EP0366056A2 - Scie annulaire - Google Patents

Scie annulaire Download PDF

Info

Publication number
EP0366056A2
EP0366056A2 EP89119695A EP89119695A EP0366056A2 EP 0366056 A2 EP0366056 A2 EP 0366056A2 EP 89119695 A EP89119695 A EP 89119695A EP 89119695 A EP89119695 A EP 89119695A EP 0366056 A2 EP0366056 A2 EP 0366056A2
Authority
EP
European Patent Office
Prior art keywords
inner hole
hole saw
saw according
synthetic resin
core
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89119695A
Other languages
German (de)
English (en)
Other versions
EP0366056A3 (en
EP0366056B1 (fr
Inventor
Theodor Dr.-Dipl.-Chem Von Benningsen-Mackiewicz
Jens Zuber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Diamantwerkzeuge GmbH and Co KG
Original Assignee
Ernst Winter and Sohn Diamantwekzeuge GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ernst Winter and Sohn Diamantwekzeuge GmbH and Co filed Critical Ernst Winter and Sohn Diamantwekzeuge GmbH and Co
Publication of EP0366056A2 publication Critical patent/EP0366056A2/fr
Publication of EP0366056A3 publication Critical patent/EP0366056A3/de
Application granted granted Critical
Publication of EP0366056B1 publication Critical patent/EP0366056B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B24D5/126—Cut-off wheels having an internal cutting edge

Definitions

  • the invention relates to an inner hole saw for separating thin slices from a rod, for example made of monocrystalline silicon, which consists of a thin circular core sheet provided with an inner hole in its center, which has a coating of diamond, boron nitride or other hard material grains with one in the edge region of the inner hole Bond carries.
  • the internal hole saws are used in particular in the electronics industry for separating so-called “wafers”, that is to say extremely thin slices from a monocrystalline silicon rod, as are used in particular for the production of so-called chips.
  • the internal hole saws have a core sheet which has a thickness of, for example, only 0.15 mm or 150 ⁇ m, which has a hole in the center, the edge of which is provided with a coating all around, in which diamond grains are arranged in a dense arrangement are embedded.
  • the bond of the diamond grains consists of an electroplated metal coating, which is preferably a nickel matrix.
  • the arrangement of the hard material covering is not limited to the cylindrical inner edge of the hole. Rather, the diamond coating extends on both sides of the core blade at the edge zones adjoining the hole with a width of approximately 2 mm.
  • the thin core blade is clamped in a clamping ring in order to produce high rigidity.
  • a clamping ring is arranged in a machine, from which it is set in rapid rotation during operation of the internal hole saw.
  • the distance from the edge of the inner hole to the clamping ring must be chosen at least so large that rods with a corresponding diameter size can be cut.
  • the advantage of such saws is that they can be used to produce small cutting widths and thus only a small loss of material from the material to be sawn. This is of particular advantage when processing expensive materials such as monocrystalline semiconductor materials.
  • brittle hard materials such as. B. ceramics, quartz glass, glass, minerals but also metals.
  • the reproducible setting of different diamond concentrations is difficult, in other words that it is difficult to use different diamond concentrations in the nickel matrix when the diamond grains are galvanically bonded, in order to adapt the saw to the material to be processed or high diamond concentrations or very low concentrations to take advantage of.
  • Inner hole saws therefore have particular problems because they have to be stretched for their use, in contrast to normal grinding wheels or external saws, in which no such internal stresses or strains occur as a result of clamping.
  • the object of the invention is to provide an internal hole saw whose mechanical and thermal properties can be specifically adapted to the materials to be processed and different operating conditions and which does not have the disadvantages associated with frequent re-sharpening.
  • the hard material bodies are embedded in a high-temperature-resistant synthetic resin bond, which is applied to the core sheet by casting or pressing, the coating adhesion on the core sheet being supported by a mechanical anchoring, and the synthetic resin having an elongation at break of more than 2%, a tensile strength of than 20 N / mm2 and a glass transition temperature of 200 to 400 ° C.
  • These are preferably epoxy resins, polyimides, flexible phenolic resins.
  • the properties of the internal hole saw according to the invention can be adapted to the materials to be machined by the use of fillers made of metallic or non-metallic materials, whereby a sufficient hold of the diamond or other hard material grains can be influenced, in which the grains are coated with a metallic or are provided with non-metallic material.
  • the additives can also prove to be useful for sufficient resistance of the synthetic resin to the coolants commonly used when using internal hole saws, which are usually water with an alkaline or acidic additive.
  • the covering is applied in powder form on the core sheet.
  • the two are then heated together, the powder being pressed simultaneously at a temperature in the range of the glass transition temperature of the chosen resin.
  • the coating is poured in the liquid state within a mold on the core sheet, as is possible in particular when using epoxy resins.
  • a subsequent attachment of a prefabricated covering to the core sheet can also be provided as an alternative.
  • Such attachment can be done using an adhesive consisting of two components.
  • fillers can influence tensile strength or elongation at break, for example.
  • fibrous or needle-shaped materials such as glass, carbon or metal fibers come into consideration.
  • the thermal conductivity can be influenced by metallic fillers and the coefficient of friction can be reduced by using dry lubricants such as graphite or polytetrafluoroethylene (PTFE).
  • dry lubricants such as graphite or polytetrafluoroethylene (PTFE).
  • mechanical clamping or anchoring can be used by the arrangement of holes in the core sheet, which leads to bridging between the two covering sides or by the arrangement of grooves in the core sheet. Adhesion is also possible, as is adhesion by chemical reaction with the core sheet material, in particular provided that the core sheet also consists of a fiber-reinforced plastic.
  • the liability of the covering is improved by roughening the core sheet beforehand. This can be done mechanically, for example by sandblasting or grinding. Instead, chemical roughening can be done by using acids or by electrolytic etching.
  • FIGS. 1 to 3 of an internal hole saw for separating thin slices from a rod 1 made of monocrystalline silicon has a core sheet 3 which is made of sheet metal and has a thickness of, for example, 0.15 mm.
  • the core sheet 3 is provided with an inner hole 4, the cylindrical wall area of which is provided with a coating 5 which consists of diamond grains which are held in a plastic bond.
  • the covering 5 extends on both sides of the core sheet 3 over an edge width of, for example, 2 mm beyond the edge of the inner hole 4.
  • the core sheet 3 is provided with holes 6 which are arranged concentrically immediately next to the edge of the inner hole and which, according to FIG. 2, are penetrated by the diamond covering 5, so that bridges are formed between the two lateral covering sections, leading to the adhesion of the covering 5 Contribute to core sheet 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
EP89119695A 1988-10-27 1989-10-24 Scie annulaire Expired - Lifetime EP0366056B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3836587A DE3836587A1 (de) 1988-10-27 1988-10-27 Innenlochsaege
DE3836587 1988-10-27

Publications (3)

Publication Number Publication Date
EP0366056A2 true EP0366056A2 (fr) 1990-05-02
EP0366056A3 EP0366056A3 (en) 1990-12-12
EP0366056B1 EP0366056B1 (fr) 1992-12-30

Family

ID=6366019

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89119695A Expired - Lifetime EP0366056B1 (fr) 1988-10-27 1989-10-24 Scie annulaire

Country Status (2)

Country Link
EP (1) EP0366056B1 (fr)
DE (2) DE3836587A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999042783A1 (fr) * 1998-02-18 1999-08-26 Cubic Defense Systems, Inc. Ensemble diode laser a utiliser dans un emetteur d'armes legeres
EP2094424A4 (fr) * 2006-11-16 2014-03-05 Shinhan Diamond Ind Co Ltd Outil diamant et procédé de fabrication de segment de celui-ci

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4024751C2 (de) * 1990-08-03 1995-06-08 Wacker Chemitronic Verfahren und Vorrichtung zum Innenlochsägen von stabförmigen Werkstücken, insbesondere Halbleiterstäben

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL42790C (fr) * 1935-02-14
GB1208408A (en) * 1968-11-29 1970-10-14 Hinmar Associates Inc Abrasive cutting tool and method
US3619152A (en) * 1969-09-16 1971-11-09 Tetrahedron Associates Cutting tool with boron filament composite
DD95335A1 (fr) * 1972-04-03 1973-01-22
US3765132A (en) * 1972-04-06 1973-10-16 Carborundum Co Free cutting internal diamond grinding wheel
IE42894B1 (en) * 1975-07-28 1980-11-05 Gen Electric Improvements in coated diamond and cubic boron mitride particles and processes thereof
DE2700037A1 (de) * 1977-01-03 1978-07-06 Richard Hahn Diamantwerkzeuge Saegeblatt
DE2740891C3 (de) * 1977-09-10 1980-11-13 Ernst 8909 Niederraunau Spielvogel Umfangsschleifscheibe
DE3218562A1 (de) * 1981-07-10 1983-01-20 Tyrolit-Schleifmittelwerke Swarovski KG, 6130 Schwaz, Tirol Kreissaegeblatt
DE3606581A1 (de) * 1986-02-28 1987-09-03 Nkk Nihon Structure Co Schleif- oder trennscheibe
DE3639700A1 (de) * 1986-11-20 1988-06-01 Winter & Sohn Ernst Innenlochsaege
US4776316A (en) * 1987-04-29 1988-10-11 Ashkenazi Brian I Wafering device and method of using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999042783A1 (fr) * 1998-02-18 1999-08-26 Cubic Defense Systems, Inc. Ensemble diode laser a utiliser dans un emetteur d'armes legeres
EP2094424A4 (fr) * 2006-11-16 2014-03-05 Shinhan Diamond Ind Co Ltd Outil diamant et procédé de fabrication de segment de celui-ci

Also Published As

Publication number Publication date
EP0366056A3 (en) 1990-12-12
DE3836587A1 (de) 1990-05-03
EP0366056B1 (fr) 1992-12-30
DE58903164D1 (de) 1993-02-11

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