EP0442312A2 - Emetteur et/ou récepteur optique intégré - Google Patents

Emetteur et/ou récepteur optique intégré Download PDF

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Publication number
EP0442312A2
EP0442312A2 EP19910101021 EP91101021A EP0442312A2 EP 0442312 A2 EP0442312 A2 EP 0442312A2 EP 19910101021 EP19910101021 EP 19910101021 EP 91101021 A EP91101021 A EP 91101021A EP 0442312 A2 EP0442312 A2 EP 0442312A2
Authority
EP
European Patent Office
Prior art keywords
light
substrate
optical
modules
receiver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19910101021
Other languages
German (de)
English (en)
Other versions
EP0442312A3 (en
Inventor
Albrecht Dr. Mozer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Alcatel Lucent NV
Original Assignee
Alcatel SEL AG
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel SEL AG, Alcatel NV filed Critical Alcatel SEL AG
Publication of EP0442312A2 publication Critical patent/EP0442312A2/fr
Publication of EP0442312A3 publication Critical patent/EP0442312A3/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers

Definitions

  • the invention is based on an optical receiver and / or transmitter according to the preamble of claim 1.
  • transmitter or receiver modules are spliced on at the beginning and at the end of the line, by means of which electrical signals are converted into light signals and at the end of the line back into electrical signals.
  • repeater modules for signal processing are provided at certain intervals.
  • the modules of the aforementioned type have so far been manufactured individually using discrete or hybrid technology. They are each in a housing from which fiber optic connectors and / or wire connections protrude. Such modules are expensive and take up a relatively large amount of space. The latter is very cumbersome if, in the case of a large number of parallel optical waveguides, for example in the case of a cable, transmitter or receiver modules or repeater modules are to be spliced on or spliced on.
  • the object of the invention is to reduce the volume of the individual modules and at the same time the manufacturing costs.
  • FIGS. 1 to 3 show a first exemplary embodiment of a line array with a large number of monolithically integrated reception modules 9.
  • Fig. 1 shows a schematic representation of a line array with a substrate 4 as a carrier, which consists of a transparent semiconductor material for the light guided over optical fibers.
  • a plurality of monolithically integrated optical receiver modules 9 are arranged on one surface of the substrate 4 (FIG. 3, item 6), preferably at uniform intervals.
  • the optical waveguides 2 are arranged at right angles to the substrate surface, in alignment with photosensitive elements, for example photodiodes (FIG. 3, item 10).
  • the optical fibers 2 are part of a short piece of cable 1. Except for electrical connecting terminals 13 of the receiver modules 9, the row array is embedded in a casting compound 15 via the end of the cable piece 1 facing the array for protection and strain relief.
  • the free end of the cable section 1 has optical fiber connection pieces 2a, via which the receiver modules 9 of the line array are spliced onto the optical fibers of a transmission path in a known manner.
  • a module 9 consists essentially of a photodiode 10, a preamplifier 11 and a main amplifier 12, the output of which is connected to an output terminal 13.
  • Fig. 3 shows on an enlarged scale and in a schematic representation a part of the line array of Fig. 1 in cross section.
  • the substrate 4 is provided with preferably evenly spaced blind holes 7. They extend to close to the opposite surface 6 of the substrate 4.
  • the diameter of the blind holes 7 is selected so that the holes 7 form an essentially play-free guide for the ends 3 of the optical waveguides 2 which have been freed from the protective jacket after the vapor deposition of an anti-reflective coating (not shown).
  • the length of the ends 3 is equal to the depth of the blind holes 7.
  • the optical waveguides 2 which bear against the end face of the protective jacket on the substrate surface 5 are fixed in the position shown by gluing 14 to the surface 5.
  • photodiodes 10 are diffused into the blind holes 7, for example in epitaxial layers, in the alignment of the light-sensitive surfaces. Details of such photodiodes can be found in the publication "Physikalischet", Vol. 44 - No. 4 - April 88, pages 91 to 97.
  • the electronic components 11 and 12 associated with the photodiodes 10 are likewise monolithically integrated.
  • FIGS. 4 to 6 show a second exemplary embodiment of a line array with monolithically integrated intermediate amplifier modules 20.
  • Fig. 4 shows - similar to the example described above - in a schematic representation a line array with a substrate 24 as a carrier, which also consists of a transparent semiconductor material for the light emerging from the optical waveguides.
  • a multiplicity of monolithically integrated electrical intermediate amplifier modules 20 are arranged on one side of the substrate 24, preferably at uniform intervals.
  • photosensitive elements e.g. Photodiodes (Fig. 6, item 10) and light-emitting elements (Fig. 6, item 19) of the modules 20, optical fibers 2 and 22 are arranged.
  • the optical fibers 2 and 22 belong to a transmission cable which is divided into an incoming cable 16 and an outgoing cable 21 by splicing the line array.
  • the connected line array is embedded in a casting compound up to the ends of the cables 16 and 21.
  • FIG. 5 shows the circuit of an intermediate amplifier module 20.
  • the light signals arriving via the optical waveguides 2 are converted into electrical signals in a manner known per se via a photodiode 10, amplified in 11 and 12, processed in a regenerator 17 and via a driver stage 18 with a downstream Given laser diode 19 as a regenerated light signal on the respective connected optical fiber 22 on the route.
  • Fig. 6 shows on an enlarged scale and in a schematic representation a part of the line array of Fig. 4 in cross section.
  • the substrate 24 is provided with preferably evenly spaced blind holes 27. They are trained in the manner described above.
  • the light-emitting surface of a laser diode 19 is directed in a central alignment to the associated blind hole 27 to the substrate.
  • Such lasers are known as so-called short cavity LD or surface emitting injection lasers and are described in summary in the conference program of the Ninth IEEE International Semiconductor Laser Conference, August 7-10, 1984, pages 52 and 53.
  • the electronic components 11, 12, 17 and 18 mentioned for signal processing are likewise monolithically integrated and connected to one another via conductor tracks 29.
  • the second exemplary embodiment provides a direct connection of the optical waveguides 2 and 22.
  • a shadow mask 30 with guide holes 31 is arranged on the substrate surface 25.
  • the guide holes 31 have a funnel-shaped widening 32 towards the outside.
  • the shadow mask 30 is so thick that the optical fibers 2 and 22 which have been introduced are already guided in the hole 31 before the optical fiber ends 3 and 23 in the associated blind hole 27 occurs.
  • the staggered arrangement of the optical waveguides 2 and 22 in FIG. 6 illustrates what has been predicted.
  • the optical waveguides 2 and 22 introduced on the stop are fixed by gluing 14 to the shadow mask 30.
  • the required number of modules 9 or 20 can be combined in the form of a surface array.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
EP19910101021 1990-02-10 1991-01-26 Integrated optical transmitter and/or receiver Withdrawn EP0442312A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4004053 1990-02-10
DE19904004053 DE4004053A1 (de) 1990-02-10 1990-02-10 Integrierter optischer empfaenger und/oder sender

Publications (2)

Publication Number Publication Date
EP0442312A2 true EP0442312A2 (fr) 1991-08-21
EP0442312A3 EP0442312A3 (en) 1992-02-26

Family

ID=6399841

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19910101021 Withdrawn EP0442312A3 (en) 1990-02-10 1991-01-26 Integrated optical transmitter and/or receiver

Country Status (2)

Country Link
EP (1) EP0442312A3 (fr)
DE (1) DE4004053A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4425636A1 (de) * 1994-07-20 1996-02-15 Daimler Benz Aerospace Ag Einrichtung zur Aufnahme optischer Elemente
EP0704069A4 (fr) * 1993-05-24 1996-05-29 Vixel Corp Interconnexion optique a fibres paralleles
ES2158827A1 (es) * 2000-02-18 2001-09-01 Fico Mirrors Sa Dispositivo de deteccion de presencia de objetos.
WO2001094995A3 (fr) * 2000-06-05 2003-05-01 Calient Networks Inc Construction de blocs de fibres pour commutateurs optiques et techniques de fabrication correspondantes
US7110633B1 (en) 2001-08-13 2006-09-19 Calient Networks, Inc. Method and apparatus to provide alternative paths for optical protection path switch arrays
EP2762936A1 (fr) * 2013-01-31 2014-08-06 CCS Technology, Inc. Procédé pour former des modules optoélectroniques pouvant être connectés à des fibres optiques et module optoélectronique pouvant être connecté à au moins une fibre optique
US20150331212A1 (en) * 2013-01-31 2015-11-19 Ccs Technology, Inc. Method for forming optoelectronic modules connectable to optical fibers and optoelectronic module connectable to at least one optical fiber

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4142340A1 (de) * 1991-12-20 1993-06-24 Siemens Ag Optoelektronischer ic
DE4440088A1 (de) * 1994-11-10 1996-05-15 Telefunken Microelectron Halbleiterbaugruppe für die bidirektionale, leitungsungebundene, optische Datenübertragung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121684A (en) * 1979-03-13 1980-09-18 Fujitsu Ltd Light semiconductor device
JPS55151377A (en) * 1979-05-16 1980-11-25 Fujitsu Ltd Photo semiconductor device
JPS5691482A (en) * 1979-12-25 1981-07-24 Fujitsu Ltd Photoelectric converter device and light fiber combining system device
GB2086073B (en) * 1980-10-16 1984-02-15 Marconi Co Ltd Electro-optical terminations
DE3142918A1 (de) * 1981-10-29 1983-05-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Opto-elektrische koppelanordnung
JPS5885579A (ja) * 1981-11-17 1983-05-21 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0704069A4 (fr) * 1993-05-24 1996-05-29 Vixel Corp Interconnexion optique a fibres paralleles
US5631988A (en) * 1993-05-24 1997-05-20 Vixel Corporation Parallel optical interconnect
DE4425636A1 (de) * 1994-07-20 1996-02-15 Daimler Benz Aerospace Ag Einrichtung zur Aufnahme optischer Elemente
DE4425636C2 (de) * 1994-07-20 2001-10-18 Daimlerchrysler Aerospace Ag Einrichtung mit einer optischen Komponente zur Integration in batch-processierte dreidimensionale Mikrosysteme
ES2158827A1 (es) * 2000-02-18 2001-09-01 Fico Mirrors Sa Dispositivo de deteccion de presencia de objetos.
WO2001061371A3 (fr) * 2000-02-18 2002-03-21 Fico Mirrors Sa Dispositif de detection de la presence d'objets
US6911642B2 (en) 2000-02-18 2005-06-28 Ficosa North America Corporation Object presence detection method and device
WO2001094995A3 (fr) * 2000-06-05 2003-05-01 Calient Networks Inc Construction de blocs de fibres pour commutateurs optiques et techniques de fabrication correspondantes
US7110633B1 (en) 2001-08-13 2006-09-19 Calient Networks, Inc. Method and apparatus to provide alternative paths for optical protection path switch arrays
EP2762936A1 (fr) * 2013-01-31 2014-08-06 CCS Technology, Inc. Procédé pour former des modules optoélectroniques pouvant être connectés à des fibres optiques et module optoélectronique pouvant être connecté à au moins une fibre optique
WO2014120588A1 (fr) * 2013-01-31 2014-08-07 Ccs Technology, Inc. Procédé de construction de modules optoélectroniques pouvant être connectés à des fibres optiques et module optoélectronique pouvant être connecté à au moins une fibre optique
US20150331212A1 (en) * 2013-01-31 2015-11-19 Ccs Technology, Inc. Method for forming optoelectronic modules connectable to optical fibers and optoelectronic module connectable to at least one optical fiber

Also Published As

Publication number Publication date
DE4004053A1 (de) 1991-08-14
EP0442312A3 (en) 1992-02-26

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