EP0500382A2 - Wasserdichtes elektrolumineszentes Dünn-Filmpaneel - Google Patents

Wasserdichtes elektrolumineszentes Dünn-Filmpaneel Download PDF

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Publication number
EP0500382A2
EP0500382A2 EP92301434A EP92301434A EP0500382A2 EP 0500382 A2 EP0500382 A2 EP 0500382A2 EP 92301434 A EP92301434 A EP 92301434A EP 92301434 A EP92301434 A EP 92301434A EP 0500382 A2 EP0500382 A2 EP 0500382A2
Authority
EP
European Patent Office
Prior art keywords
thin film
panel
film electroluminescent
moisture
black silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP92301434A
Other languages
English (en)
French (fr)
Other versions
EP0500382B1 (de
EP0500382A3 (en
Inventor
Takuo Yamashita
Takashi Ogura
Masaru Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of EP0500382A2 publication Critical patent/EP0500382A2/de
Publication of EP0500382A3 publication Critical patent/EP0500382A3/en
Application granted granted Critical
Publication of EP0500382B1 publication Critical patent/EP0500382B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces

Definitions

  • the present invention relates to moistureproof thin film electroluminescent panel used for a display device of a personal computer, a wordprocessor or the like.
  • a conventional manufacturing method of thin film electroluminescent panels as shown in Fig. 9, lower transparent electrodes 3, a lower insulating layer 4, an electroluminescent layer 5, an upper insulating layer 6 and upper electrodes 7 are deposited on a glass substrate 2 in a stacked manner to form an electroluminescent (herein after referred to as EL for brevity) device 1 and, thereafter, a lining backup glass plate 8 is put on said EL device 1 by adhering the periphery thereof to that of the glass substrate 2 with an adhesive agent 9 of epoxy resin in order to prevent moisture from penetrating into the EL device.
  • EL electroluminescent
  • silicon oil in which silicagel powder and black powder are dispersed to give a moisture absorbing property is filled into a space 11 between the EL device 1 and the backup glass plate 8 through a hole 10 of the same and, thereafter, the hole 10 is sealed tightly by plugging a "TORR SEAL @" 12 thereinto.
  • the cost of the silicone oil is high and the filling process thereof is very time-consuming and, accordingly, it is very difficult to lower the manufacturing cost thereof. Further, due to the thickness and the weight of the backup glass 8, it is difficult to make the EL device of this type thinner and lighter.
  • any structure for absorbing moisture penetrated is not provided and nothing is considered to enhance the contrast of the EL device.
  • One object of the present invention is to provide a thin film EL panel having a high moistureproof structure without using silicone oil.
  • Another object of the present invention is to provide a thin film EL panel with a high contrast being advantageous in minimizing the manufacturing cost thereof and making it thinner and lighter without lowering the credibility against moisture.
  • a further object of the present invention is to enhance the moistureproof property of a thin film EL panel by dehydrating the inner space thereof before sealing the same finally.
  • a thin film EL panel comprising a transparent substrate being characterized in that the back surface of said thin film EL device is coated with black silicone resin and that the back surface of said thin film EL device is covered over the black silicone coating by a moistureproof sheet.
  • the back side of the thin film EL device is double-sealed with the coating layer of black silicone resin and the moistureproof sheet.
  • powder-like or pellet-like moisture absorbing material is arranged for absorbing moisture penetrating through the moistureproof sheet.
  • the powder-like or pellet-like material is arranged by dispersing it in the black silicone resin beforehand.
  • it is arranged between the black silicone coating and the moisture-proof sheet.
  • it is arranged therebetween in a manner contained in a gaspermeable sack.
  • a sheet-like moisture-absorbing body is arranged between the black silicone coating and the moistureproof sheet.
  • the black silicone resin is preferably of a type hardened by the additional reaction.
  • the contrast thereof is highly enhanced since the EL device is lined with the black coating and, thereby, the quality of display is much improved.
  • the manufacturing process is simplified and the EL panel can be made thinner and lighter.
  • Figs. 1 to 5 and 7 show partial sectional views of thin film EL panels according to the present invention. Through all these Figs., same reference numerals denote same elements as those used in Fig. 9.
  • the thin film EL panels shown in Figs. 1 to 3 have a substantially same fundamental structure except for the manner of arrangement of moisture absorbing means.
  • the reference numeral 1 denotes a thin film EL device.
  • Thin film EL device 1 is comprised of lower transparent stripe electrodes 3 formed on a transparent substrate 2 such as a glass substrate in parallel to each other at an equal pitch, a lower insulating layer 4, an EL layer 5, an upper insulating layer 6 and upper stripe electrodes 7 arranged in parallel to each other at an equal pitch and in direction orthogonal to that of the lower transparent electrodes 3. These elements 3 to 7 are formed stacked one on the other.
  • the reference numeral 13 denotes a layer of a black silicone resin. This black silicone resin layer 13 is formed by painting the black silicone resin so as to cover the EL device 1.
  • the reference numeral 14 denotes powder like or pellet-like moisture absorber comprised of powder or pellets of silica(Si0 2 ), molecular sieve or the like. In the structure shown in Fig. 1, the moisture absorber 14 is dispersed in the black silicone resin 13. In the structure shown in Fig. 2, it is arranged on the black silicone layer 13.
  • Fig. 3 it is contained in a gaspermeable sack 20 and the sack 20 is arranged on the black silicone layer 13.
  • the reference numeral 18 denotes a moistureproof sheet which is comprised of a laminated sheet having such a structure that a metal foil 16 of 5 to 50 f..lm thickness is sandwiched with organic resin films 15 and 17 of 5 to 50 f..lm thickness such as polyester films. These organic resin films 15 and 17 may be made of different materials.
  • the moistureproof effect of said sheet 18 is mainly obtained by the metal foil 16 since it is impermeable against moisture.
  • the organic resin films 15 and 17 are mainly for protection of the surface of the metal foil 16 and for insulation to the EL device 1 but are desirably made of a resin material having a low moisture-permeability.
  • Said moistureproof sheet 18 covers the EL device 1 so as to define a space 19 therebetween and is bonded to the transparent substrate 2 along the periphery thereof with an epoxy resin adhesive agent 9 to seal the inside of the EL panel completely.
  • the moisture absorber 14 absorbs moisture existing inside of said moistureproof sheet 18, the credibility of the EL panel against moisture is highly enhanced.
  • gas discharge from the EL device 1 is done by raising the temperature up to 200°C or more in a vacuum to remove residual moisture as much as possible.
  • the black silicone resin 13 in which powder-like or pellet-like moisture absorber 14 is dispersed is painted or printed on the thin film EL device 1 in dry N 2 gas or dry air at a room temperature.
  • the liquid of black silicone resin is prepared by mixing, at a room temperature, powder-like or pellet-like moisture absorber 14 having been vacuum-dehydrated at a temperature of 100°C or more into the liquid of black silicone resin having been dehydrated and deformed in a vacuum.
  • the black silicone resin 13 is hardened by maintaining the same at a constant temperature for a constant time predetermined according to the property thereof (for instance at 150°C for one hour).
  • the moistureproof sheet 18 is adhered with an epoxy adhesive agent 9 in dry N 2 gas or dry air. Accordingly, dry N 2 gas or dry air is filled in the space 19.
  • the predetermined amount of the moisture absorber 14 having been vacuum-dehydrated by heating the same at 100°C or more is arranged on the hardened black silicone resin 13.
  • the gaspermeable sack 20 containing a predetermined amount of the moisture absorber 14 is vacuum-dehydrated by heating the same up to 100°C or more beforehand, and it is put on the hardened black silicone resin 13.
  • the use of the sack makes treatment of the moisture absorber easier.
  • the moistureproof sheet 18 is adhered to the periphery of the substrate 2 with the epoxy resin adhesive agent 9 in dry N 2 gas or dry air.
  • the moisture absorber 14 is a sheet made from non woven fabric or the like which contains silica micro powder, molecular sieve powder or the like therein.
  • This black silicon resin 13 enhances the contrast of the EL panel by forming the black background and contributes to relax stresses generated in the EL panel.
  • Fig. 6 shows the number of broken pixels of the EL panel in relation with the hardness of the black silicone resin hardened.
  • the EL panel vibrates with a small amplitude during action thereof and, accordingly, the breaking property of the pixel is affected by stresses exerted thereto from the black silicone resin 13 coated thereon. In other words, it is deeply related to the hardness of the black silicone resin after hardened.
  • the hardness of the black silicone resin 13 should be smaller or equal to 20 when it is measured according to JIS C 2123.
  • the black silicone resin prefferably has a dielectric strength equal to or larger than 1 x 10 5 V/cm in order to avoid damage to electrodes and pixels due to discharges among electrodes during action of the EL panel.
  • a thin film EL panel having no moisture absorber therein. If it is used in an atmosphere conditioned well, a reasonably long life will be guaranteed even in this case.
  • Fig. 7 shows a sixth preferred embodiment of the present invention.
  • the thin film EL panel shown in Fig. 7 has a substantially same structure as that shown in Fig. 4 except for a hole 21 of a small diameter, for example of about 6mm, pierced in the moistureproof sheet 18. This small hole 21 is provided for dehydrating the inner space 19 of the EL panel to remove the moisture introduced thereinto during the fabricating process of the EL panel.
  • the EL panel Upon dehydrating the inner space 19, the EL panel is charged into a vacuum chamber (not shown) and is vacuum-dehydrated therein by raising the inner temperature up to 100°C or more. Then, dry N 2 gas or air is filled into the vacuum chamber and the hole 21 is sealed quickly by adhering a small strip 22 having the same layered structure as that of the moistureproof sheet 18 from the outside thereof. By heating and hardening epoxy resin 9' applied to the under side of the small strip 22, the hole 21 is sealed surely and, thus, the fabrication process of the EL panel is completed.
  • the number of small holes to be pierced may be two or more. Further, it is desirable to pierce the small hole in the moistureproof sheet 18 beforehand for smooth and quick dehydrating operation. However, it is also possible to pierce the small hole upon dehydrating the EL panel.
  • the moisture having been penetrated into the inner space of the EL panel during the fabrication process thereof is surely dehydrated resulting in a much higher reliability against degradation due to moisture.
  • Fig. 8 shows experimental data related to the lifetime of sealing obtained under three sealing conditions.
  • the life-time of sealing at room temperature and humidity was estimated from an acceleration life- time test wherein thin film EL panels were operated to repeat light emission in an atmosphere at a temperature of 85°C and a relative humidity of 85%.
  • the life-time of sealing is greatly affected by an ambient humidity upon sealing the EL panel but the dehydration operation can remove undesirable effects based on a high ambient humidity perfectly.
  • the life-time of sealing demanded for actual use is about 5 x 10 4 hours and this criterion can easily satisfied by the present preferred embodiment of the present invention, as indicated by the case C in Fig. 8.
  • the background of the display is black. This enhances the contrast of display, the quality of display and the appearance of the panel.
  • the sealing process of the EL panel is simplified since the moistureproof sheet is adhered to the substrate in a dry atmosphere in the present invention. Further, the EL panel according to the present invention can be made thinner and lighter when compared with the conventional one wherein the backup glass plate is used.
  • the present invention can be applied to both dot matrix type and segment type EL devices.

Landscapes

  • Electroluminescent Light Sources (AREA)
EP92301434A 1991-02-21 1992-02-21 Wasserdichtes elektrolumineszentes Dünn-Filmpaneel Expired - Lifetime EP0500382B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27186/91 1991-02-21
JP3027186A JPH04267096A (ja) 1991-02-21 1991-02-21 薄膜ｅｌパネル

Publications (3)

Publication Number Publication Date
EP0500382A2 true EP0500382A2 (de) 1992-08-26
EP0500382A3 EP0500382A3 (en) 1993-09-22
EP0500382B1 EP0500382B1 (de) 1996-12-27

Family

ID=12214049

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92301434A Expired - Lifetime EP0500382B1 (de) 1991-02-21 1992-02-21 Wasserdichtes elektrolumineszentes Dünn-Filmpaneel

Country Status (4)

Country Link
EP (1) EP0500382B1 (de)
JP (1) JPH04267096A (de)
DE (1) DE69216123T2 (de)
FI (1) FI105882B (de)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0776147A1 (de) * 1995-11-24 1997-05-28 Pioneer Electronic Corporation Organisches elektrolumineszentes Element
WO2001019142A1 (en) * 1999-09-03 2001-03-15 Uniax Corporation Encapsulation of organic electronic devices
WO2001031717A1 (en) * 1999-10-25 2001-05-03 Saes Getters S.P.A. Moisture sorbing system for screens comprising organic light emitting diodes and process for the manufacture thereof
EP1137325A2 (de) 2000-03-23 2001-09-26 Nitto Denko Corporation Befestigungsglied, elektrolumineszente Vorrichtung damit und Substrat für die Vorrichtung
EP1077589A3 (de) * 1999-08-19 2002-01-02 Harness System Technologies Research, Ltd. Organische elektroluminisierte Vorrichtung
EP1115267A3 (de) * 1999-12-28 2002-07-31 Nec Corporation Organische Elektrolumineszenzanzeige und Verfahren zu deren Herstellung
EP1135004A3 (de) * 2000-03-16 2003-04-16 Nitto Denko Corporation Material für elektrolumineszente Vorrichtung und elektrolumineszente Vorrichtung damit
KR20030030380A (ko) * 2001-10-10 2003-04-18 엘지.필립스 엘시디 주식회사 유기전계 발광소자
EP1619544A1 (de) * 2004-07-19 2006-01-25 LG Electronics, Inc. Flüssigkristallanzeige und Methode zu ihrer Herstellung
WO2008003166A1 (en) * 2006-07-05 2008-01-10 Ifire Ip Corporation Sealed thick film dielectric electroluminescent display
CN100438120C (zh) * 2003-04-08 2008-11-26 日本东北先锋公司 有机电致发光面板及其制造方法
US7585430B2 (en) 2001-01-08 2009-09-08 Sud-Chemie Ag Plate-shaped pressed bodies
US7687119B2 (en) 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
WO2015122951A3 (en) * 2013-12-12 2015-10-22 Qualcomm Mems Technologies, Inc. Mems encapsulation by multilayer film lamination
WO2016164136A1 (en) * 2015-04-09 2016-10-13 Qualcomm Mems Technologies, Inc. Pre-release encapsulation of electromechanical system devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102179329B1 (ko) * 2013-11-28 2020-11-18 삼성디스플레이 주식회사 표시 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669795A (en) * 1979-11-09 1981-06-11 Nippon Telegraph & Telephone Thin film electroluminescent element sealing method
JPS62295090A (ja) * 1986-06-14 1987-12-22 双葉電子工業株式会社 電界発光表示パネルとその製造方法
JPS63105494A (ja) * 1986-10-22 1988-05-10 アルプス電気株式会社 薄膜ｅｌパネル
JPH01149397A (ja) * 1987-12-07 1989-06-12 Ricoh Co Ltd エレクトロルミネッセンス素子
US4963788A (en) * 1988-07-14 1990-10-16 Planar Systems, Inc. Thin film electroluminescent display with improved contrast
JP2742057B2 (ja) * 1988-07-14 1998-04-22 シャープ株式会社 薄膜ｅｌパネル
JPH02197071A (ja) * 1989-01-26 1990-08-03 Sharp Corp 薄膜ｅｌパネル

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0776147A1 (de) * 1995-11-24 1997-05-28 Pioneer Electronic Corporation Organisches elektrolumineszentes Element
EP1077589A3 (de) * 1999-08-19 2002-01-02 Harness System Technologies Research, Ltd. Organische elektroluminisierte Vorrichtung
WO2001019142A1 (en) * 1999-09-03 2001-03-15 Uniax Corporation Encapsulation of organic electronic devices
WO2001031717A1 (en) * 1999-10-25 2001-05-03 Saes Getters S.P.A. Moisture sorbing system for screens comprising organic light emitting diodes and process for the manufacture thereof
EP1115267A3 (de) * 1999-12-28 2002-07-31 Nec Corporation Organische Elektrolumineszenzanzeige und Verfahren zu deren Herstellung
US6551724B2 (en) 1999-12-28 2003-04-22 Nec Corporation Organic electro-luminescent display panel
EP1135004A3 (de) * 2000-03-16 2003-04-16 Nitto Denko Corporation Material für elektrolumineszente Vorrichtung und elektrolumineszente Vorrichtung damit
EP1137325A2 (de) 2000-03-23 2001-09-26 Nitto Denko Corporation Befestigungsglied, elektrolumineszente Vorrichtung damit und Substrat für die Vorrichtung
EP1137325A3 (de) * 2000-03-23 2003-04-16 Nitto Denko Corporation Befestigungsglied, elektrolumineszente Vorrichtung damit und Substrat für die Vorrichtung
US6696179B2 (en) 2000-03-23 2004-02-24 Nitto Denko Corporation Fixing member, electroluminescent device using the member and backing substrate for the device
US7585430B2 (en) 2001-01-08 2009-09-08 Sud-Chemie Ag Plate-shaped pressed bodies
KR20030030380A (ko) * 2001-10-10 2003-04-18 엘지.필립스 엘시디 주식회사 유기전계 발광소자
CN100438120C (zh) * 2003-04-08 2008-11-26 日本东北先锋公司 有机电致发光面板及其制造方法
EP1619544A1 (de) * 2004-07-19 2006-01-25 LG Electronics, Inc. Flüssigkristallanzeige und Methode zu ihrer Herstellung
US7675585B2 (en) 2004-07-19 2010-03-09 Lg Electronics Inc. Liquid crystal display with organic EL backlight comprising cap member with protrusions
US7687119B2 (en) 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
WO2008003166A1 (en) * 2006-07-05 2008-01-10 Ifire Ip Corporation Sealed thick film dielectric electroluminescent display
WO2015122951A3 (en) * 2013-12-12 2015-10-22 Qualcomm Mems Technologies, Inc. Mems encapsulation by multilayer film lamination
WO2016164136A1 (en) * 2015-04-09 2016-10-13 Qualcomm Mems Technologies, Inc. Pre-release encapsulation of electromechanical system devices

Also Published As

Publication number Publication date
EP0500382B1 (de) 1996-12-27
FI920728L (fi) 1992-08-22
JPH04267096A (ja) 1992-09-22
DE69216123D1 (de) 1997-02-06
FI105882B (fi) 2000-10-13
EP0500382A3 (en) 1993-09-22
DE69216123T2 (de) 1997-05-15
FI920728A0 (fi) 1992-02-20

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