-nickel-cobalt compound.
  • a thin gold or copper ring 4 is inserted between the surfaces of the flanges 7, 8.
  • Correspondingly shaped plungers 3 and counter bearings 2 are also located in the vacuum chamber, which serve to exert greater pressure on the two flange parts 7 and 8.
  • the two flange parts are firmly pressed together by this pressure.
  • the interposed ductile metal parts 4 made of gold or copper deform in the process and result in a type of cold-soldered connection. The dimensions of the tube are largely fixed and sealed.
  • the tube placed on a rotating device 5 is now further rotated within the vacuum chamber in the presence of a vacuum.
  • a laser 1 located outside the vacuum chamber generates a laser beam 15, which is deflected and focused on the seam of the cold-pressed flange 7, 8 by means of collecting optics 16.
  • the material of the two flange parts 7 and 8 is welded together on the circumference.
  • the intensity of the laser beam and the speed of rotation of the turntable 5 are coordinated accordingly.
  • the cross section of the laser beam 15 is selected in the plane of the window 6 inserted in a vacuum-tight manner in the wall of the vacuum chamber so that the thermal surface loading cannot lead to any damage to the flange 6. at a laser beam focal length of e.g. B. 150 to 200 mm focal length due to the existing beam at the window 6 a warming up of this disc is not yet taking place.
  • a laser beam focal length e.g. B. 150 to 200 mm focal length due to the existing beam at the window 6 a warming up of this disc is not yet taking place.
  • metal evaporation can occur.
  • this metal evaporation cannot get into the interior of the wafer image intensifier tube as a result of the cold pressing that has already taken place.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Claims (9)

1. Procédé de liaison, étanche au vide, de deux parties métalliques de boîtier d'un tube électronique, dans le cas duquel on chauffe les parties du boîtier dans une chambre à vide et on les réunit l'une à l'autre au moyen d'un métal de liaison que l'on interpose et au moyen d'une application de pression, caractérisé en ce qu'après avoir effectué la liaison par pression, on soude en outre le joint de liaison dans la chambre à vide au moyen d'un faisceau laser.
2. Procédé selon la revendication 1, caractérisé en ce que le métal de liaison interposé est plus ductile que le métal des parties du boîtier et, après exécution de la liaison par pression, est suffisamment mince pour que, lors du soudage au laser, les arêtes métalliques des parties du boîtier soient réunies l'une à l'autre.
3. Procédé selon la revendication 1 ou la revendication 2, caractérisé en ce que comme métal de liaison on emploie un métal ductile, comme l'or, le cuivre ou analogue.
4. Procédé selon l'une des revendications 1 à 3, caractérisé en ce que comme métal de liaison on emploie un métal présentant des caractéristiques de brasage à l'égard des parties du boîtier.
5. Procédé selon l'une des revendications 1 à 4, caractérisé en ce que comme métal pour les parties du boîtier on emploie un composé ferreux, en particulier un composé ferreux contenant du chrome du nickel et/ou du cobalt.
6. Procédé selon l'une des revendications 1 à 5, caractérisé en ce que l'on réunit les parties du boîtier l'une à l'autre à la façon d'une liaison à rebord et que l'on procède au soudage au laser à la périphérie des arêtes du rebord.
7. Procédé selon l'une des revendications 1 à 6, caractérisé en ce que l'on fait tourner les parties du boîtier, réunies par pression, à l'intérieur de la chambre à vide et que l'on dirige le faisceau laser, produit à l'extérieur de la chambre à vide, à travers une fenêtre, étanche au vide et prévue dans la paroi de la chambre à vide, en le focalisant sur l'emplacement du soudage.
8. Procédé selon la revendication 7, caractérisé en ce que l'on focalise le faisceau laser de façon que dans le plan de traversée de la fenêtre il possède un diamètre assez grand pour éviter d'endommager la fenêtre.
9. Application du procédé selon l'une des revendications 1 à 8, pour la fabrication d'un tube amplificateur d'image avec photocathode, en particulier d'un tube amplificateur d'image à microplaquette.
EP87108254A 1986-06-19 1987-06-06 Procédé d'assemblage étanche de deux parties d'enceinte métalliques Expired - Lifetime EP0250940B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863620585 DE3620585A1 (de) 1986-06-19 1986-06-19 Verfahren zum vakuumdichten verbinden zweier metallener gehaeuseteile
DE3620585 1986-06-19

Publications (2)

Publication Number Publication Date
EP0250940A1 EP0250940A1 (fr) 1988-01-07
EP0250940B1 true EP0250940B1 (fr) 1990-03-28

Family

ID=6303281

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87108254A Expired - Lifetime EP0250940B1 (fr) 1986-06-19 1987-06-06 Procédé d'assemblage étanche de deux parties d'enceinte métalliques

Country Status (2)

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EP (1) EP0250940B1 (fr)
DE (2) DE3620585A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5422456A (en) * 1993-08-31 1995-06-06 Dahm; Jonathan S. Orbital head laser welder
DE19806321A1 (de) * 1998-02-06 1999-08-19 Samsung Display Devices Co Ltd Verfahren und Vorrichtung zum Verbinden von Befestigungselementen am Maskenrahmen von Bildröhren
DE102011107708B4 (de) 2011-07-14 2025-02-27 Evobeam GmbH Laserstrahlschweißvorrichtung
DE102018210773A1 (de) * 2018-06-29 2020-01-02 Robert Bosch Gmbh Herstellungsverfahren eines Gehäuses für eine Elektronik
CN114346436B (zh) * 2022-01-17 2022-10-04 浙江精匠智能科技有限公司 保温杯抽真空设备及其使用方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1143535A (fr) * 1965-02-23
US4423351A (en) * 1980-05-06 1983-12-27 Tokyo Shibaura Denki Kabushiki Kaisha Vacuum container of radiation image multiplier tube and method of manufacturing the same

Also Published As

Publication number Publication date
EP0250940A1 (fr) 1988-01-07
DE3620585A1 (de) 1987-12-23
DE3762076D1 (de) 1990-05-03

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