EP0287722A1 - Procédé pour le soudage au laser d'éléments à base d'aluminium - Google Patents

Procédé pour le soudage au laser d'éléments à base d'aluminium Download PDF

Info

Publication number
EP0287722A1
EP0287722A1 EP87303537A EP87303537A EP0287722A1 EP 0287722 A1 EP0287722 A1 EP 0287722A1 EP 87303537 A EP87303537 A EP 87303537A EP 87303537 A EP87303537 A EP 87303537A EP 0287722 A1 EP0287722 A1 EP 0287722A1
Authority
EP
European Patent Office
Prior art keywords
casing
aluminium
cover
nickel
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP87303537A
Other languages
German (de)
English (en)
Inventor
Tsutomu Iikawa
Takeaki Sakai
Isao Kawamura
Katsuhide Natori
Takeshi Nagai
Shigeki Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to EP87303537A priority Critical patent/EP0287722A1/fr
Publication of EP0287722A1 publication Critical patent/EP0287722A1/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/206—Laser sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B23K35/286—Al as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof

Definitions

  • the present invention relates to an assembly of welded aluminium based elements, particularly a process for making a package for a microwave amplifier.
  • This low thermal conductivity causes a deter­ioration in the performance of IC's mounted in the package because of its low heat dissipation property, particularly in a package for high output amplifiers.
  • aluminium or an aluminium alloy is lighter and exhibits a desirable malleability and excellent thermal conductivity, and therefore, aluminium or an aluminium alloy is more suitable for producing a package for IC's. Nevertheless, where the aluminium or aluminium alloy elements must be bonded together to produce such a package, this cannot be achieved by brazing, because this method makes it necessary to subject the whole package including the IC's to a high temperature.
  • Steve Bolin et al disclose, on page 26 of an article Laser Welding, Cutting and Drilling, Part 2, Assembly Engineering, July 1980, that one successful solution to this problem was to alter the composition of the weld joint by adding a filler metal - specifically type 4047 aluminium alloy (same as 718 braze alloy).
  • a filler metal - specifically type 4047 aluminium alloy (same as 718 braze alloy).
  • the 12% silicon content of this material prevented the occurrence of cracks in a welded zone by increasing the high temperature strength of the metal.
  • a process for laser welding a cover and a casing, each made of aluminium or an aluminium based alloy, with a nickel intermediate layer to form a package of electronic devices comprises the steps of: boring holes in sides of the casing, thereby providing holes through which input/output and source terminals can be inserted and be soldered hermetically to the casing; plating a nickel layer on the surface of the casing; mounting electronic devices in the casing and forming connections between the devices and the terminals; and welding the cover and the casing together to seal the cover and the casing hermetically using a pulsed YAG laser beam, thereby forming a weld zone containing 1.5 to 10.0% of nickel by weight.
  • the cover and casing may be formed by casting or by cutting of essentially pure aluminium or a cast aluminium based alloy, or a corrosion resistant aluminium based alloy or other aluminium based alloy.
  • a pure aluminium may be, e.g. A 1100 as defined in Japanese Industrial Standard (JIS) H 4000.
  • a cast aluminium based alloy may be, e.g. AC4A alloy, which contains, in percentage by weight ⁇ 0.2 Cu, 8.0 to 10.0 Si, 0.2 to 0.8 Mg, ⁇ 0.2 Zn, ⁇ 0.7 Fe, 0.3 to 0.8 Mn, ⁇ 0.2 Ti.
  • a corrosion resistant aluminium based alloy may be, e.g., A 5052 alloy which contains, in percentage by weight, ⁇ 0.45 (Si + Fe), ⁇ 0.10 Cu, ⁇ 0.10 Mn, 2.2 to 2.8 Mg, 0.15 to 0.35 Cr, ⁇ 0.10 Zn. Both of these alloys are defined also in JIS H 4000.
  • a cover 1 and a casing 2 having a side thickness of 2.5 mm were produced of A 1100 pure aluminium.
  • Two holes for inserting input/output terminals 3 were bored in the end side surfaces of the casing, and twenty four holes for inserting source terminals 4 were bored in the longitudinal side surface of the casing, as shown in Figure 4.
  • the casing 2 was chemically plated by means of a plating solution which comprised nickel sulfate 350 g/l, nickel chloride 50 g/l, and boron sulfate 10 g/l, as shown in Figure 5.
  • Gallium arsenic FET devices were mounted in the recess of the casing, and the input/output terminals 3 and source terminals 4 were inserted in the side wall of the casing and were soldered to the casing hermetically.
  • the nickel layer 5 exhibited a good underplating for soldering. The necessary connections were accomplished between the electronic devices and the terminals.
  • the cover 1 and casing 2 were butted together via plated nickel layer 5.
  • the laser welding was carried out in nitrogen with a welding speed of 4 mm/s by a 0.3 mm laser beam with an average output of 200 W, a pulse width of 4 ms, and a pulse rate of 15 p/s.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
EP87303537A 1987-04-22 1987-04-22 Procédé pour le soudage au laser d'éléments à base d'aluminium Withdrawn EP0287722A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP87303537A EP0287722A1 (fr) 1987-04-22 1987-04-22 Procédé pour le soudage au laser d'éléments à base d'aluminium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP87303537A EP0287722A1 (fr) 1987-04-22 1987-04-22 Procédé pour le soudage au laser d'éléments à base d'aluminium

Publications (1)

Publication Number Publication Date
EP0287722A1 true EP0287722A1 (fr) 1988-10-26

Family

ID=8197872

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87303537A Withdrawn EP0287722A1 (fr) 1987-04-22 1987-04-22 Procédé pour le soudage au laser d'éléments à base d'aluminium

Country Status (1)

Country Link
EP (1) EP0287722A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0379431A1 (fr) * 1989-01-20 1990-07-25 Dassault Electronique Procédé de scellement verre-aluminium, notamment pour traversée électrique de boîtier de circuit hybride, objet composite et composition de verre correspondants
WO1995008842A1 (fr) * 1993-09-22 1995-03-30 Unisys Corporation Boitier de circuit integre avec un couvercle specialement conçu pour etre assujetti au laser
US20140084752A1 (en) * 2012-09-26 2014-03-27 Seiko Epson Corporation Method of manufacturing electronic device, electronic apparatus, and mobile apparatus
US20140146451A1 (en) * 2012-11-26 2014-05-29 Seiko Epson Corporation Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object
CN103846549A (zh) * 2012-11-29 2014-06-11 北京航星机器制造公司 一种电子成件及电子产品壳的激光焊接封装方法
WO2016005172A1 (fr) * 2014-07-08 2016-01-14 Continental Automotive Gmbh Boîtier pour appareil de commande
CN116441711A (zh) * 2023-02-28 2023-07-18 大族激光科技产业集团股份有限公司 7系铝合金的激光焊接方法、激光焊接设备及存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270986A (en) * 1979-07-12 1981-06-02 Sifco Industries, Inc. Method for soldering aluminum
US4521668A (en) * 1983-11-08 1985-06-04 Westinghouse Electric Corp. Method of hermetically laser sealing electronic packages

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4270986A (en) * 1979-07-12 1981-06-02 Sifco Industries, Inc. Method for soldering aluminum
US4521668A (en) * 1983-11-08 1985-06-04 Westinghouse Electric Corp. Method of hermetically laser sealing electronic packages

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 10, no. 151 (M-483)[2208], 31st May 1986; & JP-A-61 003 694 (FUJITSU K.K.) 09-01-1986 *

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0379431A1 (fr) * 1989-01-20 1990-07-25 Dassault Electronique Procédé de scellement verre-aluminium, notamment pour traversée électrique de boîtier de circuit hybride, objet composite et composition de verre correspondants
FR2642257A1 (fr) * 1989-01-20 1990-07-27 Dassault Electronique Procede de scellement verre-aluminium, notamment pour traversee electrique de boitier de circuit hybride, objet composite et composition de verre correspondants
US5538527A (en) * 1989-01-20 1996-07-23 Dassault Electronique Method of sealing glass to aluminum, particularly for electrical feed-through connectors
WO1995008842A1 (fr) * 1993-09-22 1995-03-30 Unisys Corporation Boitier de circuit integre avec un couvercle specialement conçu pour etre assujetti au laser
US20140084752A1 (en) * 2012-09-26 2014-03-27 Seiko Epson Corporation Method of manufacturing electronic device, electronic apparatus, and mobile apparatus
US9660176B2 (en) * 2012-09-26 2017-05-23 Seiko Epson Corporation Method of manufacturing electronic device, electronic apparatus, and mobile apparatus
US9350318B2 (en) * 2012-11-26 2016-05-24 Seiko Epson Corporation Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object
US20140146451A1 (en) * 2012-11-26 2014-05-29 Seiko Epson Corporation Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object
CN103846549B (zh) * 2012-11-29 2016-02-10 北京航星机器制造公司 一种电子成件及电子产品壳体的激光焊接封装方法
CN103846549A (zh) * 2012-11-29 2014-06-11 北京航星机器制造公司 一种电子成件及电子产品壳的激光焊接封装方法
WO2016005172A1 (fr) * 2014-07-08 2016-01-14 Continental Automotive Gmbh Boîtier pour appareil de commande
CN106470793A (zh) * 2014-07-08 2017-03-01 大陆汽车有限公司 用于控制单元的壳体
US10421421B2 (en) 2014-07-08 2019-09-24 Continental Automotive Gmbh Housing for a control unit
DE102014213243B4 (de) 2014-07-08 2024-10-17 Vitesco Technologies GmbH Gehäuse für ein Steuergerät
CN116441711A (zh) * 2023-02-28 2023-07-18 大族激光科技产业集团股份有限公司 7系铝合金的激光焊接方法、激光焊接设备及存储介质

Similar Documents

Publication Publication Date Title
US4760240A (en) Process for laser welding of aluminum based elements
EP0522687B1 (fr) Connecteur hermétique
US3482305A (en) Method of bonding aluminum
US4506108A (en) Copper body power hybrid package and method of manufacture
US6231691B1 (en) Lead-free solder
EP0568568B1 (fr) Procede de brasage de surfaces metalliques
KR20060015749A (ko) 알루미늄재의 납땜방법
EP0491959B1 (fr) Procede de soudage de metaux de types differents au moyen d'une energie laser
KR20060123217A (ko) 브레이징용 알루미늄 합금 스트립
US20040023487A1 (en) Electronic component package and method of manufacturing same
Jacobson et al. Diffusion soldering
JPH02196074A (ja) セラミックスと金属の接合体の製造法
JPH08218137A (ja) レーザー溶接性に優れた銅または銅合金部材
JPH07223090A (ja) アルミニウム合金と銅の接合用ろう材およびこのろう材によって接合された複合材
EP0366082A2 (fr) Support pour dispositif semi-conducteur
US3553825A (en) Method of bonding aluminum
JPH0574977A (ja) アルミナ基体の亀裂を無くす方法
CN118951479A (zh) 一种提升铝/铜焊接接头强韧性和耐蚀性的焊料
Iikawa et al. Aluminum alloy package for microwave amplifier
Sakai et al. A new laser hermetic sealing technique for aluminum package
Biro et al. The effects of Ni and Au/Ni platings on laser welding of thin sheets
JP7586449B2 (ja) 封止構造体の製造方法
JPH0947895A (ja) ろう材
JPS6325501B2 (fr)
SU1479246A1 (ru) Способ диффузионной сварки через промежуточную прокладку

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB IT NL

17P Request for examination filed

Effective date: 19881013

17Q First examination report despatched

Effective date: 19890323

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 19890803

RIN1 Information on inventor provided before grant (corrected)

Inventor name: NAGAI, TAKESHI

Inventor name: SAKAI, TAKEAKI

Inventor name: NATORI, KATSUHIDE

Inventor name: IIKAWA, TSUTOMU

Inventor name: KAWAMURA, ISAO

Inventor name: OKAMOTO, SHIGEKI