Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
  • H05K3/4007—Surface contacts, e.g. bumps
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/02—Contact members
  • H01R13/22—Contacts for co-operating by abutting
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0364—Conductor shape
  • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0364—Conductor shape
  • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/03—Metal processing
  • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
  • H05K2203/0703—Plating
  • H05K2203/0723—Electroplating, e.g. finish plating

Definitions

• the present invention relates to a connection method applicable for making any flat connection between two rigid or flexible members.
• connection connections are made by placing opposite the connection zones consisting of flat conductive pads provided or not with surface protection such as gilding or tinning, and by maintaining said conductive pads in contact by means of appropriate tightening.
• This type of connection is used, for example, 'to connect conductors in the form of strips (commonly called "strip line") therebetween or a printed circuit card.
• strip line commonly called "strip line"
• the quality of these connections depends of course on the surface condition of the conductive pads intended to come into contact. In practice, their flatness is most often very approximate, in particular that of printed circuit boards which, inherently, have surface undulations. This results in poor quality connections which are characterized by high contact resistances.
• the object of the invention is to overcome this drawback by a process which is very simple to implement and which makes it possible to produce a single electrical connection more generally suited to power connections or connections of ribbon lines.
• This method consists in forming a first conductive iage intended to come into contact in a flat connection with a second substantially planar conductive pad, a surface state making appear from a substantially planar base a plurality of studs of the same height regularly distributed. , then apply opposite. and clamping the first and second conductive pads, so as to establish contact between the top of each pad and the surface of the second pad.
• FIG. 1 partially shows a conductive pad comprising pads for connection according to the method of the invention
• the Figure 2 is a view similar to Figure 1 illustrating another type of studs.
• the conductive pads 10 shown in FIGS. 1 and 2 are the ends of a ribbon conductor, generally made of copper, applied to a substrate 11.
• the latter can be rigid, such as a printed circuit board, for example. It can also be flexible, in particular in the case of a strip line or "strip line", the track 10 can then be the end of one of several parallel tracks.
• the mass of the studs 12 in the form of cylindrical pellets which are aligned in columns and in rows.
• the studs 12 can be arranged in staggered rows or according to any other regular distribution, depending, as well as their number, on the geometry of the range.
• the number of pads is, for example, 20 and the current is, for example 5 A.
• the studs 12 can be given a height, depending on the case, between a few hundredths and a few tens of millimeters for a diameter and a spacing of the order of a few tens of millimeters. Tests have been carried out by forming pads 50 ⁇ in height and 0.7 mm in diameter, spaced 0.8 mm apart, the results of which have proved to be extraordinarily satisfactory, namely that the contact resistance in the connection between the conductive area thus obtained and another normal area conductive area was reduced by more than half.
• An interesting development of the invention consists in providing on the pad 10 a coating of fairly hard conductive material, such as nickel, in order to prevent the studs 12 against deformation and crushing. This precaution ensures that the studs are held securely in the event of tightening or repeated dismantling of the connection. Of course, conventional additional protection by tinning or gilding can also be provided.
• the studs 12 'shown in Figure 2 have the form of regular tetrahedra. The characteristics of these studs, from the point of view of their dimensions and their distribution, are substantially the same as for cylindrical studs. With the studs 12 ', contact is established by their points. If they are coated, as previously described, with a layer of nickel or other hard conductive material, said tips, instead of being crushed during tightening, are impregnated in the surface of the conductive surface opposite screws, so as to provide an additional slip resistance function in the connection.
• the pads on track 10 can be obtained very simply in a single collective deposition operation, for example by electroplating, with the advantage that industrial tools - to implement this technique already exists in the field of printed circuits, so that the process of the invention is characterized by a very low cost. Because it brings a significant reduction in contact resistance in any flexible flat connection - flexible, flexible - rigid or rigid - rigid, we will find very interesting applications for both power connections that is to say of strong currents only for connections of ribbon lines or "strip line" used in VHF and in microwave. Note that the method is applicable to conductive pads of any shape.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Metallurgy (AREA)
• Multi-Conductor Connections (AREA)
• Electroplating Methods And Accessories (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=9379185

Family Applications (1)

Country Status (4)

Families Citing this family (5)

Family Cites Families (7)

• 1989
  • 1989-02-28 FR FR8902555A patent/FR2643754B1/fr not_active Expired - Fee Related
• 1990
  • 1990-02-27 CA CA 2028110 patent/CA2028110A1/fr not_active Abandoned
  • 1990-02-27 EP EP19900904369 patent/EP0418345A1/de not_active Withdrawn
  • 1990-02-27 WO PCT/FR1990/000137 patent/WO1990010320A1/fr not_active Ceased

Non-Patent Citations (1)

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