EP0360238A2 - Energiekabel - Google Patents
Energiekabel Download PDFInfo
- Publication number
- EP0360238A2 EP0360238A2 EP89117373A EP89117373A EP0360238A2 EP 0360238 A2 EP0360238 A2 EP 0360238A2 EP 89117373 A EP89117373 A EP 89117373A EP 89117373 A EP89117373 A EP 89117373A EP 0360238 A2 EP0360238 A2 EP 0360238A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor
- insulation
- extruded
- parts
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B9/00—Power cables
- H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
- H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/14—Insulating conductors or cables by extrusion
Definitions
- the present invention relates to power cables and in particular to power cables having a conductor, a number of fully bonded dielectric layers including an extruded semiconductor over the conductor, one or more layers of extruded insulation material over the inner semiconductor and an outer extruded semiconductor over the insulation, and finally an outer metal screen and possible outer protective shields, layers and/or sheaths over the outer semiconductor.
- Crosslinking agents such as organic peroxides are usually added to the dielectric material before or during the extrusion process to provide a fully crosslinked insulation and semiconductors.
- the semiconductors are made semiconductive by adding conductive material such as conductive carbon black to the extrudable plastic material.
- conductive material such as conductive carbon black
- the presence of carbon black particles within the extruder leads to higher friction and higher temperature within the extruded material. This increases the risk of pre-crosslinking and clotting.
- the semiconductors are also very much thinner than the insulation, and the extruder passages for the semiconductors are therefore much narrower than the passages for the insulation material. The tendency of clotting is therefore greater in the semiconductors than in the insulation.
- the clots When the clots occur in the outer semiconductor they can usually be detected by inspection and repaired. If the clots occur in the inner semiconductor which is usually extruded in tandem with the insulation or in multiple heads, detection is very difficult or impossible.
- Clots at this interface is also critical because the voltage gradient is higher than at the interface between the insulation and the outer semiconductor.
- the object of the present invention is to improve the dielectric properties of power cables with extruded insulation. This object is obtained by ensuring that the interfaces between the semiconductors and the insulation are smooth and free from clots and lumps which may protrude into the insulation.
- Multiple head extruders may be used to extrude the inner and outer parts of the composite semiconductor(s).
- the inner and outer parts of each semiconductor will however, be integrally united, in spite of the fact that crosslinking agents, in accordance with the invention, are not added to the inner parts before or during the extrusion process.
- a cable conductor 2 is provided with an extruded composite semiconductor 3, one or more layers of extruded insulation material 4 such as crosslinked polyethylene, an outer extruded composite semiconductor 5 and an outer metal screen and possible outer protective screens, layers and/or sheaths 6. All the dielectric layers are fully bonded.
- the semiconductor 3 is extruded in two parts, - an outer part 3a, and an inner part 3b - to constitute a composite semiconductor.
- the outer part 3a of the composite semiconductor which part contains crosslinking agents per se, clots or lumps or other protrusions 9, 10 may occur on the surface of the layer.
- the insulation layers are extruded directly over the crosslinked semiconductor with the risk that said protrusions may cause breakdown of the cable insulation.
- the material used for extruding the inner part 3b of the composite semiconductor 3 is, in accordance with the invention, free from crosslinking agents. No clots will therefore occur in the extrusion channels for the inner part 3b of the inner composite semiconductor 3, and the interface 7 between this semiconductor 3 and the inner surface of the insulation layers 4 will be very smooth and free from protrusions into the insulation.
- the thickness of the inner part 3b should be large enough to cover or at least smoothen the possible protrusions occurring in the outer part 3a.
- the outer semiconductor 5 may also be extruded in two parts - an inner part 5b and an outer part 5a - to constitute a composite semiconductor.
- the material used for extruding the inner part 5b of the composite semiconductor is free from crosslinking agents. No clots or protrusions will therefore occur at the outer surface 8 of the insulation layers 4 and this surface will be smooth.
- the thickness of the inner part 5b should be large enough to cover or smoothen possible clots or protrusions 11, 12 occurring in the extruded outer part 5a.
- the inner parts 3b and 5b of the composite semiconductor will also be crosslinked in the final cable, due to migration of crosslinking agents. In some cases it may, however, be preferred to use relatively thick inner parts 3b and/or 5b when it is allowable to leave some of the semiconductive material in its thermoplastic state.
- Typical materials which can be used for the composite semiconductors 3 and 5 are copolymers of ethylene with addition of conductive carbon black.
- the only difference between the material used to extrude the semiconductive inner parts 3b, 5b and the outer parts 3a, 5a is that crosslinking agents such as organic peroxides are added to the material for the latter parts.
- crosslinking agents such as organic peroxides are added to the material for the latter parts.
- the base materials are substantially identical, said parts will be fully bonded to each other and to the insulation.
- Typical dimensions (thickness of the dielectrics) for a 145 kV cable are: Inner semiconductor 3: 2 mm Insulation layers 4: 21 mm Outer semiconductor 5: 1 mm The thickness of the inner parts of the composite semiconductor should be 0.1 - 0.5 mm, preferably 0.1 - 0.2 mm.
- the structure of the composite semiconducting layer should preferably be selected to ensure satisfactory electrostatic screening properties of the layer during all steady state and transient voltage conditions to which the cable is subjected during operation.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laying Of Electric Cables Or Lines Outside (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Communication Cables (AREA)
- Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT89117373T ATE85724T1 (de) | 1988-09-23 | 1989-09-20 | Energiekabel. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO884219A NO169202C (no) | 1988-09-23 | 1988-09-23 | Kraftkabel. |
| NO884219 | 1988-09-23 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0360238A2 true EP0360238A2 (de) | 1990-03-28 |
| EP0360238A3 EP0360238A3 (de) | 1991-06-12 |
| EP0360238B1 EP0360238B1 (de) | 1993-02-10 |
Family
ID=19891263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP89117373A Expired - Lifetime EP0360238B1 (de) | 1988-09-23 | 1989-09-20 | Energiekabel |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0360238B1 (de) |
| JP (1) | JPH0770265B2 (de) |
| AT (1) | ATE85724T1 (de) |
| DE (1) | DE68904849T2 (de) |
| DK (1) | DK168973B1 (de) |
| FI (1) | FI94382C (de) |
| NO (1) | NO169202C (de) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3935042A (en) * | 1974-07-08 | 1976-01-27 | General Electric Company | Method of manufacturing corona-resistant ethylene-propylene rubber insulated power cable, and the product thereof |
-
1988
- 1988-09-23 NO NO884219A patent/NO169202C/no not_active IP Right Cessation
-
1989
- 1989-09-19 FI FI894425A patent/FI94382C/fi not_active IP Right Cessation
- 1989-09-20 DE DE8989117373T patent/DE68904849T2/de not_active Expired - Fee Related
- 1989-09-20 AT AT89117373T patent/ATE85724T1/de not_active IP Right Cessation
- 1989-09-20 EP EP89117373A patent/EP0360238B1/de not_active Expired - Lifetime
- 1989-09-22 JP JP1245387A patent/JPH0770265B2/ja not_active Expired - Lifetime
- 1989-09-22 DK DK468089A patent/DK168973B1/da not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE68904849D1 (de) | 1993-03-25 |
| DK168973B1 (da) | 1994-07-18 |
| EP0360238A3 (de) | 1991-06-12 |
| FI94382C (fi) | 1995-08-25 |
| FI94382B (fi) | 1995-05-15 |
| JPH02197020A (ja) | 1990-08-03 |
| EP0360238B1 (de) | 1993-02-10 |
| NO884219L (no) | 1990-03-26 |
| ATE85724T1 (de) | 1993-02-15 |
| JPH0770265B2 (ja) | 1995-07-31 |
| FI894425L (fi) | 1990-03-24 |
| DK468089A (da) | 1990-03-24 |
| NO169202B (no) | 1992-02-10 |
| NO884219D0 (no) | 1988-09-23 |
| DK468089D0 (da) | 1989-09-22 |
| FI894425A0 (fi) | 1989-09-19 |
| DE68904849T2 (de) | 1993-08-12 |
| NO169202C (no) | 1992-05-20 |
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