EP0562629A3 - - Google Patents

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Publication number: EP0562629A3
Authority: EP; European Patent Office
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

EP19930105051

Other versions

EP0562629A2 (en

Inventor

Takatoshi Takikawa

Shosaku Yamanaka

Takao Maeda

Keizo Harada

Shunsuke Ban

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumitomo Electric Industries Ltd

Original Assignee

Sumitomo Electric Industries Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1992-03-26

Filing date

1993-03-26

Publication date

1994-03-09

1993-03-26 Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd

1993-09-29 Publication of EP0562629A2 publication Critical patent/EP0562629A2/en

1994-03-09 Publication of EP0562629A3 publication Critical patent/EP0562629A3/xx

Status Ceased legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/66—Conductive materials thereof
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/475—Capacitors in combination with leadframes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

EP93105051A 1992-03-26 1993-03-26 Semiconductor device comprising a package Ceased EP0562629A2 (en)

Applications Claiming Priority (8)

Application Number	Priority Date	Filing Date	Title
JP6864992		1992-03-26
JP68649/92		1992-03-26
JP7710092		1992-03-31
JP77100/92		1992-03-31
JP9102192		1992-04-10
JP91021/92		1992-04-10
JP9970592		1992-04-20
JP99705/92		1992-04-20

Publications (2)

Publication Number	Publication Date
EP0562629A2 EP0562629A2 (en)	1993-09-29
EP0562629A3 true EP0562629A3 (2)	1994-03-09

Family

ID=27465023

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP93105051A Ceased EP0562629A2 (en)	1992-03-26	1993-03-26	Semiconductor device comprising a package

Country Status (2)

Country	Link
EP (1)	EP0562629A2 (2)
CA (1)	CA2092767A1 (2)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB2293918A (en) *	1994-10-06	1996-04-10	Ibm	Electronic circuit packaging
GB2312988A (en) *	1996-05-10	1997-11-12	Memory Corp Plc	Connecting a semiconductor die to a carrier
JP2003204016A (ja) *	2002-01-09	2003-07-18	Sony Corp	回路基板、これを用いた半導体装置及び電子機器
CN109326586A (zh) *	2018-08-24	2019-02-12	中国电子科技集团公司第二十九研究所	一种电源控制模块及其制造方法
CN117174682B (zh) *	2023-11-02	2024-02-20	广东芯陶微电子有限公司	Pqfn封装的dc-dc转换器及其制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1987001510A1 (en) *	1985-08-27	1987-03-12	Hughes Aircraft Company	Microelectronic package
GB2199988A (en) *	1987-01-12	1988-07-20	Intel Corp	Multi-layer molded plastic ic package
FR2609841A1 (fr) *	1987-01-20	1988-07-22	Toshiba Kk	Dispositif de circuit integre a semi-conducteurs
EP0275973A2 (en) *	1987-01-19	1988-07-27	Sumitomo Electric Industries Limited	Integrated circuit package
EP0379404A2 (en) *	1989-01-14	1990-07-25	TDK Corporation	A multilayer hybrid circuit
JPH0429360A (ja) *	1990-05-24	1992-01-31	Shinko Electric Ind Co Ltd	樹脂封止型半導体装置

1993
- 1993-03-26 CA CA002092767A patent/CA2092767A1/en not_active Abandoned
- 1993-03-26 EP EP93105051A patent/EP0562629A2/en not_active Ceased

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO1987001510A1 (en) *	1985-08-27	1987-03-12	Hughes Aircraft Company	Microelectronic package
GB2199988A (en) *	1987-01-12	1988-07-20	Intel Corp	Multi-layer molded plastic ic package
EP0275973A2 (en) *	1987-01-19	1988-07-27	Sumitomo Electric Industries Limited	Integrated circuit package
FR2609841A1 (fr) *	1987-01-20	1988-07-22	Toshiba Kk	Dispositif de circuit integre a semi-conducteurs
EP0379404A2 (en) *	1989-01-14	1990-07-25	TDK Corporation	A multilayer hybrid circuit
JPH0429360A (ja) *	1990-05-24	1992-01-31	Shinko Electric Ind Co Ltd	樹脂封止型半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 16, no. 196 (E - 1200) 12 May 1992 (1992-05-12) *

Also Published As

Publication number	Publication date
EP0562629A2 (en)	1993-09-29
CA2092767A1 (en)	1993-09-27

Legal Events

Date	Code	Title	Description
1993-08-12	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1993-09-29	AK	Designated contracting states	Kind code of ref document: A2 Designated state(s): DE FR GB
1994-01-20	PUAL	Search report despatched	Free format text: ORIGINAL CODE: 0009013
1994-03-09	AK	Designated contracting states	Kind code of ref document: A3 Designated state(s): DE FR GB
1994-06-08	17P	Request for examination filed	Effective date: 19940413
1995-05-17	17Q	First examination report despatched	Effective date: 19950331
1996-06-12	18R	Application refused	Effective date: 19960129

Publication	Publication Date	Title
TW246658B (2)	1995-05-01
BR9304651A (2)	1994-05-10
TW243525B (2)	1995-03-21
AU631518B2 (2)	1992-11-26
AU2098792A (2)	1992-11-12
BR9304980A (2)	1994-06-14
AU1803592A (2)	1992-09-03
AU1862992A (2)	1992-10-08
AU1052092A (2)	1992-11-19
AU1056992A (2)	1992-05-14
AU1081792A (2)	1992-10-22
AU1117992A (2)	1992-09-24
AU1127792A (2)	1992-12-24
AU1286992A (2)	1992-07-23
AU1299692A (2)	1992-08-13
AU1313092A (2)	1992-11-26
AU1405592A (2)	1992-07-16
AU1592892A (2)	1992-07-16
AU1610792A (2)	1992-11-19
AU1622092A (2)	1992-09-17
AU1708392A (2)	1992-10-15
AU1711092A (2)	1992-10-01
AU1729392A (2)	1992-10-22
AU1737992A (2)	1992-10-08
EP0562629A3 (2)	1994-03-09