EP0482907A3 - Electrode structures - Google Patents

Electrode structures Download PDF

Info

Publication number
EP0482907A3
EP0482907A3 EP19910309788 EP91309788A EP0482907A3 EP 0482907 A3 EP0482907 A3 EP 0482907A3 EP 19910309788 EP19910309788 EP 19910309788 EP 91309788 A EP91309788 A EP 91309788A EP 0482907 A3 EP0482907 A3 EP 0482907A3
Authority
EP
European Patent Office
Prior art keywords
electrode structures
electrode
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19910309788
Other languages
English (en)
Other versions
EP0482907A2 (de
Inventor
Fujio Mochizuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Fujitsu Quantum Devices Ltd
Original Assignee
Fujitsu Ltd
Fujitsu Quantum Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, Fujitsu Quantum Devices Ltd filed Critical Fujitsu Ltd
Publication of EP0482907A2 publication Critical patent/EP0482907A2/de
Publication of EP0482907A3 publication Critical patent/EP0482907A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP19910309788 1990-10-24 1991-10-23 Electrode structures Withdrawn EP0482907A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP284403/90 1990-10-24
JP2284403A JPH04162422A (ja) 1990-10-24 1990-10-24 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
EP0482907A2 EP0482907A2 (de) 1992-04-29
EP0482907A3 true EP0482907A3 (en) 1992-07-01

Family

ID=17678121

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19910309788 Withdrawn EP0482907A3 (en) 1990-10-24 1991-10-23 Electrode structures

Country Status (3)

Country Link
EP (1) EP0482907A3 (de)
JP (1) JPH04162422A (de)
KR (1) KR920008867A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3374743B2 (ja) * 1998-03-05 2003-02-10 日本電気株式会社 基板熱処理装置及び同装置からの基板の分離方法
JP4922870B2 (ja) * 2007-08-31 2012-04-25 株式会社アルバック 基板リフト装置
WO2014157014A1 (ja) * 2013-03-29 2014-10-02 株式会社クリエイティブ テクノロジー チャック装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0205142A2 (de) * 1985-06-11 1986-12-17 Tegal Corporation Plasmabearbeitung mit Tragebolzen
EP0323620A2 (de) * 1987-12-25 1989-07-12 Tokyo Electron Limited Ätzverfahren und -gerät
EP0324436A2 (de) * 1988-01-11 1989-07-19 Etec Systems, Inc. Vorrichtung zum Vorwählen und festhalten einer festen Distanz zwischen einem Werkstück und einem Vakuumgerät in Partikelstrahllithographiesystemen
EP0392134A2 (de) * 1989-04-13 1990-10-17 Applied Materials, Inc. Verfahren zur Behandlung der Rückseite einer Halbleiterscheibe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0205142A2 (de) * 1985-06-11 1986-12-17 Tegal Corporation Plasmabearbeitung mit Tragebolzen
EP0323620A2 (de) * 1987-12-25 1989-07-12 Tokyo Electron Limited Ätzverfahren und -gerät
EP0324436A2 (de) * 1988-01-11 1989-07-19 Etec Systems, Inc. Vorrichtung zum Vorwählen und festhalten einer festen Distanz zwischen einem Werkstück und einem Vakuumgerät in Partikelstrahllithographiesystemen
EP0392134A2 (de) * 1989-04-13 1990-10-17 Applied Materials, Inc. Verfahren zur Behandlung der Rückseite einer Halbleiterscheibe

Also Published As

Publication number Publication date
EP0482907A2 (de) 1992-04-29
JPH04162422A (ja) 1992-06-05
KR920008867A (ko) 1992-05-28

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