EP0673547A4 - Elektronikgehause, das mit einem verteilbaren klebstoff versigelt wird. - Google Patents

Elektronikgehause, das mit einem verteilbaren klebstoff versigelt wird.

Info

Publication number
EP0673547A4
EP0673547A4 EP94901644A EP94901644A EP0673547A4 EP 0673547 A4 EP0673547 A4 EP 0673547A4 EP 94901644 A EP94901644 A EP 94901644A EP 94901644 A EP94901644 A EP 94901644A EP 0673547 A4 EP0673547 A4 EP 0673547A4
Authority
EP
European Patent Office
Prior art keywords
electronic component
adhesive dispenser
component sealed
sealed
dispenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP94901644A
Other languages
English (en)
French (fr)
Other versions
EP0673547A1 (de
Inventor
Dexin Liang
George Anthony Brathwaite
Paul Robert Hoffman
German Jamlig Ramirez
Linda E Strauman
Deepak Mahulikar
Anthony M Pasqualoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of EP0673547A1 publication Critical patent/EP0673547A1/de
Publication of EP0673547A4 publication Critical patent/EP0673547A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Definitions

  • Figure 1 shows in exploded isometric view a metal electronic package as known from the prior art.
  • Figure 2 shows in top planar view an epoxy sheet for stamping a window frame of adhesive as known from the prior art.
  • FIG. 1 shows in exploded isometric view an adhesively sealed electronic package 10 as known from the prior art.
  • the adhesively sealed electronic package 10 has a base component 12 and a cover component 14.
  • the base component 12 and cover component 14 are made from a variety of materials such as ceramics, molded plastics and metals. Metallic materials such as copper, aluminum and their alloys have proven successful. The high thermal conductivity of the metals effectively dissipate heat from an encased semiconductor device.
  • a leadframe 16 is disposed between and adhesively bonded to both the base component 12 and cover component 14.
  • a second window frame shaped adhesive sheet 20 bonds the other side of the leadframe 16 to the cover component 14.
  • the five components, the base component 12, first adhesive sheet 18, leadframe 16, second adhesive sheet 20 and cover component 14 must be accurately aligned in a machined fixture for assembly. Different fixtures are required for each size package and lead configuration.
  • Package assembly is completed as illustrated in Figure 9 by the placement of a cover component 14 on the second adhesive.
  • the package 48 i ⁇ then thermally cured.
EP94901644A 1992-12-09 1993-11-22 Elektronikgehause, das mit einem verteilbaren klebstoff versigelt wird. Withdrawn EP0673547A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US98786792A 1992-12-09 1992-12-09
US987867 1992-12-09
PCT/US1993/011337 WO1994014193A1 (en) 1992-12-09 1993-11-22 Electronic package sealed with a dispensable adhesive

Publications (2)

Publication Number Publication Date
EP0673547A1 EP0673547A1 (de) 1995-09-27
EP0673547A4 true EP0673547A4 (de) 1996-03-13

Family

ID=25533645

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94901644A Withdrawn EP0673547A4 (de) 1992-12-09 1993-11-22 Elektronikgehause, das mit einem verteilbaren klebstoff versigelt wird.

Country Status (5)

Country Link
EP (1) EP0673547A4 (de)
JP (1) JPH08505266A (de)
AU (1) AU5616194A (de)
CA (1) CA2150569A1 (de)
WO (1) WO1994014193A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE508138C2 (sv) 1996-12-20 1998-08-31 Ericsson Telefon Ab L M Metod och anordning för anslutning av elektrisk komponent till kretskort
SE508139C2 (sv) * 1996-12-20 1998-08-31 Ericsson Telefon Ab L M Metod och anordning för anslutning av elektrisk komponent till kretskort
KR100697624B1 (ko) * 2005-07-18 2007-03-22 삼성전자주식회사 접착제 흐름 제어를 위한 표면 구조를 가지는 패키지 기판및 이를 이용한 반도체 패키지
WO2019093269A1 (ja) * 2017-11-09 2019-05-16 Ｎｇｋエレクトロデバイス株式会社 蓋体および電子装置
JP6929210B2 (ja) * 2017-12-11 2021-09-01 株式会社ブリヂストン タイヤ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622433A (en) * 1984-03-30 1986-11-11 Diacon, Inc. Ceramic package system using low temperature sealing glasses
US4629824A (en) * 1984-12-24 1986-12-16 Gte Products Corporation IC package sealing technique
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference
EP0447884A2 (de) * 1990-03-23 1991-09-25 Motorola, Inc. Halbleitervorrichtung mit einer bei niederer Temperatur ausgehärteten Epoxy-Vergussmasse und Verfahren zu ihrer Herstellung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139726A (en) * 1978-01-16 1979-02-13 Allen-Bradley Company Packaged microcircuit and method for assembly thereof
US5013871A (en) * 1988-02-10 1991-05-07 Olin Corporation Kit for the assembly of a metal electronic package
US5098864A (en) * 1989-11-29 1992-03-24 Olin Corporation Process for manufacturing a metal pin grid array package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622433A (en) * 1984-03-30 1986-11-11 Diacon, Inc. Ceramic package system using low temperature sealing glasses
US4629824A (en) * 1984-12-24 1986-12-16 Gte Products Corporation IC package sealing technique
US4704626A (en) * 1985-07-08 1987-11-03 Olin Corporation Graded sealing systems for semiconductor package
US5023398A (en) * 1988-10-05 1991-06-11 Olin Corporation Aluminum alloy semiconductor packages
EP0447884A2 (de) * 1990-03-23 1991-09-25 Motorola, Inc. Halbleitervorrichtung mit einer bei niederer Temperatur ausgehärteten Epoxy-Vergussmasse und Verfahren zu ihrer Herstellung
US5043534A (en) * 1990-07-02 1991-08-27 Olin Corporation Metal electronic package having improved resistance to electromagnetic interference

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO9414193A1 *

Also Published As

Publication number Publication date
EP0673547A1 (de) 1995-09-27
JPH08505266A (ja) 1996-06-04
AU5616194A (en) 1994-07-04
CA2150569A1 (en) 1994-06-23
WO1994014193A1 (en) 1994-06-23

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