EP0281004A1 - Segment pour la taille d'une scie pour le travail de la pierre - Google Patents

Segment pour la taille d'une scie pour le travail de la pierre Download PDF

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Publication number
EP0281004A1
EP0281004A1 EP88102697A EP88102697A EP0281004A1 EP 0281004 A1 EP0281004 A1 EP 0281004A1 EP 88102697 A EP88102697 A EP 88102697A EP 88102697 A EP88102697 A EP 88102697A EP 0281004 A1 EP0281004 A1 EP 0281004A1
Authority
EP
European Patent Office
Prior art keywords
cutting
segment
diamond
diamond grains
cutting segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP88102697A
Other languages
German (de)
English (en)
Inventor
Hans-Joachim Dr. Wiemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Diamantwerkzeuge GmbH and Co KG
Original Assignee
Ernst Winter and Sohn Diamantwekzeuge GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ernst Winter and Sohn Diamantwekzeuge GmbH and Co filed Critical Ernst Winter and Sohn Diamantwekzeuge GmbH and Co
Publication of EP0281004A1 publication Critical patent/EP0281004A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B24D5/123—Cut-off wheels having different cutting segments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/348—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised as impregnating agent for porous abrasive bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades

Definitions

  • the invention relates to a cutting segment for a saw for stone processing, which has a basic segment body with metallically bonded diamond grains.
  • cutting discs in the form of circular saws are used or, for example, frame saws which are provided with cutting segments which contain diamonds.
  • the processing of hard rocks such as granite and marble requires the use of saws with segments that are exposed to very high loads.
  • the wear behavior of diamond-containing segments essentially depends on the diamond grit and the binding material as well as the structure and geometry of the segments.
  • segments containing diamond have been of the type of Compacts are produced by sintering a sinter powder consisting of a metal compound, to which diamond dust is admixed.
  • a sinter powder consisting of a metal compound, to which diamond dust is admixed.
  • Nickel or cobalt are particularly suitable as coating materials.
  • no known segments with a particularly high diamond concentration can be obtained by such known powder metallurgical or sintering processes, in which a sufficient bond of the diamond grains is ensured.
  • These layers are relatively thick, that is generally more than 0.8 mm thick, since they cannot be applied economically in any other way to layers underneath, which also consist of diamonds with a metal bond, which are produced by the sintering process.
  • a layer thickness of 0.8 mm as the outer layer in powder metallurgical processing of diamonds in a metal bond was previously considered necessary if the saw segments had a length in the cutting direction of the size of 40 mm or more, as is generally the case with sawing hard rock is common.
  • protection of a cutting leg mentes against wear created by the fact that the segment base body carries at least on its outer sides en wear protection layer with a thickness of 0.1 to 0.5 mm, which consists of galvanically beaten diamonds, the grain size is smaller and the proportion of diamond in the layer is greater than that of the segment body.
  • the thickness of the side protective layer can be limited to the top, for example to a maximum of 0.5 mm, layer thicknesses of the order of magnitude preferably being used from 0.2 to 0.5 mm. It is possible to use a significantly higher diamond concentration for the side protection of the segments than was previously possible, namely a concentration of 150 to 200, which is equivalent to a diamond content of 6.6 to 8.8 carats / cm3.
  • Such a high diamond density can then be achieved in particular Chen, if the galvanically deposited wear protection layer consists of diamond grains, the surface of which is expanded by etching in the reduction process with pore-shaped depressions to at least twice the natural surface size, the majority of the diamond grains then being able to touch directly with neighboring diamond grains within the same protective layer.
  • etching of diamonds prior to their incorporation, it is known, for example according to DE-OS 18 11861, to carry out the etching in this way ren that the abrasives are treated with oxidizing substances. It is thought of a treatment of silicon carbide, which is mixed with sodium peroxide and heated or is instead treated in a melt with potassium nitride. Furthermore, the treatment of diamond grains for the purpose of roughening them is known by means of metal alloys which contain at least one component which tends to react chemically with the diamond surface. Reactive metallic bonding materials attack the diamond surface to a greater or lesser extent, with part of the diamond carbon being removed by the metal, so that there is a certain roughness which improves the bonding of the individual diamond grain.
  • a certain roughening of diamond grains takes place anyway if they are surrounded by a metal powder matrix in the sintering process and the metal powder consists, for example, of cobalt or an alloy thereof.
  • Another known etching method is to expose the diamond grains in an oven exposed, the oven atmosphere consisting of oxygen or an oxygen-containing gas such as. B. air.
  • the diamond carbon is ultimately burned to carbon monoxide, in which diamond material is removed and minor etching pits are created.
  • diamond grains are used in the segments according to the invention, not by an oxidation process, but by a so-called reduction process or a hydrogenation have such strong and deep pores that their total surface is significantly larger than twice the natural surface.
  • Such an etching in the reduction process is carried out by exposing the diamond grains embedded in a metal powder at a temperature above 700 ° C. to a stream of hydrogen or a hydrogen-containing gas.
  • Particularly suitable metals are those which are suitable for the formation of carbide, so that diamond carbon atoms can diffuse out of the diamond into the metal with the formation of a carbide, after which the metal activates the hydrogen so that it dissolves with that in the metal Can combine carbon and flushes it away as a gas.
  • the metal particles involved in the reaction remain receptive to additional carbon, which diffuses from the diamond to the metal at the point of contact.
  • the metal particles selectively eat into the diamond surface and cause Chen a topography advantageous for the purposes considered here.
  • Such pretreated diamond grains can be bonded particularly advantageously in metals to be electrodeposited, such as nickel and cobalt, since this binding material penetrates into the pores after the diamond grains have previously been cleaned with an acid, for example.
  • Synthetic as well as natural diamonds can be used for this, but their further processing in high concentration in powder metallurgically produced bonds has so far shown no particular benefit.
  • the segments according to the invention can accordingly have, for example, protective layers in which the diamond grains have a grain size of 10 to 200 ⁇ m and the diamond grains in the basic segment body have a size of 300 to 1,000 ⁇ m, the layer thickness of a protective layer being approximately 0.2 to 0.5 mm , even if the segments have a length of about 40 mm. This is due, among other things, to the fact that the diamonds in the protective layer have extreme adhesion due to the additional measures taken, so that they do not wear out as quickly as the rest of the base body of the segment.
  • the protective layers also have a guiding function, since they are effective in the sense of guide walls.
  • Another advantage is that due to the extremely tight fit of the specially pretreated diamonds in the galvanic bond of the protective layer, the degree of utilization of the high quality used for stone processing and expensive diamond material is increased considerably. This results in an increase in the efficiency of stone processing using such segments provided with the side protection mentioned.
  • the special hardness of the side protection layers not only prevents wear and tear on the edges, but the long service life of the extremely hard side protection layers results in additional lateral guidance, which improves the cutting performance and significantly increases the material removal rate when working with stone.
  • the arrangement of the wear protection layers is not limited to the walls of a cutting element aligned parallel to the cutting direction. Rather, it is also provided according to the invention to provide the end faces of a cutting segment with a wear protection layer which consists of galvanically deposited diamonds in high concentration. In such cases, the wear protection layers do not additionally have a guiding function, such as the protective layers arranged on the side, but in particular a protection function for the other components or zones of the cutting segment.
  • a single cutting segment can be provided on its front as well as on its back with a protective layer, as is expedient when the cutting element is used on a reciprocating or reciprocating tool such as a gang saw.
  • FIG. 1 shows a separating saw, the saw blade 2 of which has radially projecting teeth, each of which has a cutting segment 4 on its end face.
  • the cutting segments are arranged on the outside of the teeth and in the frame saw according to FIG. 3, the cutting segments 4 are arranged on the underside of the teeth.
  • These cutting segments 4 can, according to the embodiments shown in FIGS. 4 to 8, be of different types. What they have in common, however, is that in certain areas they carry galvanically deposited diamond grains of small diameter, which, due to an artificial roughening, have such an enlarged surface that they are arranged in a concentration in which the majority of them are in direct contact with one another touched grains lying next to them.
  • the segment according to FIG. 4 which can be used in a circular saw according to FIG. 2 or a gang saw according to FIG. 3, consists of a segment base body 7 which contains individual diamonds which are bound by powder metallurgy or in the sintering process.
  • Two wear protection layers 8 and 9 are arranged, which are aligned parallel to the feed direction. These wear protection layers have a thickness of only 0.3 mm, but a diamond content in the order of 8 carats / cm3.
  • the individual diamond grains are artificially roughened before they are galvanically bonded in nickel or cobalt, to the extent that the artificially created surface is larger than twice the natural surface. This is done by etching according to a hydrogenation process, according to which the diamond grains embedded in a preferably carbide-forming metal powder are exposed to a heat of about 700 ° C., and a stream of hydrogen or a hydrogen-containing gas.
  • the segment according to FIG. 5 has a front and a rear protective layer 10 and 11 and is therefore suitable for arrangement on a frame saw according to FIG. 3, which reciprocates in accordance with the double arrows 5 and 6 moves, the functions of the protective layers 10 and 11 being used alternately.
  • the side protection layers 8 and 9 also contribute to the lateral guidance in this case and prevent the edges of the segment from being rounded, since these side layers are harder than the other components of the segment.
  • the embodiment according to FIG. 6 differs from the one described above essentially in that the basic segment body consists of a layer of diamonds arranged in one plane.
  • This diamond layer which consists of grains with a diameter of, for example, 1,000 ⁇ m, is surrounded on all sides by protective layers 8, 9, 10 and 11 which, as described above, consist of diamonds of significantly smaller grain size and higher diamond proportions, which are galvanically bonded.
  • Such a segment like the embodiment according to FIG. 5, is also suitable for a reciprocating movement, that is to say, for example, for a frame saw 3.
  • FIG. 8 shows a segment in plan view, which is generally intended for saws and for which is composed entirely of the material of the protective layers described above.
  • This segment consists of diamond grains of small diameter, such as around 100 ⁇ m, which are artificially roughened and galvanically bonded in a metal such as cobalt or nickel in a concentration of approximately 10 carats / cm3. For this, these diamond grains are previously roughened in the manner described above.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
EP88102697A 1987-03-04 1988-02-24 Segment pour la taille d'une scie pour le travail de la pierre Withdrawn EP0281004A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3706867 1987-03-04
DE19873706867 DE3706867A1 (de) 1987-03-04 1987-03-04 Schneidsegment fuer eine saege zur steinbearbeitung

Publications (1)

Publication Number Publication Date
EP0281004A1 true EP0281004A1 (fr) 1988-09-07

Family

ID=6322214

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88102697A Withdrawn EP0281004A1 (fr) 1987-03-04 1988-02-24 Segment pour la taille d'une scie pour le travail de la pierre

Country Status (2)

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EP (1) EP0281004A1 (fr)
DE (1) DE3706867A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3912681A1 (de) * 1989-04-18 1990-10-25 Winter & Sohn Ernst Verfahren zum galvanischen beschichten von segmentflaechen, die auf der oberflaeche eines grundkoerpers angeordnet sind und danach hergestellte erzeugnisse
DE4106005A1 (de) * 1991-02-26 1992-08-27 Winter & Sohn Ernst Schleif- oder trennwerkzeug und verfahren seiner herstellung
DE9106366U1 (de) * 1991-05-23 1991-08-08 Friedrich Busse Diamantwerkzeuge GmbH + Co., 8540 Schwabach Werkzeug zur Stein- oder Betonbearbeitung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3205624A (en) * 1964-07-20 1965-09-14 Shirley I Weiss Annular cutting wheels
US4222828A (en) * 1978-06-06 1980-09-16 Akzo N.V. Process for electro-codepositing inorganic particles and a metal on a surface
FR2539146A1 (fr) * 1983-01-11 1984-07-13 Hilbertz Wolf Concretionnement mineral des structures, composants et elements de construction
US4505251A (en) * 1982-02-08 1985-03-19 Martin Stoll Cutting segment with porous center section
WO1986000252A1 (fr) * 1984-06-25 1986-01-16 Funasaw Co., Ltd. Procede d'electrodeposition d'un metal et d'un abrasif granulaire sur un outil
DD248538A1 (de) * 1986-04-24 1987-08-12 Karl Marx Stadt Tech Hochschul Verfahren zur hartstoffteilchenverankerung in metallischen oberflaechen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2784536A (en) * 1955-10-03 1957-03-12 Lee H Barron Diamond band saw
DE1108641B (de) * 1957-01-10 1961-06-15 Dagobert William Rudorff Dipl Diamantimpraegniertes oder diamantbestuecktes Werkzeug, insbesondere Bohrkrone zum Tiefbohren, Steinsaege, Abstrichwerkzeug u. dgl., und Verfahren zu seiner Herstellung
US3028710A (en) * 1959-05-08 1962-04-10 Vanguard Abrasive Corp Abrasive cut-off disk
DE3433729A1 (de) * 1984-09-14 1986-03-27 Ernst Winter & Sohn ( GmbH & Co ), 2000 Hamburg Werkzeug zur bearbeitung metallischer und nichtmetallischer werkstoffe
DE3418815A1 (de) * 1984-05-21 1985-11-21 Ernst Winter & Sohn ( GmbH & Co ), 2000 Hamburg Werkzeug mit verschleissschutzschicht zur bearbeitung metallischer und nichtmetallischer werkstoffe
DE8612523U1 (de) * 1986-05-07 1986-06-19 KADIA-Diamant Maschinen- und Werkzeugfabrik O. Kopp GmbH & Co, 7440 Nürtingen Diamantierter Sägedraht

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3205624A (en) * 1964-07-20 1965-09-14 Shirley I Weiss Annular cutting wheels
US4222828A (en) * 1978-06-06 1980-09-16 Akzo N.V. Process for electro-codepositing inorganic particles and a metal on a surface
US4505251A (en) * 1982-02-08 1985-03-19 Martin Stoll Cutting segment with porous center section
FR2539146A1 (fr) * 1983-01-11 1984-07-13 Hilbertz Wolf Concretionnement mineral des structures, composants et elements de construction
WO1986000252A1 (fr) * 1984-06-25 1986-01-16 Funasaw Co., Ltd. Procede d'electrodeposition d'un metal et d'un abrasif granulaire sur un outil
DD248538A1 (de) * 1986-04-24 1987-08-12 Karl Marx Stadt Tech Hochschul Verfahren zur hartstoffteilchenverankerung in metallischen oberflaechen

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Publication number Publication date
DE3706867A1 (de) 1988-09-15

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