EP0481935A2 - Verfahren und Gerät zum Kontrollieren von Werkstücken auf einer zweiseitigen Läppmaschine nach deren Bearbeitung - Google Patents

Verfahren und Gerät zum Kontrollieren von Werkstücken auf einer zweiseitigen Läppmaschine nach deren Bearbeitung Download PDF

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Publication number
EP0481935A2
EP0481935A2 EP91830440A EP91830440A EP0481935A2 EP 0481935 A2 EP0481935 A2 EP 0481935A2 EP 91830440 A EP91830440 A EP 91830440A EP 91830440 A EP91830440 A EP 91830440A EP 0481935 A2 EP0481935 A2 EP 0481935A2
Authority
EP
European Patent Office
Prior art keywords
workpieces
upper plate
processing unit
plate
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP91830440A
Other languages
English (en)
French (fr)
Other versions
EP0481935A3 (en
Inventor
Michele Melchiorre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MELCHIORRE OFFICINA MECCANICA Srl
Original Assignee
MELCHIORRE OFFICINA MECCANICA Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MELCHIORRE OFFICINA MECCANICA Srl filed Critical MELCHIORRE OFFICINA MECCANICA Srl
Publication of EP0481935A2 publication Critical patent/EP0481935A2/de
Publication of EP0481935A3 publication Critical patent/EP0481935A3/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Definitions

  • the present invention relates to a method and an apparatus for the post-process check of the workpieces in a double-plate lapping machine.
  • the check of the lapped workpieces is manually carried out by the operator who measures the heights of the workpieces at the end of two consecutive machining cycles.
  • the difference in the heights measured in both cycles allows the wear of the two plates, i.e. the "k-factor", to be evaluated, such factor being used to manually reset an electronic meter connected to a feeler pin which is located at the centre of the plate for measuring the wear of the latter.
  • This correction is presently carried out by measuring the heights of the finished workpieces located at diametrally opposed positions and by determining the difference of the average of such heights and the previously calculated K-factor in order to make a further correction.
  • This invention seeks to provide a method and an apparatus which allow the above mentioned problem to be semi-automatically overcome, thus avoiding any calculation by the operator at the end of any machining cycle.
  • a method for the measurement and post-process check of the workpieces consisting in operatively combining an automatic data processing unit driving the lowering of the upper plate and controlling the automatic system for the continuous adjustment of the pressure exerted by said upper plate (which is the object of a previous Patent Application of the same Applicant) with a feeler means able to measure the thickness of four workpieces located at simmetrically opposed positions at the end of any machining cycle, and a microprocessor providing the average of such measurements and controlling at the same time the spacing between the plates.
  • the spacing between the two plates measured by a probe is converted to a signal which is fed to an electronic meter in which K-factor is set, such signal being compared with the signal of the thickness measurement average provided as described above at the end of any machining cycle so as to reset the setting data of said processing unit.
  • the upper plate designated by 1 rotates about its axis and slides along said axis through the ball bearing screw 2 engaged in the lead nut 3.
  • the latter is carried by the stationary frame 4A of the lapping machine and is rotatably driven by servomotor 7.
  • a well known pressure measuring unit 5 is in terconnected between lead nut 3 and servomotor 7 for detecting the pressure value and displaying it on a videodisplay 6.
  • the apparatus further includes a power supply 8 for driving the shafts of the lapping machine, a proportional integral differential (P.I.D) amplifier indicated at 9 and the central data processing unit 10 controlling the whole apparatus.
  • a power supply 8 for driving the shafts of the lapping machine
  • a proportional integral differential (P.I.D) amplifier indicated at 9
  • the central data processing unit 10 controlling the whole apparatus.
  • the present invention provides an electronic meter 11 connected to the central data processing unit 10 in which the previously defined K-factor can be set from time to time.
  • Electronic meter 11 receives the signal fed by a probe 15 located on the lower plate 16 and intended to detect the spacing of the latter from the upper plate.
  • the thickness of the workpieces located at crossed simmetric positions is detected by a feeler pin 14 which feeds the detected thickness signals to the electronic comparator 12 provided with a display showing the detected thicknesses.
  • Electronic comparator 12 outputs in turn a signal to microprocessor 13 which makes the average of the heights of the four measured workpieces and feed it to electronic meter 11 where K-factor F(K) is set as described above.
  • Meter 11 transmits the corrected value F(K) + F(R) to the data processing unit 10 causing the upper plate to be shifted until the corrected thickness of the workpieces to be lapped has been reached as detected by probe 15.
  • meter 11 effects a comparison among setting data, the measured spacing between the two plates, and the actual thickness of the lapped workpieces so that the central data processing unit 10 is automatically reset by the corrected data.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
EP19910830440 1990-10-19 1991-10-16 Method and apparatus for the post-process check of the workpieces in a double-plate lapping machine Withdrawn EP0481935A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT4838990 1990-10-19
IT04838990A IT1243537B (it) 1990-10-19 1990-10-19 Metodo e dispositivo per il controllo al termine di ogni ciclo (post process) dei pezzi lavorati in una macchina lappatrice a doppio plateau

Publications (2)

Publication Number Publication Date
EP0481935A2 true EP0481935A2 (de) 1992-04-22
EP0481935A3 EP0481935A3 (en) 1992-09-02

Family

ID=11266266

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19910830440 Withdrawn EP0481935A3 (en) 1990-10-19 1991-10-16 Method and apparatus for the post-process check of the workpieces in a double-plate lapping machine

Country Status (2)

Country Link
EP (1) EP0481935A3 (de)
IT (1) IT1243537B (de)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998014306A1 (en) * 1996-10-04 1998-04-09 Obsidian, Inc. A method and system for controlling chemical mechanical polishing thickness removal
KR19980087549A (ko) * 1997-05-28 1998-12-05 로브그렌 리차드 선형 광택처리기를 사용하는 기계화학 광택공정의 원위치 종점 탐지와 최적화를 위한 방법과 장치
US6108091A (en) * 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6254459B1 (en) 1998-03-10 2001-07-03 Lam Research Corporation Wafer polishing device with movable window
US7125313B2 (en) 2003-02-25 2006-10-24 Novellus Systems, Inc. Apparatus and method for abrading a workpiece
JP2020015105A (ja) * 2018-07-23 2020-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5715668A (en) * 1980-06-27 1982-01-27 Fujikoshi Kikai Kogyo Kk Lapping process and lapping device
JPS57168109A (en) * 1981-04-10 1982-10-16 Shinetsu Eng Kk Device for measuring thickness of work piece in lapping plate
IT1190231B (it) * 1986-03-07 1988-02-16 Melchiorre Off Mecc Lappatrice a due plato' con dispositivo per la misura spessore del pezzo in lavorazione e con tavola di caricamento manuale dei satelliti
US4860498A (en) * 1988-08-15 1989-08-29 General Signal Corp. Automatic workpiece thickness control for dual lapping machines

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998014306A1 (en) * 1996-10-04 1998-04-09 Obsidian, Inc. A method and system for controlling chemical mechanical polishing thickness removal
KR19980087549A (ko) * 1997-05-28 1998-12-05 로브그렌 리차드 선형 광택처리기를 사용하는 기계화학 광택공정의 원위치 종점 탐지와 최적화를 위한 방법과 장치
EP0893203A3 (de) * 1997-05-28 2000-01-12 LAM Research Corporation Verfahren und Vorrichtung zur in-situ Endpunktbestimmung und zur Optimierung eines chemisch-mechanischen Polierverfahrens mit Linear Poliergerät
US6108091A (en) * 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6261155B1 (en) 1997-05-28 2001-07-17 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6621584B2 (en) 1997-05-28 2003-09-16 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6254459B1 (en) 1998-03-10 2001-07-03 Lam Research Corporation Wafer polishing device with movable window
US7125313B2 (en) 2003-02-25 2006-10-24 Novellus Systems, Inc. Apparatus and method for abrading a workpiece
JP2020015105A (ja) * 2018-07-23 2020-01-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN110757336A (zh) * 2018-07-23 2020-02-07 东京毅力科创株式会社 基板处理装置和基板处理方法

Also Published As

Publication number Publication date
IT9048389A1 (it) 1992-04-19
IT1243537B (it) 1994-06-16
EP0481935A3 (en) 1992-09-02
IT9048389A0 (it) 1990-10-19

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