EP0281804A3 - Bain alcalin stabilisé de dépôt chimique d'or - Google Patents

Bain alcalin stabilisé de dépôt chimique d'or Download PDF

Info

Publication number
EP0281804A3
EP0281804A3 EP88102273A EP88102273A EP0281804A3 EP 0281804 A3 EP0281804 A3 EP 0281804A3 EP 88102273 A EP88102273 A EP 88102273A EP 88102273 A EP88102273 A EP 88102273A EP 0281804 A3 EP0281804 A3 EP 0281804A3
Authority
EP
European Patent Office
Prior art keywords
stabilized
gold
alcaline
current
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP88102273A
Other languages
German (de)
English (en)
Other versions
EP0281804A2 (fr
Inventor
Walter Prof. Dr. Ott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of EP0281804A2 publication Critical patent/EP0281804A2/fr
Publication of EP0281804A3 publication Critical patent/EP0281804A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP88102273A 1987-03-09 1988-02-17 Bain alcalin stabilisé de dépôt chimique d'or Ceased EP0281804A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873707817 DE3707817A1 (de) 1987-03-09 1987-03-09 Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold
DE3707817 1987-03-09

Publications (2)

Publication Number Publication Date
EP0281804A2 EP0281804A2 (fr) 1988-09-14
EP0281804A3 true EP0281804A3 (fr) 1989-03-15

Family

ID=6322785

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88102273A Ceased EP0281804A3 (fr) 1987-03-09 1988-02-17 Bain alcalin stabilisé de dépôt chimique d'or

Country Status (5)

Country Link
US (1) US4838937A (fr)
EP (1) EP0281804A3 (fr)
JP (1) JPS6425987A (fr)
CA (1) CA1290993C (fr)
DE (1) DE3707817A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4919720A (en) * 1988-06-30 1990-04-24 Learonal, Inc. Electroless gold plating solutions
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
DE4024764C1 (fr) * 1990-08-02 1991-10-10 Schering Ag Berlin-Bergkamen, 1000 Berlin, De
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
JP2927142B2 (ja) * 1993-03-26 1999-07-28 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths
JP3395854B2 (ja) * 1994-02-02 2003-04-14 日立化成工業株式会社 酸化銅の化学還元液およびこれを用いた多層プリント配線板の製造方法
CN1053231C (zh) * 1996-10-16 2000-06-07 南京大学 化学镀镍-磷合金镀液及化学镀工艺
JP4932094B2 (ja) * 2001-07-02 2012-05-16 日本リーロナール有限会社 無電解金めっき液および無電解金めっき方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
JPS5020012B1 (fr) * 1964-06-24 1975-07-11
US4091128A (en) * 1976-10-08 1978-05-23 Ppg Industries, Inc. Electroless gold plating bath

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique

Also Published As

Publication number Publication date
DE3707817A1 (de) 1988-09-22
EP0281804A2 (fr) 1988-09-14
CA1290993C (fr) 1991-10-22
JPS6425987A (en) 1989-01-27
US4838937A (en) 1989-06-13

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