EP0459994A1 - Procede de revetement en continu de fils metalliques et utilisation des fils metalliques ainsi obtenus - Google Patents

Procede de revetement en continu de fils metalliques et utilisation des fils metalliques ainsi obtenus

Info

Publication number
EP0459994A1
EP0459994A1 EP90902181A EP90902181A EP0459994A1 EP 0459994 A1 EP0459994 A1 EP 0459994A1 EP 90902181 A EP90902181 A EP 90902181A EP 90902181 A EP90902181 A EP 90902181A EP 0459994 A1 EP0459994 A1 EP 0459994A1
Authority
EP
European Patent Office
Prior art keywords
weight
parts
wire
electrically conductive
polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP90902181A
Other languages
German (de)
English (en)
Inventor
Klaus-Wilhelm Lienert
Knut Von Loh
Hans Joachim Reiser
Paul Mertens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Farben und Fasern AG
Lacroix und Kress GmbH
Original Assignee
Lackdraht Union GmbH
BASF Lacke und Farben AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lackdraht Union GmbH, BASF Lacke und Farben AG filed Critical Lackdraht Union GmbH
Publication of EP0459994A1 publication Critical patent/EP0459994A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils

Definitions

  • the present invention relates to a process for the continuous layering of wires, in which
  • a further, electrically conductive layer is applied to the insulating layer by the electrically insulated wire produced in process step (I).
  • conductive paint is coated.
  • the present invention also relates to wires produced by this method and the use of these wires as an energy-storing inductive winding.
  • this conductive layer is produced by applying a thin metal layer.
  • this metal layer cannot be applied with the aid of conventional wire coating machines, so that the wire coating machine is used for Manufacture of such winding wires requires additional investment.
  • the metallic layer is problematic when processing the winding wire because it tears when the wire is stretched in the winding machine.
  • the present invention was therefore based on the object of providing a method according to the preamble of the first claim, in which both the insulating lacquer and the conductive lacquer are applied to the most varied wire diameters, in particular also to thin wires (wire diameter ⁇ 0, 35 mm) can be applied and hardened.
  • the wires produced by this method should be used as winding wires for the production of e.g. B. coils, relays, contactors, motors and other electronic devices in which inductors and capacitors can be used. These winding wires should also be able to be further processed in the usual way.
  • both the insulating and the electrically conductive coating have a sufficiently high elasticity so that the coating does not break when the wires are wound.
  • the coating must also have a sufficiently high hardness to withstand the mechanical stresses in the manufacture of coils and Like. Without resisting damage.
  • the object on which the invention is based is surprisingly achieved by a process of the type mentioned at the outset, which is characterized in that A) the insulating lacquer applied directly to the wire surface is selected from the group consisting of a) polyesterimide wire enamels, consisting of a solvent solution or an aqueous solution or an aqueous dispersion of a polyesterimide resin, the hydroxyl numbers of the polyesterimides being in the range from 50 to 200 mg KOH / g and 20 to 60% by weight solutions of the polyesterimides in organic solvents at 23 ° C. viscosities in the range from 80 to Have 15000 mPas, or
  • polyester wire enamels consisting of a solvent solution or an aqueous dispersion of a polyester resin, the polyesters having a ratio of hydroxyl to carboxyl groups of 1.1: 1 to 2.0: 1 and 20 to 60% by weight solutions of the polyesters have viscosities in the range of 40 to 12000 mPas in organic solvents at 23 oC,
  • polyamideimide wire enamels consisting of a solvent solution of a polyamideimide, 20 to 40% by weight solutions of the polyamideimides at 23 ° C. having viscosities in the range from 800 to 3000 mPas,
  • the conductive lacquer applied to the insulated wire is also selected from the group of
  • polyesterimide wire enamels Aa or the polyester wire enamels Ab the electrical conductivity of these wire enamels being produced by adding
  • Polyester resin 1) 2 to 20 parts by weight of electrically conductive carbon black per 100 parts by weight of polyesterimide or.
  • polyesterimide resins used as component Aa are known and are described, for example, in DE-OS 14 45 263 and DE-OS 14 95 100.
  • the polyesterimides are prepared in a known manner by esterifying the polyhydric carboxylic acids with the polyhydric alcohols, optionally with the addition of oxycarboxylic acids , and using starting materials containing imide groups. Instead of the free acids and / or alcohols, their reactive derivatives can also be used.
  • Terephthalic acid is preferably used as the carboxylic acid component, and ethylene glycol, glycerol and tris-2-hydroxyethyl isocyanurate are preferably used as polyhydric alcohols, the latter being particularly preferred. The use of tris-2-hydroxyethyl isocyanurate leads to an increase in the softening temperature of the paint film obtained.
  • the starting materials containing imide groups can be obtained, for example, by reaction between compounds, one of which must have a five-membered, cyclic carboxylic acid anhydride group and at least one further functional group, while the other contains at least one further functional group in addition to a primary amino group.
  • These other functional groups are primarily carboxyl groups or hydroxyl groups, but they can also be other primary amino groups or carboxylic anhydride groups.
  • Examples of compounds having a cyclic carboxylic acid anhydride grouping with a further functional group are, above all, pyromellitic dianhydride and trimellitic anhydride.
  • aromatic carboxylic acid anhydrides are also possible, for example the naphthalene tetracarboxylic acid dianhydrides or dianhydrides of tetracarboxylic acids with two benzene nuclei in the molecule, in which the carboxyl groups are in the 3,3 ', 4- and 4'-positions.
  • Examples of compounds with a primary amino group and a further functional group are in particular diprimary diamines, e.g. B. ethylenediamine, tetramethylenediamine, hexamethylenediamine, nonamethylenediamine and other aliphatic diprimary diamines.
  • diprimary diamines e.g. B. ethylenediamine, tetramethylenediamine, hexamethylenediamine, nonamethylenediamine and other aliphatic diprimary diamines.
  • aromatic diprimary diamines such as benzidine, diaminodiphenylmethane, diaminodiphenyl ketone, sulfone, sulfoxide, ether and thioether, phenylenediamines, toluenediamines, xylylenediamine and also diamines with three benzene nuclei in the molecule, such as bis (4-aminophenyl) , ⁇ '-p-xylene or bis (4-aminophenoxy) - 1,4-benzene, and finally cycloaliphatic diamines such as 4,4'-dicyclohexylmethane diamine.
  • aromatic diprimary diamines such as benzidine, diaminodiphenylmethane, diaminodiphenyl ketone, sulfone, sulfoxide, ether and thioether, phenylenediamines, toluenediamines, xylyl
  • Amino alcohol-containing compounds with a further functional group are also amino alcohols, z.
  • monoethanolamine or monopropanolamines furthermore aminocarboxylic acids such as glycine, aminopropionic acids, aminocaproic acids or aminobenzoic acid.
  • Known transesterification catalysts are used to produce the polyesterimide resins, for example heavy metal salts such as lead acetate, zinc acetate, furthermore organic titanates, cerium compounds and organic acids, such as, B. para-toluenesulfonic acid.
  • the same transesterification catalysts can be used as crosslinking catalysts in the curing of the polyesterimides - advantageously in a proportion of up to
  • Solvents suitable for the production of the polyesterimide wire enamels are cresolic and non-cresolic organic solvents such as, for example, cresol, phenol, glycol ethers such as, for. B. methyl glycol, ethyl glycol, isopropyl glycol, butyl glycol, methyl diglycol, ethyl diglycol, butyl diglycol; Glycol ether esters, e.g. B. methyl glycol acetate, ethyl glycol acetate, butyl glycol acetate and 3-methoxy-n-butyl acetate; cyclic carbonates, such as B.
  • Aromatic solvents can also be used, if appropriate in combination with the solvents mentioned. Examples of such solvents are xylene, Solventnaphtha ® , toluene, ethylbenzene, cumene, heavy benzene, various Solvesso ® - and
  • Shellsol ® types and Deasol ® Shellsol ® types and Deasol ® .
  • aqueous polyesterimide solutions or dispersions in the process according to the invention.
  • the water solubility or water dispersibility of the polyester imides is such. B. described in DE-PS 17 20 321, by introducing a sufficiently high number of carboxyl groups into the polyesterimide resin and neutralizing the carboxyl groups with an amine.
  • the viscosities of 20 to 60% by weight solvent solutions of the polyesterimides at 23 ° C. are in the range from 80 to
  • polyester resins used as component Ab are also known and are described, for example, in US Pat. Nos. 3,342,780 and EP-B-144 281.
  • the polyester is prepared in a known manner by esterifying polyvalent carboxylic acids with polyhydric alcohols in the presence of suitable catalysts.
  • Alcohols suitable for the production of the polyesters are, for example, ethylene glycol, propylene glycol 1,2 and 1,3,
  • Mixtures of ethylene glycol and tris-2-hydroxyethyl isocyanurate are preferably used.
  • the use of tris-2-hydroxyethyl isocyanurate leads to high softening temperatures of the lacquer layer.
  • Suitable carboxylic acids are for example phthalic acid, isophthalic acid, terephthalic acid and their esterifiable derivatives such as.
  • Both the half esters, the dialkyl esters and mixtures of these compounds can be used.
  • the corresponding acid halides of these compounds can also be used.
  • polyesters have a ratio of hydroxyl to carboxyl groups from 1.1: 1 to 2.0: 1, preferably from 1.15: 1 to 1.60: 1.
  • Suitable catalysts for the production of the polyester which are used in amounts of 0.01 to 5% by weight, based on the mixture, are conventional esterification catalysts. Examples of suitable compounds have already been given in the description of the polyesterimides Aa.
  • Suitable solvents for the polyester Ab are the solvents also listed in the description of the polyesterimides. At this point, therefore, for more details
  • the viscosities of the 20 to 60 wt .-% solvent solutions of the polyester are at 23 ° C in the range of 40 to 12000 mPas.
  • the polyurethane-based Ac wire enamels used in the process according to the invention are already known and are described, for example, in DE-OS 28 40 352 and DE-OS 25 45 912 described.
  • the wire enamels are produced in a known manner by dissolving a hydroxyl-containing polyester with an OH number of 100 to 450 mg KOH / g, preferably from 150 to 400 mg KOH / g and a blocked isocyanate adduct in a cresolic or non-cresolic solvent or solvent mixture.
  • polyester wire enamels Ab The same structural components (polyol and polycarboxylic acid) and the same reaction conditions as in the production of the polyester wire enamels Ab can be used for the production of the hydroxyl-containing polyesters.
  • the isocyanate adducts are prepared by reacting a diisocyanate with a polyol, the amounts of these compounds being chosen so that the NCO: OH equivalent ratio is between 1: 2 and 9: 1. The remaining free isocyanate groups of this adduct are reacted with a blocking agent.
  • the structure of the isocyanate adduct is advantageously carried out in a solvent which is inert to isocyanant groups and the polyurethane which readily dissolves, in the presence of a catalyst, at from 30 to 120 ° C.
  • diisocyanates examples include trimethylene diisocyanate, tetramethylene diisocyanate, pentamethylene diisocyanate, hexamethylene diisocyanate, propylene diisocyanate, ethylethylene diisocyanate, 2,3-dimethylethylene diisocyanate, 1-methyltrimethylene diisocyanate, 1,3-cyclopentylene diisocyanate, 1,4-cyclohexylene diisocyanate diisocyanate, 1,2-diisocyanate diisocyanate, 1,2-diisocyanate diisocyanate, 1,2-diisocyanate diisocyanate, 1,2-cyclohexylene diisocyanate, 1,2-diisocyanate, 1,2-diisocyanate, 1,2-diisocyanate , 1,4-phenylene diisocyanate,
  • Suitable polyols for adduct formation are trimethylolpropane, neopentyl glycol, glycerin, hexanetriol, pentaerythritol and glycols such as, for. B. ethylene glycol and propylene glycol. Trimethylolpropane is preferably used. An adduct of 1 mol of trimethylolpropane and 3 mol of tolylene diisocyanate and / or bis (4-isocyanatophenyl) methane is very particularly preferably used.
  • blocking agents are suitable for blocking the free isocyanate groups, but it must be ensured that deblocking only occurs at temperatures above 120 ° C.
  • suitable compounds are aliphatic, cycloaliphatic or aromatic alcohols such as. B. butanol, isobutanol, 2-ethylhexanol, cyclohexanol, cyclopentanol, benzyl alcohol, phenols, cresols; ⁇ -Hydroxykylether such as. B. methyl, ethyl, butyl glycol; Amines such as B. di-n-butylamine, di-n-hexylamine; Oximes such as B.
  • Phenol and / or cresol are used as the preferred blocking agent.
  • Suitable inert solvents are for example heterocyclic, aliphatic or aromatic hydrocarbons, ethers, esters and ketones such as.
  • the content of blocked isocyanate adduct in the wire enamel Ac is between 30 and 90% by weight, based on the sum of the blocked isocyanate adduct and the hydroxyl-containing polyester.
  • Wire enamels based on polyurethane are preferably used both as an insulating enamel and particularly as an electrically conductive enamel, especially when thin wires ( ⁇ ⁇ 0.35 mm) are to be coated.
  • Wire enamels based on polyurethane have the advantage that they are directly solderable / tinnable and that they have low viscosities with a high solids content. This is particularly advantageous with regard to high application speeds and with regard to the maximum amount of soot that can be incorporated.
  • Polyurethanes as conductive lacquers also have the advantage that, when they are coated on polyester or polyesterimide insulating lacquers, they can be removed simply by melting on part of the wire. This is e.g. B. then of importance if the Cu wire conductor is contacted without the conductive lacquer layer being connected.
  • the viscosities of 15 to 50% by weight solutions of the polyurethanes at 23 ° C. are in the range from 50 to 10,000 mPas.
  • the wire enamels Ad based on polyamideimide are also known and are described, for example, in US Pat. No. 3,554,984, DE-OS 24 41 020, DE-OS 25 56 523, DE-AS 12 66 427 and DE-OS 19 56 512.
  • the polyamideimides are prepared in a known manner from polycarboxylic acids or their anhydrides, in which 2 carboxyl groups are in the vicinal position and which must have at least one further functional group, and from polyamines with at least one primary amino group capable of imid ring formation or from compounds with at least 2 Isocyanate groups.
  • the polyamideimides can also be obtained by reacting polyamides, polyisocyanates which contain at least 2 NCO groups and cyclic dicarboxylic anhydrides which contain at least one further group capable of condensation or addition.
  • polyamideimides from diisocyanates or diamines and dicarboxylic acids if one of the components already contains the imide group.
  • a tricarboxylic anhydride can first be reacted with a diprimary diamine to give the corresponding diimidocarboxylic acid, which then reacts with a diisocyanate to give the polyamideimide.
  • Tricarboxylic acids or their anhydrides in which 2 carboxyl groups are in the vicinal position are preferably used for the production of the polyamideimides.
  • the corresponding aromatic tricarboxylic anhydrides such as. B. trimellitic anhydride, naphthalene tricarboxylic acid anhydrides, bisphenyltricarboxylic acid anhydrides and other tricarboxylic acids with 2 benzene nuclei in the molecule and
  • 2 vicinal carboxyl groups such as the examples listed in DE-OS 19 56 512.
  • Trimellitic anhydride is very particularly preferably used.
  • the diprimary diamines already described for the polyamidocarboxylic acids can be used as the amine component.
  • aromatic diamines containing a thiadiazole ring such as. B. 2,5-bis- (4-aminophenyl) -1,3,4-thiadiazole, 2,5-bis- (3-aminophenyl) -1,3,4-thiadiazole, 2- (4-aminophenyl) - 5- (3-aminophenyl) -1,3,4-thiadiazole and mixtures of the different isomers.
  • Suitable diisocyanates for the preparation of the polyamideimides are aliphatic diisocyanates such as. B. tetramethylene, hexamethylene, heptamethylene and trimethylhexamethylene diisocyanates; cycloaliphatic diisocyanates such as B. isophorone diisocyanate, ⁇ , ⁇ '-diisocyanate-1,4-dimethylcyclohexane,
  • Suitable polyamides are those polyamides which are obtained by polycondensation of dicarboxylic acids or their derivatives with diamines or of aminocarboxylic acids and their derivatives such as, for. B. lactamnen have been obtained.
  • polyamides may be mentioned by way of example: dimethylene succinic amide, pentamethylene pimelic acid amide, undecane methylene tridecanedicarboxylic acid amide, hexamethylene adipic acid amide, hexamethylene sebacic acid amide, polycaproic acid amide.
  • Hexamethylene adipic acid amide and polycaproic acid amide are particularly preferred.
  • Suitable solvents are - as in the case of polyamidocarboxylic acids - those organic compounds whose functional groups do not react to a large extent with the starting materials and which dissolve at least 1 component, preferably both starting materials and the polyamideimide.
  • Examples are N, N-dimethylformamide, N, N-dimethylacetamide, N, N-diethyl formamide, N, N-diethylacetamide, N, N-dimethylmethoxyacetamide, N-methylcaprolactam, dimethyl sulfoxide, N-methylpyrrolidone, tetramethylurea, pyridine, formamide, N -Methylformamide, N-acetylpyrrolidone, dimethyl sulfone, tetramethylene sulfone and hexamethyl phosphoramide.
  • soluble heavy metal salts such as. B. zinc octoate, cadmium octoate, tetraisopropyl titanate or tetrabu tyltitanat in an amount of up to 3 wt .-%, based on the binder, are used.
  • the viscosities of 20 to 40% by weight solutions of the polyamideimides at 23 ° C. are in the range from 800 to 3000 mPas.
  • the wire enamels Aa to Ad optionally contain conventional auxiliaries and additives and leveling agents in conventional amounts, preferably
  • the solvent content of the wire enamels Aa to Ad is generally between 40 and 80% by weight, based on the overall formulation, but the solvent content depends on the coating viscosity to be set in each case.
  • the electrically conductive lacquers used in the second step of the process according to the invention also consist of the known wire lacquers based on polyesterimide (wire lacquer Aa), polyester (wire lacquer Ab), polyurethane-based (wire lacquer Ac) and polyamide-imide-based (wire lacquer ad) described above. .
  • electrically conductive carbon black and / or graphite is additionally added to these coatings. The amount of carbon black and / or graphite added depends on the binder base of the wire enamel. It also depends on whether carbon black or graphite is added as the sole component, or whether a combination of electrically conductive carbon black and graphite is used.
  • any electrically conductive carbon black that can be wetted by the wire enamels Aa to Ad can be used.
  • the average particle size of the carbon black used should be such that smooth paint surfaces result. This means that the maximum average particle size of the carbon black used must be smaller than the dry film thickness of the conductive lacquer layer after a single application.
  • the graphite which can be used must also be wettable by the wire enamels Aa to Ad. In addition, a smooth paint film must result.
  • a varnish with a high soot / graphite content which can be painted with a high application speed.
  • the wires obtained can be soldered directly. If the conductive varnishes based on polyurethane are coated on polyester or polyesterimide insulating varnishes, there is the further advantage that the conductive varnish and the insulating varnish can be removed separately by selective melting.
  • a further preferred embodiment of the method according to the invention is a method in which an insulating varnish is also applied to the electrically conductive layer and isolates the conductive layer from the outside.
  • the wire enamels based on polyesterimide, polyester, polyurethane and polyamideimide already described on pages 5 to 14 are suitable for this. For details, reference is therefore made to these pages of the description.
  • Both the insulating and the electrically conductive lacquer are applied and hardened using conventional painting machines.
  • the required paint film thickness is built up by at least 1 to 10 individual orders, whereby each individual coat of paint is cured without bubbles before the next coat of paint is applied.
  • Conventional painting machines operate at a take-off speed of 5 to 180 m / min, depending on the binder base of the wire enamel and the thickness of the wire to be coated. Typical oven temperatures are between 300 oC and
  • the wires produced by the method according to the invention are outstandingly suitable for use as winding wires for the production of various electronic components, such as, for. As relays, coils, motors, etc. Since the wires according to the invention also have capacitive properties due to their structure (series capacitor), they are particularly well suited for the production of capacitively energy-storing windings such as these z. B. are described in DE-OS 36 04 579. In many cases, such windings can replace the capacitor and coil where they interact.
  • the wires produced by the method according to the invention can, for example, due to the high elasticity of the conductive lacquer layer. B. stretched in the winding machine without the conductive layer tearing.
  • Another important advantage of the method according to the invention is that the conductivity of the conductive lacquer layer can be controlled within wide ranges via the content of electrically conductive carbon black and / or graphite, whereas this is not possible with a metallic layer.
  • a dimethyl terephthalate, 10.2 parts of trishydroxyethyl isocyanurate (THEIC), 11.5 parts of trimellitic anhydride and 5.9 parts of 4,4'-diaminodiphenylmethane are prepared in the presence of 0.04 part of tetra-n-butyl titanate.
  • This polyesterimide is one in 56 parts Mixture of Kresol / Solventnaphtha ® dissolved in a ratio of 2: 1 and mixed with 0.7%, based on the total recipe, of a commercially available titanium catalyst.
  • the wire enamel 2 thus obtained has a solids content of 39% (1 hour / 180 ° C.) at a viscosity of 800 mPas (23 ° C.).
  • the polyamideimide is prepared by the method described in DE-AS 12 66 427 from 38.5 parts of trimellitic anhydride and 60.0 parts of diphenylmethane diisocyanate.
  • a 33% solution in N-methylpyrrolidone has a viscosity of 1500 mPas at 23 ° C.
  • Example 1 1000 parts of wire enamel 1 based on polyurethane, 270
  • a copper wire (diameter 0.71 mm) is drawn off at a take-off speed of 28 m / min on a commercially available
  • the conductive varnish 1 (which was also used in Example 1) is then applied to this wire enamel at a stripping speed of 24 m / min with 6 passes and at
  • a wire coated with insulating varnish and conductive varnish is produced analogously to example 2, in contrast to example 2 the oven temperature being 420-460 ° C. both during the hardening of the insulating varnish layer and during the hardening of the conductive varnish layer.
  • a coated wire with the resistance and capacitance values given in Table 1 is obtained at a coating speed of 26 m / min.
  • Parts of the carbon black used in Example 1 are finely dispersed for 30 min at 2330 revolutions / min. The so made
  • Conductive varnish 2 has a solids content of 32.8% (1 hour / 180 ° C.).
  • a copper wire (0.71 mm) is coated with the wire enamel 2 at a take-off speed of 28 m / min on a commercially available coating machine with 8 passages and baked at 500 to 520 ° C.
  • the conductive lacquer 2 described above is then applied to this wire enamel layer and baked (dry layer thickness 42 ⁇ m).
  • the capacity and the resistance of the conductive lacquer layer were measured from a 1 m long wire coated in this way. The results are shown in Table 1.
  • Example 5 500 parts of wire enamel 2 based on polyesterimide, 10.4
  • a copper wire (0 1 mm) is coated with the wire enamel 2 (dry layer thickness 50 ⁇ m).
  • the capacitance and the resistance of the conductive layer were measured from such a coated wire.
  • Example 2 dispersed 10 min at 1835 revolutions / min.
  • This lacquer is diluted with 30 parts of cresol and 30 parts of Solventnaphtha ® to a viscosity of 900 mPas (23 ° C).
  • the conductive lacquer 4 thus obtained has a solids content of 39.1% (1 h / 180 ° C.).
  • a copper wire (diameter 1 mm) is made on a conventional painting machine (oven length 3 m, 7 paint jobs,
  • the above-described conductive lacquer 4 with 5 passes is then applied to this wire enamel layer in the same lacquering machine at a stripping speed of 8.5 m / min and baked at 520 to 540 ° C.
  • the capacitance and resistance of the conductive lacquer layer are measured from a 1 m long wire coated in this way.
  • the conductive lacquer 5 thus produced has a solids content of
  • the conductive lacquer 5 is applied in a layer thickness of 35 ⁇ m onto a 1 mm Cu wire, coated with wire enamel 2 (dry film thickness 50 ⁇ m).
  • Conductive lacquer layer has a resistance of 960 k ⁇ / m (see also Table 1).
  • Example 8
  • Example 1 600 parts of the polyamideimidic wire enamel 4, 180 parts of the graphite used in Example 1 and 7.8 parts of the electrically conductive carbon black used in Example 1 are dispersed at 1835 revolutions for 30 minutes.
  • the solids content of the conductive lacquer 6 thus produced is 46.7% (1h '180 ° C).
  • the conductive lacquer 6 is applied in a layer thickness of 45 ⁇ m on a 1 mm Cu wire that is insulated with the wire enamel 2 (dry film thickness 50 ⁇ m).
  • the conductive lacquer layer has a resistance of 970 k ⁇ / m (see also Table 1).

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Paints Or Removers (AREA)
  • Insulated Conductors (AREA)
  • Organic Insulating Materials (AREA)
  • Communication Cables (AREA)
  • Insulating Of Coils (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Road Signs Or Road Markings (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Coating With Molten Metal (AREA)

Abstract

Selon un procédé de revêtement de fils métalliques, on revêt des fils métalliques revêtus d'une laque isolante à base de polyesterimide, de polyester ou de polyuréthane, avec soit (1) un vernis pour fils métalliques en polyesterimide ou en polyester qui contient (a) entre 2 et 20 parties en poids de suie électroconductrice ou (b) entre 50 et 110 parties en poids de graphite ou (c) entre 1 et 12 parties en poids de suie et entre 50 et 110 parties en poids de graphite; soit (2) un vernis pour fils métalliques en polyuréthane qui contient (a) entre 5 et 50 parties en poids de suie électroconductrice ou (b) entre 2 et 40 parties en poids de graphite ou (c) entre 1 et 35 parties en poids de suie et entre 2 et 115 parties en poids de graphite; soit (3) un vernis pour fils métalliques en polyamidimide qui contient (a) entre 1 et 10 parties en poids de suie électroconductrice ou (b) entre 60 et 110 parties en poids de graphite ou (c) entre 1 et 10 parties en poids de suie et entre 60 et 110 parties en poids de graphite, toutes les quantités mentionnées se référant à 100 parties en poids de liant.
EP90902181A 1989-02-21 1990-01-27 Procede de revetement en continu de fils metalliques et utilisation des fils metalliques ainsi obtenus Pending EP0459994A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3905287A DE3905287A1 (de) 1989-02-21 1989-02-21 Verfahren zum kontinuierlichen beschichten von draehten sowie die verwendung der so hergestellten draehte
DE3905287 1989-02-21

Publications (1)

Publication Number Publication Date
EP0459994A1 true EP0459994A1 (fr) 1991-12-11

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EP90902181A Pending EP0459994A1 (fr) 1989-02-21 1990-01-27 Procede de revetement en continu de fils metalliques et utilisation des fils metalliques ainsi obtenus
EP90200246A Expired - Lifetime EP0384505B1 (fr) 1989-02-21 1990-01-27 Procédé de revêtement en continu de fils et utilisation des fils ainsi obtenus

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Country Status (9)

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EP (2) EP0459994A1 (fr)
JP (1) JPH065605B2 (fr)
KR (1) KR960002488B1 (fr)
AT (1) ATE88831T1 (fr)
BR (1) BR9007146A (fr)
DE (2) DE3905287A1 (fr)
DK (1) DK0384505T3 (fr)
ES (1) ES2042191T3 (fr)
WO (1) WO1990010298A1 (fr)

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DE4133546C2 (de) * 1991-10-10 2000-12-07 Mahle Gmbh Kolben-Zylinderanordnung eines Verbrennungsmotors
US6218624B1 (en) * 1994-07-05 2001-04-17 Belden Wire & Cable Company Coaxial cable
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ATE88831T1 (de) 1993-05-15
JPH04500882A (ja) 1992-02-13
KR960002488B1 (ko) 1996-02-17
EP0384505B1 (fr) 1993-04-28
EP0384505A1 (fr) 1990-08-29
DK0384505T3 (da) 1993-08-02
KR920700459A (ko) 1992-02-19
WO1990010298A1 (fr) 1990-09-07
DE3905287A1 (de) 1990-08-30
BR9007146A (pt) 1991-10-22
JPH065605B2 (ja) 1994-01-19
ES2042191T3 (es) 1993-12-01
DE59001279D1 (de) 1993-06-03

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