EP0673547A4 - ELECTRONIC COMPONENT SEALED WITH ADHESIVE DISPENSER. - Google Patents

ELECTRONIC COMPONENT SEALED WITH ADHESIVE DISPENSER.

Info

Publication number: EP0673547A4
Authority: EP; European Patent Office
Prior art keywords: electronic component; adhesive dispenser; component sealed; sealed; dispenser
Prior art date: 1992-12-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP94901644A

Other languages

German (de)

French (fr)

Other versions

EP0673547A1 (en

Inventor

Dexin Liang

George Anthony Brathwaite

Paul Robert Hoffman

German Jamlig Ramirez

Linda E Strauman

Deepak Mahulikar

Anthony M Pasqualoni

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Olin Corp

Original Assignee

Olin Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1992-12-09

Filing date

1993-11-22

Publication date

1996-03-13

1993-11-22 Application filed by Olin Corp filed Critical Olin Corp

1995-09-27 Publication of EP0673547A1 publication Critical patent/EP0673547A1/en

1996-03-13 Publication of EP0673547A4 publication Critical patent/EP0673547A4/en

Status Withdrawn legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Definitions

Figure 1 shows in exploded isometric view a metal electronic package as known from the prior art.
Figure 2 shows in top planar view an epoxy sheet for stamping a window frame of adhesive as known from the prior art.
FIG. 1 shows in exploded isometric view an adhesively sealed electronic package 10 as known from the prior art.
the adhesively sealed electronic package 10 has a base component 12 and a cover component 14.
the base component 12 and cover component 14 are made from a variety of materials such as ceramics, molded plastics and metals. Metallic materials such as copper, aluminum and their alloys have proven successful. The high thermal conductivity of the metals effectively dissipate heat from an encased semiconductor device.
a leadframe 16 is disposed between and adhesively bonded to both the base component 12 and cover component 14.
a second window frame shaped adhesive sheet 20 bonds the other side of the leadframe 16 to the cover component 14.
the five components, the base component 12, first adhesive sheet 18, leadframe 16, second adhesive sheet 20 and cover component 14 must be accurately aligned in a machined fixture for assembly. Different fixtures are required for each size package and lead configuration.
Package assembly is completed as illustrated in Figure 9 by the placement of a cover component 14 on the second adhesive.
the package 48 i ⁇ then thermally cured.

EP94901644A 1992-12-09 1993-11-22 ELECTRONIC COMPONENT SEALED WITH ADHESIVE DISPENSER. Withdrawn EP0673547A4 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US98786792A	1992-12-09	1992-12-09
US987867		1992-12-09
PCT/US1993/011337 WO1994014193A1 (en)	1992-12-09	1993-11-22	Electronic package sealed with a dispensable adhesive

Publications (2)

Publication Number	Publication Date
EP0673547A1 EP0673547A1 (en)	1995-09-27
EP0673547A4 true EP0673547A4 (en)	1996-03-13

Family

ID=25533645

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP94901644A Withdrawn EP0673547A4 (en)	1992-12-09	1993-11-22	ELECTRONIC COMPONENT SEALED WITH ADHESIVE DISPENSER.

Country Status (5)

Country	Link
EP (1)	EP0673547A4 (en)
JP (1)	JPH08505266A (en)
AU (1)	AU5616194A (en)
CA (1)	CA2150569A1 (en)
WO (1)	WO1994014193A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
SE508138C2 (en)	1996-12-20	1998-08-31	Ericsson Telefon Ab L M	Method and apparatus for connecting electrical component to circuit board
SE508139C2 (en) *	1996-12-20	1998-08-31	Ericsson Telefon Ab L M	Method and apparatus for connecting electrical component to circuit board
KR100697624B1 (en) *	2005-07-18	2007-03-22	삼성전자주식회사	Package substrate having surface structure for adhesive flow control and semiconductor package using same
WO2019093269A1 (en) *	2017-11-09	2019-05-16	Ｎｇｋエレクトロデバイス株式会社	Cover member and electronic device
JP6929210B2 (en) *	2017-12-11	2021-09-01	株式会社ブリヂストン	tire

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4622433A (en) *	1984-03-30	1986-11-11	Diacon, Inc.	Ceramic package system using low temperature sealing glasses
US4629824A (en) *	1984-12-24	1986-12-16	Gte Products Corporation	IC package sealing technique
US4704626A (en) *	1985-07-08	1987-11-03	Olin Corporation	Graded sealing systems for semiconductor package
US5023398A (en) *	1988-10-05	1991-06-11	Olin Corporation	Aluminum alloy semiconductor packages
US5043534A (en) *	1990-07-02	1991-08-27	Olin Corporation	Metal electronic package having improved resistance to electromagnetic interference
EP0447884A2 (en) *	1990-03-23	1991-09-25	Motorola, Inc.	Semiconductor device having a low temperature UV-cured epoxy seal and method for making the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4139726A (en) *	1978-01-16	1979-02-13	Allen-Bradley Company	Packaged microcircuit and method for assembly thereof
US5013871A (en) *	1988-02-10	1991-05-07	Olin Corporation	Kit for the assembly of a metal electronic package
US5098864A (en) *	1989-11-29	1992-03-24	Olin Corporation	Process for manufacturing a metal pin grid array package

1993
- 1993-11-22 EP EP94901644A patent/EP0673547A4/en not_active Withdrawn
- 1993-11-22 AU AU56161/94A patent/AU5616194A/en not_active Abandoned
- 1993-11-22 WO PCT/US1993/011337 patent/WO1994014193A1/en not_active Ceased
- 1993-11-22 JP JP6514193A patent/JPH08505266A/en active Pending
- 1993-11-22 CA CA002150569A patent/CA2150569A1/en not_active Abandoned

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4622433A (en) *	1984-03-30	1986-11-11	Diacon, Inc.	Ceramic package system using low temperature sealing glasses
US4629824A (en) *	1984-12-24	1986-12-16	Gte Products Corporation	IC package sealing technique
US4704626A (en) *	1985-07-08	1987-11-03	Olin Corporation	Graded sealing systems for semiconductor package
US5023398A (en) *	1988-10-05	1991-06-11	Olin Corporation	Aluminum alloy semiconductor packages
EP0447884A2 (en) *	1990-03-23	1991-09-25	Motorola, Inc.	Semiconductor device having a low temperature UV-cured epoxy seal and method for making the same
US5043534A (en) *	1990-07-02	1991-08-27	Olin Corporation	Metal electronic package having improved resistance to electromagnetic interference

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9414193A1 *

Also Published As

Publication number	Publication date
EP0673547A1 (en)	1995-09-27
JPH08505266A (en)	1996-06-04
AU5616194A (en)	1994-07-04
CA2150569A1 (en)	1994-06-23
WO1994014193A1 (en)	1994-06-23

Legal Events

Date	Code	Title	Description
1995-08-11	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
1995-09-27	17P	Request for examination filed	Effective date: 19950608
1995-09-27	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): DE FR GB IT NL
1996-03-13	A4	Supplementary search report drawn up and despatched
1996-03-13	AK	Designated contracting states	Kind code of ref document: A4 Designated state(s): DE FR GB IT NL
1997-11-19	17Q	First examination report despatched	Effective date: 19971006
1999-10-15	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
1999-12-01	18D	Application deemed to be withdrawn	Effective date: 19990601

Publication	Publication Date	Title
DE69308150D1 (en)	1997-03-27	A CONTAINER
ID956B (en)	1996-09-26	ASSEMBLY CONTAINER CONTAINERS
DE69332442D1 (en)	2002-11-28	Blackboard with integrated display
FR2550009B1 (en)	1986-01-24	ELECTRONIC COMPONENT HOUSING PROVIDED WITH A CAPACITOR
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IT1278326B1 (en)	1997-11-17	BAG OR MULTI-LAYER BAG WITH A BOTTOM.
EP0673547A4 (en)	1996-03-13	ELECTRONIC COMPONENT SEALED WITH ADHESIVE DISPENSER.
GB9305957D0 (en)	1993-05-12	Electronic finder
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DE69413713D1 (en)	1998-11-05	COATING AGENTS WITH A HIGH SOLIDS PART
CH682967GA3 (en)	1993-12-31	Display device for a timepiece.
DE59407606D1 (en)	1999-02-18	ELECTRONIC COUNTER
GB2264676B (en)	1996-01-03	A liquid applicator.
ITMI940089A0 (en)	1994-01-21	VISCOSITY COUPLING
ITMI940252A0 (en)	1994-02-11	BEVEL CORNER CONNECTION
NO934450L (en)	1994-06-10	The epoxy resin
KR940001907U (en)	1994-01-03	Condenser container
GB9306708D0 (en)	1993-05-26	Electronic spirit dispenser
FI935462A0 (en)	1993-12-07	This is the case when transport is carried out on a double plan