EP0458922A1 - Procede de fabrication d'un composant enduit superficiellement, notamment d'un element de contact pour interrupteur a vide, et dispositif pour la mise en uvre de ce procede. - Google Patents

Procede de fabrication d'un composant enduit superficiellement, notamment d'un element de contact pour interrupteur a vide, et dispositif pour la mise en uvre de ce procede.

Info

Publication number
EP0458922A1
EP0458922A1 EP91900146A EP91900146A EP0458922A1 EP 0458922 A1 EP0458922 A1 EP 0458922A1 EP 91900146 A EP91900146 A EP 91900146A EP 91900146 A EP91900146 A EP 91900146A EP 0458922 A1 EP0458922 A1 EP 0458922A1
Authority
EP
European Patent Office
Prior art keywords
substrate
local area
melted
additive
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP91900146A
Other languages
German (de)
English (en)
Other versions
EP0458922B1 (fr
Inventor
Ekkehard Schade
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Calor Emag AG
Original Assignee
Calor Emag AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Calor Emag AG filed Critical Calor Emag AG
Publication of EP0458922A1 publication Critical patent/EP0458922A1/fr
Application granted granted Critical
Publication of EP0458922B1 publication Critical patent/EP0458922B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/0203—Contacts characterised by the material thereof specially adapted for vacuum switches

Definitions

  • Component in particular a contact piece for one
  • Vacuum switch and device for performing this
  • the invention is based on a method for producing a surface-coated component, in particular a contact piece for a vacuum switch, according to the preamble of claim 1.
  • the invention also relates to a device for carrying out this method.
  • the invention relates to a prior art, such as is described in DE-Al-3541584.
  • a method specified in this patent publication serves to produce metal composite materials from a base material with at least one metal and further active components.
  • a substrate made of the base material is melted locally in a targeted manner by means of energy radiation, and the active component is added to the melting volume.
  • This requires beams with an extremely high beam current density, such as laser beams, and special energy transmission devices with which the active components can be accelerated to high speeds.
  • the invention achieves the object of specifying a method for producing a surface-coated component, in particular a contact piece for a vacuum switch, with which large-area components can also be produced with little outlay on equipment.
  • the method according to the invention enables the production of highly resilient surface-coated components with little outlay on equipment.
  • Low demands are placed on the heat flow source because its beam current density can be kept low. Due to the low jet current density of the heat flow source, evaporation and spraying away of additive are largely avoided in the manufacture of the components.
  • the target stoichiometry of the surface layer is therefore not impaired.
  • Surface layers of up to several millimeters can be easily achieved. Such surface layers are particularly suitable as an arcing contact layer of the contact pieces of vacuum switches, particularly when they are designed as copper-chrome layers.
  • Fig.l an apparatus for performing the method according to the invention
  • Figure 2 is a plan view of a perpendicular to
  • FIG. 3 shows a plan view of the location of the substrate 1 shown in section in FIG. 2.
  • the substrate 1 is, for example, a copper disc of approximately 40 mm in diameter and approximately 8 mm in thickness, but can also any other suitable metallic body.
  • the support device 3 consists, for example, of a good heat-conducting material, such as preferably copper or silver, and has a support 5 mounted on a rotating device 4 which is cooled approximately with water. 6 denotes a heat flow source.
  • This heat flow source advantageously emits high-energy corpuscular beams, such as electron or ion beams, but can also be designed as a Hall generator or any other suitable device.
  • This heat flow source advantageously has a beam current density of a few to a few hundred kilowatts per square centimeter.
  • the heat flow source advantageously has a total output of a few hundred watts up to approx. 20 kilowatts.
  • 7 denotes an additive supply device for receiving a powdery additive 8, which is trickled down onto the surface of the substrate 1 in the direction of the arrows 9 to form a powder layer 10.
  • the additive preferably has lower thermal conductivity than the substrate 1 and can contain chromium or an alloy based on chromium and copper when producing a contact piece for a vacuum switch with a backing consisting predominantly of copper.
  • the substrate 1 which then contains predominantly copper, the additive 8 which then contains predominantly chromium powder, and the heat flow source 6, which operates approximately on the basis of electron beams, are in a vacuum of approx. 10 ⁇ 6 mbar.
  • the support device 3 rotates about an axis 11 such that an average advance of the substrate 1 relative to the heat flow source 6 of, for example, 5-10 cm / s is achieved.
  • An energy flow 12 emitted by the heat flow source 6 simultaneously falls on one Part of the substrate surface. This energy flow has an expansion of, for example, 0.25 to 1 cm 2 on impact and has a current density of, for example, 20 kW / cm 2 at the point of impact.
  • the energy flow 12 is almost completely absorbed by the substrate 1 and therefore supplies the substrate 1 with heat.
  • the heat supplied to the substrate 1 is conducted from the impingement area of the energy flow 12 through heat conduction into the entire substrate 1. In this way and due to the rotation of the substrate 1 and any oscillation of the energy flow, overheating of the impact area is avoided.
  • the substrate 1 is preheated to a temperature which is considerably above room temperature but below its melting temperature. With the copper disc described above, this preheating temperature is approx. 700 - 1000 ° C.
  • the output power of the heat flow source 6 is reduced during the preheating of the substrate 1. After reaching the preheating temperature, the beam 12 has a current density of only a few kW / cm 2 .
  • the preheating temperature can be set at a predetermined power of the heat flow source 6 by suitable heat dissipation via the support device 3.
  • the contact surface 2 can be kept at the desired temperature by appropriately enlarging or reducing the cross section of the support 5.
  • a part 17 made of a single piece between the substrate 1 and the support 5 leading to cooling compared to the rest of the material of the support device 3 is comparatively poorly heat-conducting material, such as stainless steel.
  • the suitable setting of the temperature can of course also be achieved by jointly using both of the measures described above.
  • the support surface 2 should have a temperature of 500-600 ° C.
  • the comparatively low energy conducted by the energy flow 12 into the substrate 1 is sufficient to melt the material of the substrate in a local area 15.
  • the powder layer 10 is brought onto the surface of the substrate 1.
  • the coating formed by loose powder is typically 25-50 mg / cm 2 .
  • the local area 15 is guided to and through the powder layer 10 by rotation of the support device 3. Liquid material located in the locally melted region, for example copper, wets powder located in the powder layer 10 or soaks the powder layer 10 by predominantly effective capillary forces. This effect can be increased by further additives if necessary.
  • the support device 3 or the heat flow source 6 and the additive supply device 7 By rotating the support device 3 or the heat flow source 6 and the additive supply device 7 about the vertically extended axis 11, which is guided centrally through the support table 3, and by additionally radially, preferably oscillating, movements of the heat flow source 6 and additive supply device 7 can be achieved, that almost the entire surface of the substrate 1 is successively melted and coated.
  • the melting of the substrate 1 can, of course, also be carried out by a translational displacement in a horizontal xy plane, with the heat flow source 6 in the x and y directions between the Edges of the substrate 1 back and forth, and the support surface 2 is shifted approximately in the y direction.
  • the additive feed device 7 should be moved according to its displacement with the substrate 1 rotating.
  • an approximately 50-100 ⁇ m thick surface layer 16 can be produced in this way.
  • This layer is also characterized, inter alia, in that the substrate 1 and thus also the surface layer 16 are largely gas-free due to the comparatively slow and large-area melting.
  • layer thicknesses of up to several millimeters can be produced without any problems.
  • Different layer thicknesses and / or predetermined surface profiles can be produced by suitably controlling the power and the current density of the energy flow 12, the heating time of the local area 15 and / or the amount of the additive 8 supplied.
  • Vacuum switches equipped with contact pieces manufactured in this way have significantly improved breaking capacities compared to vacuum switches with comparable dimensions but with contact pieces manufactured according to conventional methods.
  • the surface layer 16 is briefly heated to a temperature substantially above the melting temperature of the substrate 1, at least over part of its outer surface and starting from its outer surface at least over part of its depth.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacture Of Switches (AREA)
  • High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)

Abstract

L'invention permet de fabriquer des composants enduits superficiellement, tels que des éléments de contact pour interrupteurs à vide, en amenant à fusion un substrat métallique (1) au niveau de sa surface, au moyen d'un flux d'énergie (12) dans une zone locale (15), et en réunissant une substance d'apport (8) avec le matériau fondu de ladite zone locale (15). Grâce à ce procédé, des éléments, même de grande surface, peuvent être fabriqués en ayant recours à un appareillage réduit. Ce résultat est atteint grâce aux dispositions suivantes: le substrat (1) est préchauffé avant d'amener à fusion la zone locale (15), ce préchauffage s'effectuant à une température bien supérieure à la température ambiante, mais toutefois inférieure à sa température de fusion. Après préchauffage, la zone locale (15) est amenée à fusion à la surface du substrat, et la substance d'apport (8) est appliquée sur la surface du substrat, sous forme d'une couche pulvérulente mobile (10). La zone locale (15) fondue par le flux d'énergie (12) est guidée en direction et à travers la couche pulvérulente (10) et est alors humidifiée dans la poudre se trouvant dans la couche pulvérulente (10), ou bien la couche pulvérulente (10) est imprégnée par le matériau liquide provenant de la zone locale portée à fusion (15), grâce à quoi la poudre de ladite couche pulvérulente (10) se trouve liée à la surface du substrat (1), ce qui aboutit à la formation de la couche superficielle (16) recherchée.
EP91900146A 1989-12-15 1990-12-17 Procede de fabrication d'un composant enduit superficiellement, notamment d'un element de contact pour interrupteur a vide, et dispositif pour la mise en oeuvre de ce procede Expired - Lifetime EP0458922B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH4513/89 1989-12-15
CH451389 1989-12-15
PCT/CH1990/000285 WO1991009409A1 (fr) 1989-12-15 1990-12-17 Procede de fabrication d'un composant enduit superficiellement, notamment d'un element de contact pour interrupteur a vide, et dispositif pour la mise en ×uvre de ce procede

Publications (2)

Publication Number Publication Date
EP0458922A1 true EP0458922A1 (fr) 1991-12-04
EP0458922B1 EP0458922B1 (fr) 1995-06-07

Family

ID=4277496

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91900146A Expired - Lifetime EP0458922B1 (fr) 1989-12-15 1990-12-17 Procede de fabrication d'un composant enduit superficiellement, notamment d'un element de contact pour interrupteur a vide, et dispositif pour la mise en oeuvre de ce procede

Country Status (6)

Country Link
US (1) US5254185A (fr)
EP (1) EP0458922B1 (fr)
JP (1) JPH04503732A (fr)
AT (1) ATE123587T1 (fr)
DE (1) DE59009215D1 (fr)
WO (1) WO1991009409A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997014163A1 (fr) * 1995-10-10 1997-04-17 Abb Patent Gmbh Procede et dispositif de fabrication d'une piece de contact

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19612143B4 (de) * 1996-03-27 2005-05-04 Abb Patent Gmbh Verfahren zur Herstellung eines Spiralkontaktstückes für eine Vakuumkammer und Vorrichtung zur Durchführung des Verfahrens
DE19632573A1 (de) * 1996-08-13 1998-02-19 Abb Patent Gmbh Verfahren zur Herstellung einer Kontaktanordnung für eine Vakuumkammer und Kontaktanordnung
DE19650752C1 (de) * 1996-12-06 1998-03-05 Louis Renner Gmbh Kupfer-Chrom-Kontaktwerkstoff mit feinkörnig umgewandelter Oberfläche für elektrische Schaltkontakte und Verfahren zu dessen Herstellung
US6423162B1 (en) * 1999-07-02 2002-07-23 The University Of Tennesse Research Corporation Method for producing decorative appearing bumper surfaces
DE102011006899B4 (de) * 2011-04-06 2025-01-30 Te Connectivity Germany Gmbh Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement und eine Vorrichtung zur Herstellung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2175606A (en) * 1939-10-10 Method and apparatus fob alloying
DE2014638A1 (de) * 1970-03-26 1971-10-14 Siemens Ag Verfahren zur Herstellung eines Zweischichten Kontaktstuckes
GB2047567B (en) * 1979-03-16 1983-12-14 Dodd K H Coating with parachute material
DE3050651A1 (de) * 1980-11-28 1982-11-18 N Proizv Ob Tulatschermet Method of preparation of contacts and electrodes of vacuum electric apparatuses
US4750947A (en) * 1985-02-01 1988-06-14 Nippon Steel Corporation Method for surface-alloying metal with a high-density energy beam and an alloy metal
JPS61270335A (ja) * 1985-05-24 1986-11-29 Toyota Motor Corp 内燃機関用肉盛バルブ
DE3541584A1 (de) * 1985-11-25 1987-05-27 Siemens Ag Verfahren und vorrichtung zum herstellen von metall-verbund-werkstoffen sowie damit hergestellte kontaktstuecke fuer elektrische schaltgeraete

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9109409A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997014163A1 (fr) * 1995-10-10 1997-04-17 Abb Patent Gmbh Procede et dispositif de fabrication d'une piece de contact

Also Published As

Publication number Publication date
EP0458922B1 (fr) 1995-06-07
DE59009215D1 (de) 1995-07-13
US5254185A (en) 1993-10-19
WO1991009409A1 (fr) 1991-06-27
JPH04503732A (ja) 1992-07-02
ATE123587T1 (de) 1995-06-15

Similar Documents

Publication Publication Date Title
DE2740569A1 (de) Oberflaechenlegierungs- und waermebehandlungsverfahren
DE102011006899B4 (de) Verfahren zur Herstellung von Kontaktelementen durch mechanisches Aufbringen von Materialschicht mit hoher Auflösung sowie Kontaktelement und eine Vorrichtung zur Herstellung
EP0383844B1 (fr) Materiaux ou piece stratifies et leur procede de fabrication
DE102010025967A1 (de) Positionieren von Mikrolöchern
DE1185305B (de) Verfahren zum Loeten, Schweissen und Abtragen von Materialien mittels eines Ladungstraegerstrahls
EP0558135B1 (fr) Procédé pour engendrer un dessin dans la surface d'une pièce d'oeuvre
DE2814044A1 (de) Verfahren zum herstellen eines loches in einem werkstueck mit hilfe von laserstrahlung
DE68906793T2 (de) Ein einen laserstrahl benutzendes verfahren zur mikrobearbeitung der fläche eines werkstücks.
EP0458922B1 (fr) Procede de fabrication d'un composant enduit superficiellement, notamment d'un element de contact pour interrupteur a vide, et dispositif pour la mise en oeuvre de ce procede
DE102017103650B4 (de) Verfahren für das selektive laserstrahlhartlöten
DE102020204989B3 (de) Verfahren zur additiven Fertigung eines Schaltungsträgers und Schaltungsträger
DE3007169C2 (de) Verfahren zur Herstellung von Mikrobohrungen in Metallteilen mit Hilfe eines Leistungs-Lasers
DE69806294T2 (de) Maskierungsmethode zur lokalen Carbonisierung oder Nitrierung eines Metalles
CH667107A5 (de) Verfahren und vorrichtung zur materialverdampfung.
DE3541584C2 (fr)
EP1640108B1 (fr) Procédé de fabrication d'un contact
DE69705671T2 (de) Verfahren zur Verwendung von Kupfer-Basis-Elektroden für das Punktschweissen von Aluminium
DE2937108C2 (fr)
DE4212035C2 (de) Verfahren zum Umschmelzen von Oberflächen von Werkstücken mit Laserstrahlung
DE112023002699T5 (de) Verfahren zur herstellung eines keramik-metall-verbundobjekts
DE19520149A1 (de) Endkonturnahes Laserstrahlbeschichten mit Kokille
WO1995027307A1 (fr) Procede et dispositif pour realiser des bossages de brasage
DE19821772A1 (de) Keramische Verdampferschiffchen mit verbessertem Erstbenetzungsverhalten
DE1796166A1 (de) Verfahren und Vorrichtung zum Aufbringen duenner Schichten auf die Oberflaeche von Gegenstaenden
DE1218411B (de) Verfahren zur Herstellung eines duennen einkristallinen Plaettchens

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19910527

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT CH DE GB LI

17Q First examination report despatched

Effective date: 19940222

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT CH DE GB LI

REF Corresponds to:

Ref document number: 123587

Country of ref document: AT

Date of ref document: 19950615

Kind code of ref document: T

REF Corresponds to:

Ref document number: 59009215

Country of ref document: DE

Date of ref document: 19950713

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19950904

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19961014

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 19961024

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 19961029

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971217

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971217

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971231

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971231

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19971217

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19981021

Year of fee payment: 9

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20001003