EP0645814A3 - Leistungs-Halbleiter-Schaltmodul. - Google Patents

Leistungs-Halbleiter-Schaltmodul. Download PDF

Info

Publication number: EP0645814A3
Authority: EP; European Patent Office
Prior art keywords: power semiconductor; switching module; semiconductor switching; module; power
Prior art date: 1993-09-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP94202328A

Other languages

English (en)

French (fr)

Other versions

EP0645814A2 (de

EP0645814B1 (de

Inventor

Donald Eugene Lake

Charles Tyler Eytcheson

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Delco Electronics LLC

Original Assignee

Delco Electronics LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1993-09-07

Filing date

1994-08-16

Publication date

1995-09-20

1994-08-16 Application filed by Delco Electronics LLC filed Critical Delco Electronics LLC

1995-03-29 Publication of EP0645814A2 publication Critical patent/EP0645814A2/de

1995-09-20 Publication of EP0645814A3 publication Critical patent/EP0645814A3/de

1998-11-04 Application granted granted Critical

1998-11-04 Publication of EP0645814B1 publication Critical patent/EP0645814B1/de

2014-08-16 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes

EP94202328A 1993-09-07 1994-08-16 Leistungs-Halbleiter-Schaltmodul Expired - Lifetime EP0645814B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US08/116,793 US5519253A (en)	1993-09-07	1993-09-07	Coaxial switch module
US116793		1993-09-07

Publications (3)

Publication Number	Publication Date
EP0645814A2 EP0645814A2 (de)	1995-03-29
EP0645814A3 true EP0645814A3 (de)	1995-09-20
EP0645814B1 EP0645814B1 (de)	1998-11-04

Family

ID=22369260

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP94202328A Expired - Lifetime EP0645814B1 (de)	1993-09-07	1994-08-16	Leistungs-Halbleiter-Schaltmodul

Country Status (4)

Country	Link
US (1)	US5519253A (de)
EP (1)	EP0645814B1 (de)
JP (1)	JPH07169906A (de)
DE (1)	DE69414337T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3476612B2 (ja) *	1995-12-21	2003-12-10	三菱電機株式会社	半導体装置
US5736787A (en) *	1996-07-11	1998-04-07	Larimer; William R.	Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices
JP3124513B2 (ja) *	1997-06-18	2001-01-15	三菱電機株式会社	電力半導体スイッチ装置
US6020636A (en) *	1997-10-24	2000-02-01	Eni Technologies, Inc.	Kilowatt power transistor
US6127727A (en) *	1998-04-06	2000-10-03	Delco Electronics Corp.	Semiconductor substrate subassembly with alignment and stress relief features
US5895974A (en) *	1998-04-06	1999-04-20	Delco Electronics Corp.	Durable substrate subassembly for transistor switch module
US6054765A (en) *	1998-04-27	2000-04-25	Delco Electronics Corporation	Parallel dual switch module
JP3480901B2 (ja) *	1998-06-18	2003-12-22	株式会社東芝	圧接形半導体素子および電力変換装置
US6262553B1 (en) *	1999-04-13	2001-07-17	M. P. Menze Research & Development Inc.	Control for material spreaders
US6917152B2 (en) *	2002-07-26	2005-07-12	Osram Sylvania Inc.	2nd anode button for cathode ray tube
US7692293B2 (en) *	2004-12-17	2010-04-06	Siemens Aktiengesellschaft	Semiconductor switching module
EP1936687A1 (de) *	2006-12-22	2008-06-25	ABB Technology AG	Elektrischer Kontakt
US7591027B2 (en)	2007-02-22	2009-09-22	Donald Ernest Scruggs	Flushette partial and full toilet flush devices
JP4840314B2 (ja) *	2007-09-26	2011-12-21	三菱電機株式会社	電力半導体モジュール
DE102009002993B4 (de) *	2009-05-11	2012-10-04	Infineon Technologies Ag	Leistungshalbleitermodul mit beabstandeten Schaltungsträgern
TWI406444B (zh) *	2010-03-05	2013-08-21	Prologium Technology Co	電能供應系統之封裝結構及其應用之電能供應系統
KR101337797B1 (ko) *	2010-07-14	2013-12-06	한미사이언스 주식회사	지속형 인간 성장 호르몬 결합체 액상 제제
EP2790217A1 (de) *	2013-04-09	2014-10-15	ABB Technology AG	Leistungshalbleitermodul
DE102014109385A1 (de)	2014-07-04	2016-01-07	Karlsruher Institut für Technologie	Elektronische Bauteilanordnung
JP6344197B2 (ja) *	2014-10-30	2018-06-20	富士電機株式会社	半導体装置
CN107112898B (zh)	2014-11-18	2019-06-21	通用电气全球采购有限责任公司	母线和功率电子装置及制造引线端连接器的方法
DE102016106681A1 (de) *	2016-04-12	2017-10-12	First Sensor Lewicki GmbH	Elektronische Baugruppe
US10137789B2 (en) *	2016-07-20	2018-11-27	Ford Global Technologies, Llc	Signal pin arrangement for multi-device power module
US20180275760A1 (en)	2017-03-23	2018-09-27	Mindmaze Holding Sa	System, method and apparatus for accurately measuring haptic forces
US11205825B2 (en)	2018-03-23	2021-12-21	Victor Nelson	Non-contact type coaxial switch
US11069640B2 (en)	2019-06-14	2021-07-20	Cree Fayetteville, Inc.	Package for power electronics
CN114846600A (zh) *	2019-12-28	2022-08-02	丹佛斯硅动力有限责任公司	具有改进的电气特性和热特性的功率模块
US11967899B2 (en) *	2020-05-22	2024-04-23	Marel Power Solutions	Fluid cooled inverter
US11569174B2 (en)	2021-02-18	2023-01-31	Wolfspeed, Inc.	Integrated power module

Citations (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3714709A (en) *	1970-07-06	1973-02-06	Rca Corp	Method of manufacturing thick-film hybrid integrated circuits
DE2441902A1 (de) *	1974-09-02	1976-06-16	Siemens Ag	Schaltungsanordnung mit einander parallel geschalteten steuerbaren halbleiterbauelementen
FR2452178A1 (fr) *	1979-03-19	1980-10-17	Gen Electric	Dispositif semi-conducteur a faible impedance thermique
EP0035135A2 (de) *	1980-02-13	1981-09-09	SEMIKRON Elektronik GmbH	Halbleiterbaueinheit mit wenigstens zwei Halbleiterbauelementen
JPS5710958A (en) *	1980-06-25	1982-01-20	Shindengen Electric Mfg Co Ltd	Semiconductor device
JPS62150871A (ja) *	1985-12-25	1987-07-04	Hitachi Ltd	半導体装置
EP0427143A2 (de) *	1989-11-07	1991-05-15	IXYS Semiconductor GmbH	Leistungshalbleitermodul
WO1993008601A1 (en) *	1991-10-16	1993-04-29	General Electric Company	Mounting arrangements for high voltage/high power semiconductors
EP0553981A2 (de) *	1992-01-29	1993-08-04	General Electric Company	Packung von niedriger Induktanz für mehrere parallelgeschaltete, bei hoher Frequenz betriebenen Anordnungen
JPH05292756A (ja) *	1992-04-14	1993-11-05	Toshiba Corp	電力変換装置

1993
- 1993-09-07 US US08/116,793 patent/US5519253A/en not_active Expired - Lifetime
1994
- 1994-08-16 EP EP94202328A patent/EP0645814B1/de not_active Expired - Lifetime
- 1994-08-16 DE DE69414337T patent/DE69414337T2/de not_active Expired - Fee Related
- 1994-09-07 JP JP6213905A patent/JPH07169906A/ja active Pending

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3714709A (en) *	1970-07-06	1973-02-06	Rca Corp	Method of manufacturing thick-film hybrid integrated circuits
DE2441902A1 (de) *	1974-09-02	1976-06-16	Siemens Ag	Schaltungsanordnung mit einander parallel geschalteten steuerbaren halbleiterbauelementen
FR2452178A1 (fr) *	1979-03-19	1980-10-17	Gen Electric	Dispositif semi-conducteur a faible impedance thermique
EP0035135A2 (de) *	1980-02-13	1981-09-09	SEMIKRON Elektronik GmbH	Halbleiterbaueinheit mit wenigstens zwei Halbleiterbauelementen
JPS5710958A (en) *	1980-06-25	1982-01-20	Shindengen Electric Mfg Co Ltd	Semiconductor device
JPS62150871A (ja) *	1985-12-25	1987-07-04	Hitachi Ltd	半導体装置
EP0427143A2 (de) *	1989-11-07	1991-05-15	IXYS Semiconductor GmbH	Leistungshalbleitermodul
WO1993008601A1 (en) *	1991-10-16	1993-04-29	General Electric Company	Mounting arrangements for high voltage/high power semiconductors
EP0553981A2 (de) *	1992-01-29	1993-08-04	General Electric Company	Packung von niedriger Induktanz für mehrere parallelgeschaltete, bei hoher Frequenz betriebenen Anordnungen
JPH05292756A (ja) *	1992-04-14	1993-11-05	Toshiba Corp	電力変換装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
D. MALINIAK, ELECTRONIC DESIGN, vol. 41, no. 15, 22 July 1993 (1993-07-22), HASBROUCK HEIGHTS, NEW JERSEY US, pages 35 *
PATENT ABSTRACTS OF JAPAN vol. 11, no. 384 (E - 565) 15 December 1987 (1987-12-15) *
PATENT ABSTRACTS OF JAPAN vol. 18, no. 88 (E - 1507) 14 February 1994 (1994-02-14) *
PATENT ABSTRACTS OF JAPAN vol. 6, no. 72 (E - 105) 7 May 1982 (1982-05-07) *

Also Published As

Publication number	Publication date
JPH07169906A (ja)	1995-07-04
US5519253A (en)	1996-05-21
DE69414337D1 (de)	1998-12-10
EP0645814A2 (de)	1995-03-29
DE69414337T2 (de)	1999-04-01
EP0645814B1 (de)	1998-11-04

Legal Events

Date	Code	Title	Description
1995-02-10	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
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1997-03-26	17Q	First examination report despatched	Effective date: 19970205
1997-12-17	GRAG	Despatch of communication of intention to grant	Free format text: ORIGINAL CODE: EPIDOS AGRA
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1998-03-31	GRAH	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOS IGRA
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Publication	Publication Date	Title
EP0645814A3 (de)	1995-09-20	Leistungs-Halbleiter-Schaltmodul.
EP0645815A3 (de)	1995-09-06	Hochleistungs-Halbleiter-Schaltmodul.
EP0594395A3 (de)	1995-01-11	Leistungshalbleitermodul.
DE69420327D1 (de)	1999-10-07	Halbleiter-Leistungsschaltung
DE59611245D1 (de)	2005-08-18	Leistungshalbleitermodul
DE69638295D1 (de)	2011-01-05	Halbleiterleistungsmodul
DE69420672D1 (de)	1999-10-21	Leistungsschaltung
DE59406106D1 (de)	1998-07-09	Leistungshalbleiterbauelement
DE69319026D1 (de)	1998-07-16	Halbleiter-Leistungsmodul
DE69325953D1 (de)	1999-09-16	Leistungshalbleitermodul
DE59304797D1 (de)	1997-01-30	Leistungshalbleiter-Modul
DE59504782D1 (de)	1999-02-25	Niederinduktives Leistungshalbleitermodul
EP0723338A3 (de)	1996-12-11	Schaltkreis
DE69616251D1 (de)	2001-11-29	Halbleiteranordnung mit Halbleiterleistungselementen
FR2724790B1 (fr)	1997-10-31	Circuit de commutation
DE69943196D1 (de)	2011-03-31	Halbleiter-Leistungs-Modul
EP0618668A3 (de)	1994-10-12	Leistungswechselrichter-Einrichtung.
DE59611068D1 (de)	2004-10-07	Leistungs-Halbleitermodul
DE59508681D1 (de)	2000-10-05	Leistungshalbleitermodul
FR2713387B1 (fr)	1996-01-12	Condenseur de puissance.
DE69501245D1 (de)	1998-01-29	Schaltleistungsschaltung
DE59610548D1 (de)	2003-07-31	Leistungshalbleitermodul
FR2706631B1 (fr)	1997-12-12	Module de commutation optique compact.
DE69409597D1 (de)	1998-05-20	Leistungshalbleiterbauelement
ITBO970411A0 (it)	1997-07-04	Apparecchiatura ausiliaria di alimentazione elettrica.