EP0539097A1 - Outil de percussion à faible contamination pour casser le silicium - Google Patents

Outil de percussion à faible contamination pour casser le silicium Download PDF

Info

Publication number: EP0539097A1
Authority: EP; European Patent Office
Prior art keywords: core; impact tool; low; silicon; head portion
Prior art date: 1991-10-23
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP92309423A

Other languages

German (de)

English (en)

Other versions

EP0539097B1 (fr

Inventor

Daniel Patrick Rice

Elden Emery Ruhlig

John Dee Nemeth

Chris Tim Schmidt

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hemlock Semiconductor Operations LLC

Original Assignee

Hemlock Semiconductor Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-10-23

Filing date

1992-10-15

Publication date

1993-04-28

1992-10-15 Application filed by Hemlock Semiconductor Corp filed Critical Hemlock Semiconductor Corp

1993-04-28 Publication of EP0539097A1 publication Critical patent/EP0539097A1/fr

1994-11-30 Application granted granted Critical

1994-11-30 Publication of EP0539097B1 publication Critical patent/EP0539097B1/fr

2012-10-15 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

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Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25D—PERCUSSIVE TOOLS
- B25D9/00—Portable percussive tools with fluid-pressure drive, i.e. driven directly by fluids, e.g. having several percussive tool bits operated simultaneously
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25D—PERCUSSIVE TOOLS
- B25D1/00—Hand hammers; Hammer heads of special shape or materials
- B25D1/02—Inserts or attachments forming the striking part of hammer heads
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25D—PERCUSSIVE TOOLS
- B25D2222/00—Materials of the tool or the workpiece
- B25D2222/21—Metals
- B25D2222/51—Hard metals, e.g. tungsten carbide
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25D—PERCUSSIVE TOOLS
- B25D2222/00—Materials of the tool or the workpiece
- B25D2222/54—Plastics
- B25D2222/69—Foamed polymers, e.g. polyurethane foam

Definitions

the present invention is a low-contamination impact tool especially useful for the breaking of semiconductor-grade silicon into pieces.
the low-contamination impact tool comprises a core forming a handle portion and a head portion, the head portion contacting a tungsten carbide alloy striking element.
the core is encapsulated in a synthetic resin.
transistional metal impurities including among others copper, gold, iron, cobalt, nickel, chromium, tantalum, zinc and tungsten and impurities such as carbon, boron, phosphorous, aluminum and arsenic. These impurities, even in small quantities, introduce defect sites in semiconductor grade silicon which can ultimately result in degraded device performance and limit circuit density.
a polycrystalline silicon of high purity is formed by chemical vapor deposition of a high purity chlorosilane gas onto a heated silicon substrate.
the resulting product is rods of polycrystalline silicon.
the polycrystalline silicon rods must be further processed to produce a monocrystalline silicon from which silicon wafers can be cut.
a significant portion of the monocrystalline silicon required by the semiconductor industry is produced by the well known Czochralski process.
silicon pieces are melted in an appropriate vessel and a monocrystalline silicon seed crystal is used to draw a monocrystalline rod of semiconductor-grade silicon from the melt. Control of this crystal growth process requires that the silicon pieces added to the melt containing vessel be within a defined size range. Therefore, it is necessary that the polycrystalline silicon rods formed during the chemical vaporization deposition process be broken into pieces of suitable size.
the low-contamination impact tool described as the present invention is especially useful for breaking silicon into pieces.
the inventors have discovered that during the breaking process, the silicon can be significantly contaminated by contact with the surfaces of the breaking instrument, including the handle and striking surfaces.
the present invention reduces the contamination associated with the breaking instrument by covering all surfaces, but the striking surface, with a low-contamination synthetic resin.
the exposed striking surface is formed of a tungsten carbide alloy, which is also of a low-contamination nature.
Maeda U.S. Patent No. 4,697,481, issued October 6, 1987, describes a hammer including a head core and a handle core, where the head core and handle core are imbedded in a resin, with the exception of one end of the head core which serves as a striking surface.
Maeda describes the striking surface as being made of a ferrous metal.
the present invention is a low-contamination impact tool especially useful for the breaking of semiconductor-grade silicon into pieces.
the low-contamination impact tool comprises a core forming a handle portion and a head portion, the head portion contacting a tungsten carbide alloy striking element.
the core is encapsulated in a synthetic resin material.
the preferred synthetic resin is urethane.
Figure 1 illustrates a cross-sectional view of an embodiment of the present invention.
the present invention is a low-contamination impact tool.
the tool is designed especially to break semiconductor grade silicon into pieces without imparting significant contamination to the pieces.
the low-contamination impact tool comprises: (A) a core forming a handle portion and a head portion, (B) a tungsten carbide alloy striking element having an end contacted with the head portion of the core and (C) a shell of synthetic resin encapsulating the core.
the low-contamination impact tool comprises a core consisting of handle portion 1 and head portion 2 .
the core can be formed from any metal, metal alloy, plastic or composite of sufficient rigidity and strength to deliver an impact to a surface. Preferred is when the core is formed from a metal or metal alloy, for example, carbon steel, stainless steel, inconel, monel or hasteloy. More preferred is when the core is formed from AISI 1018 cold rolled steel.
the size of the core is not critical to the present invention. Those skilled in the art will recognize that the core must have sufficient cross-sectional area to prevent bending and breaking of the core during use of the low-contamination impact tool as a breaking instrument.
the required cross-sectional area will depend upon the material from which the core is constructed as well as the length of handle portion 1 .
AISI 1018 cold rolled steel is used as the material of construction of the core material, and the low-comtamination impact tool is to be used for the breaking of silicon
a length of about 8 inches to 12 inches for handle portion 1 and a cross-sectional diameter of about 0.4 to 0.5 inches for handle portion 1 is suitable.
Head portion 2 can be constructed of the same or different material than handle portion 1 . Preferred is when head portion 2 is formed from the same material as handle portion 1 .
Head portion 2 and handle portion 1 are connected.
the connection can be achieved by forming the core as a single element by, for example, molding, casting, stamping, cutting or machining, depending upon the particular material of fabrication.
head portion 2 and handle portion 1 can be formed separately and connected by, for example, wedging, welding, brazing, fusing, threading or other standard means for connecting two solid objects.
the core is formed from AISI 1018 cold rolled steel, it is preferred that head portion 2 and handle portion 1 be formed separately and connected by welding.
head portion 2 is determined by the material of fabrication, the size of handle portion 1 , the method of securing striking element 4 and the size of striking element 4 .
handle portion 1 and head portion 2 are formed from AISI 1018 cold rolled steel, it is preferred that head portion 2 has a length of about one inch to two inches and a diameter of about 0.5 to one inch.
Head portion 2 is secured in contact with striking element 4 .
the method of securing contact of head portion 2 with striking element 4 is not critical to the present invention.
striking element 4 is secured in contact with head portion 2 during the process of encapsulating the core with a synthetic resin.
the synthetic resin maintains the position of striking element 4 , as illustrated in Figure 1.
the advantage of this method of securing striking element 4 is that the striking element can be easily recovered and reused if the remainder of the low-contamination impact tool is damaged.
striking element 4 can be directly secured to head portion 2 by standard means, as described above, for attaching two solid objects.
Striking element 4 is formed from a tungsten carbide alloy, where cobalt is the alloying metal. It is preferred that the tungsten carbide alloy contain about 8 to 15 weight percent cobalt. More preferred is when the tungsten carbide alloy contains about 10 to 13 weight percent cobalt.
the shape of striking element 4 is not critical to the present invention. However, in a preferred embodiment of the present invention striking element 4 is formed in a generally cylindrical shape with a constricted central portion. The constricted central portion helps secure striking element 4 in contact with head portion 2 , when a synthetic resin is used as the securing means. The constriction can be about one to 30 percent of the diameter of striking element 4 . Preferred is when the constriction is about five to 20 percent of the diameter of striking element 4 .
the diameter of striking element 4 is within a range of about 0.5 to one inch.
Striking element 4 has striking face 5 .
the radius of curvature of the edge of striking face 5 is important to minimize breaking of particles from striking element 4 during use.
a radius of about 0.03 to 0.25 inch is considered useful.
Preferred is a radius of about 0.07 to 0.12 inch.
the core is encapsulated in a synthetic resin to form cover 3 .
the purpose of encapsulating the core in the synthetic resin is to prevent the core from contacting the material to be broken with the low-contamination impact tool.
the synthetic resin is selected so as to impart minimal undesirable contamination to the material to be broken.
synthetic resin is meant highly cross-linked polymeric materials that are not naturally occurring.
the synthetic resin can be for example, polyurethane, polypropylene, polyethylene or polycarbonate. Preferred is when the synthetic resin is polyurethane. Even more preferred is when the synthetic resin is a polyurethane having a Shore A Hardness of about 90 to 97.
Cover 3 can be formed around the core and striking element 4 by injecting or casting the synthetic resin into a cavity of a mold which has the same shape as the external shape of cover 3 .
the core is placed in the mold, striking element 4 positioned as illustrated in Figure 1 and the synthetic resin injected and cured, securing striking element 4 in contact with head portion 2 .
Silicon samples were prepared by breaking a rod of polycrystalline silicon with an impact tool having a non-encapsulated handle and head formed from AISI 1018 cold rolled steel. A tungsten carbide alloy striking element was attached to the head of the impact tool. The tungsten carbide alloy contained about 12 weight percent cobalt. During the breaking process, care was taken to contact each piece of silicon with the handle of the impact tool. Samples of silicon pieces were analyzed for iron and phosphorus surface contamination by graphite furnace atomic absorption and photoluminesience techniques, respectively. The results are presented in Table 1. Table 1 Contamination of Silicon Pieces by Contact With Impact Tool Uncoated Handle Sample No. Fe ppb P ppb 1 0.90 0.27 2 0.74 0.29 3 0.79 0.43 4 0.80 0.37 5 0.63 0.07 6 0.67 0.20 Mean 0.76 0.27
Silicon samples were prepared by breaking a rod of polycrystalline silicon with an impact tool having a polyurethane encapsulated handle and head.
the handle and head were formed from AISI 1018 cold rolled steel.
the polyurethane coating was formed-from a polyether based liquid, isocyanate-terminated prepolymer using (4,4′-methylene-bis(orthochloroaniline)) as catalyst to effect cure.
the cured polyurethane had a Shore A durometer of about 95.
a tungsten carbide alloy striking element was attached to the head of the impact tool by molding into the polyurethane.
the tungsten carbide alloy was as described for Example 1.
care was taken to contact each sample of silicon with the urethane coated handle of the impact tool.
the silicon samples were analyzed as described in Example 1 and the results are presented in Table 2.

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Physics & Mathematics (AREA)
Fluid Mechanics (AREA)
Percussive Tools And Related Accessories (AREA)
Silicon Compounds (AREA)

EP92309423A 1991-10-23 1992-10-15 Outil de percussion à faible contamination pour casser le silicium Expired - Lifetime EP0539097B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US78147691A	1991-10-23	1991-10-23
US781476		1991-10-23

Publications (2)

Publication Number	Publication Date
EP0539097A1 true EP0539097A1 (fr)	1993-04-28
EP0539097B1 EP0539097B1 (fr)	1994-11-30

Family

ID=25122876

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP92309423A Expired - Lifetime EP0539097B1 (fr)	1991-10-23	1992-10-15	Outil de percussion à faible contamination pour casser le silicium

Country Status (5)

Country	Link
EP (1)	EP0539097B1 (fr)
JP (1)	JPH06218677A (fr)
KR (1)	KR100207163B1 (fr)
CA (1)	CA2081127A1 (fr)
DE (1)	DE69200756T2 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2384741A (en) *	2002-02-02	2003-08-06	Keith England	Hammers and the like
EP1338682A3 (fr) *	2002-02-20	2004-01-28	Hemlock Semiconductor Corporation	Copeaux sous forme fluide, procédés et appareillage pour leur fabrication ainsi que leur utilisation
US6874713B2 (en)	2002-08-22	2005-04-05	Dow Corning Corporation	Method and apparatus for improving silicon processing efficiency
EP1553214A3 (fr) *	2002-02-20	2007-03-28	Hemlock Semiconductor Corporation	Copeaux sous forme fluide, procédés et appareillage pour leur fabrication ainsi que leur utilisation
WO2007101666A3 (fr) *	2006-03-08	2008-03-27	Schott Solar Gmbh	Procédé d'obtention et/ou de recyclage de matériaux
EP2030737A3 (fr) *	2007-08-27	2009-04-29	Mitsubishi Materials Corporation	Marteau pour concasser du silicium polycristallin
DE102012204050A1 (de) *	2012-03-15	2013-09-19	Sunicon GmbH	Vorrichtung und Verfahren zum Bearbeiten von Silizium-Stücken
US20140037959A1 (en) *	2012-08-06	2014-02-06	Wacker Chemie Ag	Polycrystalline silicon chunks and method for producing them
CN111727107A (zh) *	2018-02-27	2020-09-29	株式会社德山	锤
WO2021037366A1 (fr)	2019-08-29	2021-03-04	Wacker Chemie Ag	Procédé de production de fragments de silicium

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7270706B2 (en) *	2004-10-04	2007-09-18	Dow Corning Corporation	Roll crusher to produce high purity polycrystalline silicon chips

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3148716A (en) *	1962-04-02	1964-09-15	Vanghan & Bushnell Mfg Co	Impact tool with chip-resistant striking face
US3640324A (en) *	1969-11-13	1972-02-08	Vaughan & Bushnell Mfg Co	Hammer head having an antislip and wear-resistant striking face surface
DE2152761A1 (de) *	1971-06-22	1972-12-28	Custom Electronic Systems, Inc., Indianapolis, Ind. (V.StA.)	Schlagwerkzeug
FR2337612A1 (fr) *	1976-01-12	1977-08-05	Ces Inc	Marteau
DE3204848A1 (de) *	1982-02-11	1983-08-18	Lothar Laflör GmbH & Co, 5620 Velbert	Nothammer
FR2577458A1 (fr) *	1985-02-21	1986-08-22	Maeda Shell Service Co	Marteau moule monobloc a noyaux separes de tete et de manche

1992
- 1992-10-15 EP EP92309423A patent/EP0539097B1/fr not_active Expired - Lifetime
- 1992-10-15 DE DE69200756T patent/DE69200756T2/de not_active Expired - Fee Related
- 1992-10-22 CA CA002081127A patent/CA2081127A1/fr not_active Abandoned
- 1992-10-23 JP JP4285935A patent/JPH06218677A/ja active Pending
- 1992-10-23 KR KR1019920019583A patent/KR100207163B1/ko not_active Expired - Fee Related

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3148716A (en) *	1962-04-02	1964-09-15	Vanghan & Bushnell Mfg Co	Impact tool with chip-resistant striking face
US3640324A (en) *	1969-11-13	1972-02-08	Vaughan & Bushnell Mfg Co	Hammer head having an antislip and wear-resistant striking face surface
DE2152761A1 (de) *	1971-06-22	1972-12-28	Custom Electronic Systems, Inc., Indianapolis, Ind. (V.StA.)	Schlagwerkzeug
FR2337612A1 (fr) *	1976-01-12	1977-08-05	Ces Inc	Marteau
DE3204848A1 (de) *	1982-02-11	1983-08-18	Lothar Laflör GmbH & Co, 5620 Velbert	Nothammer
FR2577458A1 (fr) *	1985-02-21	1986-08-22	Maeda Shell Service Co	Marteau moule monobloc a noyaux separes de tete et de manche

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2384741A (en) *	2002-02-02	2003-08-06	Keith England	Hammers and the like
EP1338682A3 (fr) *	2002-02-20	2004-01-28	Hemlock Semiconductor Corporation	Copeaux sous forme fluide, procédés et appareillage pour leur fabrication ainsi que leur utilisation
EP1553214A3 (fr) *	2002-02-20	2007-03-28	Hemlock Semiconductor Corporation	Copeaux sous forme fluide, procédés et appareillage pour leur fabrication ainsi que leur utilisation
US6874713B2 (en)	2002-08-22	2005-04-05	Dow Corning Corporation	Method and apparatus for improving silicon processing efficiency
US8118248B2 (en)	2006-03-08	2012-02-21	Schott Solar Ag	Method for recovering and/or recycling material
WO2007101666A3 (fr) *	2006-03-08	2008-03-27	Schott Solar Gmbh	Procédé d'obtention et/ou de recyclage de matériaux
EP2141121A1 (fr)	2006-03-08	2010-01-06	SCHOTT Solar AG	Broyeur déchiqueteur
US7694903B2 (en)	2006-03-08	2010-04-13	Schott Solar Ag	Method for recovering and/or recycling material
CN101376242B (zh) *	2007-08-27	2012-11-14	三菱麻铁里亚尔株式会社	多晶硅破碎用锤
US7950308B2 (en)	2007-08-27	2011-05-31	Mitsubishi Materials Corporation	Hammer for breaking polycrystalline silicon
EP2030737A3 (fr) *	2007-08-27	2009-04-29	Mitsubishi Materials Corporation	Marteau pour concasser du silicium polycristallin
DE102012204050A1 (de) *	2012-03-15	2013-09-19	Sunicon GmbH	Vorrichtung und Verfahren zum Bearbeiten von Silizium-Stücken
DE102012204050B4 (de) *	2012-03-15	2017-03-23	Solarworld Industries Sachsen Gmbh	Vorrichtung und Verfahren zum Bearbeiten von Silizium-Stücken
US20140037959A1 (en) *	2012-08-06	2014-02-06	Wacker Chemie Ag	Polycrystalline silicon chunks and method for producing them
US9266741B2 (en) *	2012-08-06	2016-02-23	Wacker Chemie Ag	Polycrystalline silicon chunks and method for producing them
CN111727107A (zh) *	2018-02-27	2020-09-29	株式会社德山	锤
EP3760384A4 (fr) *	2018-02-27	2021-04-28	Tokuyama Corporation	Marteau
US11794330B2 (en)	2018-02-27	2023-10-24	Tokuyama Corporation	Hammer
WO2021037366A1 (fr)	2019-08-29	2021-03-04	Wacker Chemie Ag	Procédé de production de fragments de silicium
CN114127011A (zh) *	2019-08-29	2022-03-01	瓦克化学股份公司	用于生产硅块的方法
CN114127011B (zh) *	2019-08-29	2024-03-08	瓦克化学股份公司	用于生产硅块的方法

Also Published As

Publication number	Publication date
KR100207163B1 (ko)	1999-07-15
CA2081127A1 (fr)	1993-04-24
JPH06218677A (ja)	1994-08-09
EP0539097B1 (fr)	1994-11-30
DE69200756D1 (de)	1995-01-12
KR930007591A (ko)	1993-05-20
DE69200756T2 (de)	1995-04-06

Legal Events

Date	Code	Title	Description
1993-03-12	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1993-04-28	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): DE FR GB
1993-08-11	17P	Request for examination filed	Effective date: 19930528
1993-08-18	17Q	First examination report despatched	Effective date: 19930702
1994-10-14	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
1994-11-30	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): DE FR GB
1995-01-12	REF	Corresponds to:	Ref document number: 69200756 Country of ref document: DE Date of ref document: 19950112
1995-03-03	ET	Fr: translation filed
1995-09-30	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
1995-11-22	26N	No opposition filed
1997-09-04	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: FR Payment date: 19970904 Year of fee payment: 6 Ref country code: DE Payment date: 19970904 Year of fee payment: 6
1997-09-09	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: GB Payment date: 19970909 Year of fee payment: 6
1998-10-15	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19981015
1999-06-02	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 19981015
1999-06-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990630
1999-07-30	REG	Reference to a national code	Ref country code: FR Ref legal event code: ST
1999-08-03	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990803

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