EP0716910A3 - Drahtgattersäge, Sägeverfahren und Behalter für gesägte Wafern - Google Patents

Drahtgattersäge, Sägeverfahren und Behalter für gesägte Wafern Download PDF

Info

Publication number
EP0716910A3
EP0716910A3 EP95119709A EP95119709A EP0716910A3 EP 0716910 A3 EP0716910 A3 EP 0716910A3 EP 95119709 A EP95119709 A EP 95119709A EP 95119709 A EP95119709 A EP 95119709A EP 0716910 A3 EP0716910 A3 EP 0716910A3
Authority
EP
European Patent Office
Prior art keywords
same
cassette
housing
wire saw
saw device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95119709A
Other languages
English (en)
French (fr)
Other versions
EP0716910A2 (de
EP0716910B1 (de
Inventor
Tadashi Tonegawa
Junzo Wakuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31162494A external-priority patent/JP3143570B2/ja
Priority claimed from JP06812595A external-priority patent/JP3163231B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of EP0716910A2 publication Critical patent/EP0716910A2/de
Publication of EP0716910A3 publication Critical patent/EP0716910A3/de
Application granted granted Critical
Publication of EP0716910B1 publication Critical patent/EP0716910B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP95119709A 1994-12-15 1995-12-14 Drahtgittersäge und Sägeverfahren Expired - Lifetime EP0716910B1 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP31162494 1994-12-15
JP31162494A JP3143570B2 (ja) 1994-12-15 1994-12-15 マルチワイヤーソー
JP311624/94 1994-12-15
JP6812595 1995-03-27
JP68125/95 1995-03-27
JP06812595A JP3163231B2 (ja) 1995-03-27 1995-03-27 マルチワイヤーソー装置及びこれを用いたスライス方法

Publications (3)

Publication Number Publication Date
EP0716910A2 EP0716910A2 (de) 1996-06-19
EP0716910A3 true EP0716910A3 (de) 1997-05-02
EP0716910B1 EP0716910B1 (de) 2002-03-27

Family

ID=26409358

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95119709A Expired - Lifetime EP0716910B1 (de) 1994-12-15 1995-12-14 Drahtgittersäge und Sägeverfahren

Country Status (3)

Country Link
US (1) US5715806A (de)
EP (1) EP0716910B1 (de)
DE (1) DE69526038T2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
JPH09272119A (ja) * 1996-04-04 1997-10-21 Daido Hoxan Inc ウエハの製法およびそれに用いる装置
JPH09286021A (ja) * 1996-04-22 1997-11-04 Komatsu Electron Metals Co Ltd 半導体インゴットの切断方法
JPH1022244A (ja) * 1996-06-29 1998-01-23 Komatsu Electron Metals Co Ltd 半導体ウェハの洗浄用バスケット
JP3273163B2 (ja) * 1996-09-06 2002-04-08 シャープ株式会社 マルチワイヤソー
US6279564B1 (en) 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US5878737A (en) * 1997-07-07 1999-03-09 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US6024080A (en) * 1997-07-07 2000-02-15 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
JP2001510742A (ja) * 1997-07-07 2001-08-07 レーザー・テクノロジー・ウエスト・リミテッド ダイヤモンドインプリグネイテッドワイヤを利用して加工物を薄切りにするための装置および方法
JP3625408B2 (ja) * 1999-03-09 2005-03-02 シャープ株式会社 マルチワイヤソーを用いた加工方法
US6112738A (en) * 1999-04-02 2000-09-05 Memc Electronics Materials, Inc. Method of slicing silicon wafers for laser marking
US6915796B2 (en) * 2002-09-24 2005-07-12 Chien-Min Sung Superabrasive wire saw and associated methods of manufacture
CH696807A5 (fr) * 2003-01-13 2007-12-14 Hct Shaping Systems S A Dispositif de sciage par fil.
CH698391B1 (fr) * 2003-12-17 2009-07-31 Applied Materials Switzerland Dispositif de sciage par fil.
KR20070004073A (ko) * 2004-03-30 2007-01-05 솔라익스 인코퍼레이티드 초박형 실리콘 웨이퍼 절단방법 및 장치
KR100667690B1 (ko) * 2004-11-23 2007-01-12 주식회사 실트론 웨이퍼 슬라이싱 방법 및 장치
DE102005028112A1 (de) * 2005-06-13 2006-12-21 Schmid Technology Systems Gmbh Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung
DE102006050330B4 (de) * 2006-10-25 2009-10-22 Siltronic Ag Verfahren zum gleichzeitigen Auftrennen von wenigstens zwei zylindrischen Werkstücken in eine Vielzahl von Scheiben
DE102007028439A1 (de) 2007-06-18 2008-12-24 Schott Ag Verfahren zum Abtrennen einer Mehrzahl von Halbleiterscheiben von einem Halbleitermaterial-Rohblock
US7909678B2 (en) * 2007-08-27 2011-03-22 Schott Ag Method for manufacturing silicone wafers
US20100300259A1 (en) * 2009-05-29 2010-12-02 Applied Materials, Inc. Substrate side marking and identification
CN102574226A (zh) * 2009-09-18 2012-07-11 应用材料公司 线锯工件支撑装置、支撑间隔件及其使用方法
TW201112317A (en) * 2009-09-22 2011-04-01 Ching Hung Machinery & Electric Ind Co Ltd Serial multi-thread saw crystal slicing device
CN102172996B (zh) * 2011-02-14 2014-09-24 上海日进机床有限公司 浸晶切割方法
JP2013038116A (ja) * 2011-08-04 2013-02-21 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶基板の製造方法
DE102011090053A1 (de) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles
US20130251940A1 (en) * 2012-03-23 2013-09-26 Sheng Sun Method of cutting an ingot for solar cell fabrication
WO2013153691A1 (ja) * 2012-04-12 2013-10-17 三菱電機株式会社 ワイヤ放電加工装置およびこれを用いた半導体ウエハの製造方法
CN102941628B (zh) * 2012-07-31 2014-12-24 南通皋鑫电子股份有限公司 二极管硅叠切割工艺及其专用工装
CN103878891A (zh) * 2012-12-24 2014-06-25 九州方园新能源股份有限公司 一种设有倒角导向条的硅棒
DE102013202028A1 (de) * 2013-02-07 2014-08-07 Robert Bosch Gmbh Verfahren zum Herstellen von Wafern, insbesondere von Wafern für Solarzellen, und Vorrichtung zum Herstellen von Wafern
CN105216127B (zh) * 2015-08-28 2017-07-07 厦门钨业股份有限公司 多线切割方法及多线切割机
JP6249319B1 (ja) * 2017-03-30 2017-12-20 パナソニックＩｐマネジメント株式会社 ソーワイヤー及び切断装置
CN108638353A (zh) * 2017-05-24 2018-10-12 林晓丽 利用金刚线切割的设备
JP6751900B2 (ja) * 2018-01-29 2020-09-09 パナソニックＩｐマネジメント株式会社 金属線及びソーワイヤー
CN111361030B (zh) * 2020-04-24 2021-11-23 西安奕斯伟材料科技有限公司 多线切割装置及多线切割方法
CN113752402B (zh) 2021-09-16 2022-07-12 广东金湾高景太阳能科技有限公司 一种大尺寸硅片提料划伤亮线的解决方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2024715A (en) * 1934-11-21 1935-12-17 William C Bonnett Apparatus for making button blanks from pearl stock
JPS61182761A (ja) * 1985-02-07 1986-08-15 Sumitomo Metal Ind Ltd ワイヤソーにおけるウェハ列の一括取出方法
US4625093A (en) * 1984-08-14 1986-11-25 Massachusetts Institute Of Technology Stock removal by laser cutting
US4655191A (en) * 1985-03-08 1987-04-07 Motorola, Inc. Wire saw machine
US5054626A (en) * 1990-09-13 1991-10-08 George Stempinski Storage rack
US5351446A (en) * 1991-10-15 1994-10-04 Wacker-Chemtronic Gesellschaft fur Elecktronik-Grundstoffe mbH Method and apparatus for the rotary sawing of brittle and hard materials

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1619128A (en) * 1923-12-17 1927-03-01 Uline Ice Scoring Machine Comp Ice-scoring machine
US3032026A (en) * 1959-07-18 1962-05-01 Bosch Gmbh Robert Device for slicing semiconductor crystals and the like
US3540427A (en) * 1968-06-14 1970-11-17 Ibm Electro-optic array and method of making same
US3599623A (en) * 1969-09-02 1971-08-17 Fairchild Camera Instr Co Cutting apparatus for making finely controlled cuts utilizing a tiltable wheel for regulating the cutting blade movement
SU715345A1 (ru) * 1977-11-02 1980-02-15 Всесоюзный Научно-Исследовательский И Проектно-Изыскательский Институт По Проблемам Добычи Транспорта И Переработки Минерального Сырья В Промышленности Строительных Материалов Способ изготовлени бортового камн
US4287869A (en) * 1978-03-13 1981-09-08 Crystal Systems Inc. Charging system for cutting blade
JP2673544B2 (ja) * 1988-06-14 1997-11-05 株式会社日平トヤマ 脆性材料の切断方法
JPH0790547B2 (ja) * 1990-11-01 1995-10-04 住友金属工業株式会社 マルチワイヤソーによる切断方法
JP2551229B2 (ja) * 1990-11-01 1996-11-06 住友金属工業株式会社 マルチワイヤソーによる切断方法およびその装置
JP3325676B2 (ja) * 1993-11-29 2002-09-17 シャープ株式会社 シリコンインゴットのスライス加工方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2024715A (en) * 1934-11-21 1935-12-17 William C Bonnett Apparatus for making button blanks from pearl stock
US4625093A (en) * 1984-08-14 1986-11-25 Massachusetts Institute Of Technology Stock removal by laser cutting
JPS61182761A (ja) * 1985-02-07 1986-08-15 Sumitomo Metal Ind Ltd ワイヤソーにおけるウェハ列の一括取出方法
US4655191A (en) * 1985-03-08 1987-04-07 Motorola, Inc. Wire saw machine
US5054626A (en) * 1990-09-13 1991-10-08 George Stempinski Storage rack
US5351446A (en) * 1991-10-15 1994-10-04 Wacker-Chemtronic Gesellschaft fur Elecktronik-Grundstoffe mbH Method and apparatus for the rotary sawing of brittle and hard materials

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
A.S. SHAH ET AL: "ROW-PASS LASER CUTTING", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 16, no. 10, March 1974 (1974-03-01), NEW YORK US, pages 3237, XP002026794 *

Also Published As

Publication number Publication date
EP0716910A2 (de) 1996-06-19
DE69526038T2 (de) 2002-10-31
US5715806A (en) 1998-02-10
EP0716910B1 (de) 2002-03-27
DE69526038D1 (de) 2002-05-02

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