EP0800433A1 - Procede de controle de connexions realisees par microcablage aux ultrasons - Google Patents

Procede de controle de connexions realisees par microcablage aux ultrasons

Info

Publication number
EP0800433A1
EP0800433A1 EP95938352A EP95938352A EP0800433A1 EP 0800433 A1 EP0800433 A1 EP 0800433A1 EP 95938352 A EP95938352 A EP 95938352A EP 95938352 A EP95938352 A EP 95938352A EP 0800433 A1 EP0800433 A1 EP 0800433A1
Authority
EP
European Patent Office
Prior art keywords
connection
bond
strength
wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95938352A
Other languages
German (de)
English (en)
Other versions
EP0800433B1 (fr
Inventor
Arno Altpeter
Franz RIEDMÜLLER
Manfred Reinold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP0800433A1 publication Critical patent/EP0800433A1/fr
Application granted granted Critical
Publication of EP0800433B1 publication Critical patent/EP0800433B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Definitions

  • the invention is based on a method for testing connections produced by ultrasonic wire bonding according to the preamble of the main claim.
  • the strength is determined in the shear, tensile and peel test. This process can only be carried out on a random basis, so that it cannot meet the high quality requirements of modern mass production.
  • features of the main claim have the advantage that each individual connection is non-destructively checked for strength or quality without additional expenditure of time, and an unforeseen occurrence of disturbance variables impairing strength can be recognized in good time.
  • Advantageous refinements of the method according to the main claim are possible through the measures listed in the subclaims.
  • Process assurance module generates a signal for the removal of the relevant components when a connection is found that does not meet the specified quality standard. With an appropriate design, this means that the production flow does not have to be interrupted by a discharge process.
  • the course of the wire deformation during the bonding process can be easily and reliably detected by a contactless sensor.
  • the bond wedge amplitude can advantageously be determined by detecting and evaluating the current consumption of the ultrasound device.
  • the method according to the invention is preferably applicable to wedge-wedge bond welding methods.
  • FIG. 1 shows the parts of a wedge-wedge bond welding device that are of interest in the present context
  • FIG. 2 shows the vibration profile in the bond wedge tool according to FIG. 1
  • FIGS. 3 and 4 show the time profiles of the amplitudes and transmitted to the wire, determined in preliminary tests for a specific application the wire deformation for clean and for contaminated contact surfaces on the wire and on the substrate.
  • the bond welding device has a fixed support 10 for the substrate 12 to which the wire 14 is to be welded by bonding.
  • a bond wedge tool 16 is used, which is designed in the usual way and interacts with the wire 14.
  • the bond wedge tool 16 is pressed in the bonding process by a force P against the wire end to be connected and the substrate 12.
  • an ultrasound device (not shown) transmits an oscillation energy E to the bond wedge tool 16, the amplitude profile of which in
  • the force P and the vibration energy E are dimensioned such that the tensile strength of the connection reaches or exceeds a predetermined value with clean contact surfaces on the wire 14 and substrate 12. It can be seen from FIG. 2 that the input amplitude a_ of the vibration energy E is greater than the output amplitude a 2 transmitted to the wire 14. This caused by the friction between the wire 14, substrate 12 and bond wedge tool 16 damping effect is smaller, the more the contact surfaces of the wire and substrate are contaminated by hand perspiration, oil or the like.
  • the present invention takes advantage of this fact by querying and evaluating the output amplitude & 2 during the bonding process.
  • the sizes or temporal profiles of the output amplitude & 2 for clean and for contaminated contact surfaces are determined by preliminary tests which are geared to a specific application.
  • Surrender 3 shows curve A for clean and curve B for contaminated contact surfaces.
  • Curve A is now stored as a master curve in a process assurance module which is queried at two different times t 2 and t 2 during the bonding process beginning at time t 0 .
  • the process safety module now decides whether the values of the output amplitude a2 determined at these times correspond to the value on curve A or lie within a predetermined tolerance range. If this is not the case, the
  • Process safety module trigger a signal for the need to eject the relevant components.
  • the speed or the time course of the wire deformation is also determined as a further parameter for the strength or quality of the bond connection.
  • the diagram according to FIG. 4 shows the distance b over the process time t, which takes up the working surface of the bond wedge tool 16 to a reference plane on the support 10 or the substrate 12. With clean contact surfaces there is a deformation curve according to curve C, with contaminated contact surfaces there is a slower curve according to curve D. Curve C is stored as a master curve in the process control module and - like curve A - is used to assess the actual values of the wire deformation determined at times t ⁇ and t2.
  • the measurements can be evaluated in such a way that there is a signal for the ejection of components if only one measured value lies outside the specified tolerance range for the corresponding master curve A or C.
  • the method can also be chosen so that the measured values recorded at time 2 are rated higher than those at

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

La présente invention concerne un procédé de contrôle de connexions réalisées par microcâblage aux ultrasons. Avec ce procédé, la solidité de la connexion est déterminée en tant que grandeur fondamentale caractérisant la qualité de la soudure. Selon l'invention, il est proposé de déterminer, comme paramètres essentiels de la solidité de la connexion, la vitesse ou les variations, en fonction du temps, de la déformation des fils métalliques et les variations, en fonction du temps, de la taille du coin de soudage pendant l'opération de soudage et de les juger par comparaison avec des données correspondant à une norme de qualité prescrite et stockées dans un module de surveillance du processus. Il est ainsi possible de vérifier individuellement la solidité de chaque connexion, sans causer de perturbation et sans y consacrer un supplément de temps.
EP95938352A 1994-12-29 1995-11-29 Procede de controle de connexions realisees par microcablage aux ultrasons Expired - Lifetime EP0800433B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4447073A DE4447073C1 (de) 1994-12-29 1994-12-29 Verfahren zum Prüfen von durch Ultraschalldrahtbonden hergestellten Verbindungen
DE4447073 1994-12-29
PCT/DE1995/001686 WO1996020806A1 (fr) 1994-12-29 1995-11-29 Procede de controle de connexions realisees par microcablage aux ultrasons

Publications (2)

Publication Number Publication Date
EP0800433A1 true EP0800433A1 (fr) 1997-10-15
EP0800433B1 EP0800433B1 (fr) 1999-10-20

Family

ID=6537402

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95938352A Expired - Lifetime EP0800433B1 (fr) 1994-12-29 1995-11-29 Procede de controle de connexions realisees par microcablage aux ultrasons

Country Status (4)

Country Link
EP (1) EP0800433B1 (fr)
DE (2) DE4447073C1 (fr)
ES (1) ES2138758T3 (fr)
WO (1) WO1996020806A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6393924B1 (en) * 1997-11-10 2002-05-28 Schunk Ultraschalltechnik Gmbh Testing method for non-destructive testing of a welded connector, a testing device and an ultrasonic welding apparatus having such a device
DE10030007C2 (de) * 2000-06-17 2002-04-18 Bosch Gmbh Robert Verfahren und Vorrichtung zum Prüfen der Festigkeit von Verbindungen
DE10110048A1 (de) * 2001-03-02 2002-09-05 Bosch Gmbh Robert Verfahren zum Prüfen von durch Ultraschall-Drahtbonden hergestellten Verbindungen
DE50110953D1 (de) 2001-11-07 2006-10-19 F & K Delvotec Bondtech Gmbh Prüfverfahren für Bondverbindungen und Drahtbonder
ATE472387T1 (de) 2006-09-05 2010-07-15 Univ Berlin Tech Verfahren und vorrichtung zur regelung der herstellung von drahtbondverbindungen
DE102017101736A1 (de) 2017-01-30 2018-08-02 F&K Delvotec Bondtechnik Gmbh Verfahren zur Herstellung von Drahtbondverbindungen und Anordnung zur Durchführung des Verfahrens

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3890831A (en) * 1973-01-19 1975-06-24 Us Navy Ultrasonic bond monitor
GB1506164A (en) * 1974-07-09 1978-04-05 Mullard Ltd Ultrasonic bonding apparatus
US4606490A (en) * 1982-08-24 1986-08-19 Asm Assembly Automation Limited Apparatus and method for automatic evaluation of a bond created by an ultrasonic transducer
DE3429776A1 (de) * 1984-08-13 1986-02-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zur qualitaetskontrolle beim ultraschallschweissen sowie zugehoerige vorrichtung
US4815001A (en) * 1986-05-30 1989-03-21 Crestek, Inc. Ultrasonic wire bonding quality monitor and method
DE3701652A1 (de) * 1987-01-21 1988-08-04 Siemens Ag Ueberwachung von bondparametern waehrend des bondvorganges
GB8826488D0 (en) * 1988-11-11 1988-12-14 Emhart Deutschland Quality control for wire bonding
US4998664A (en) * 1989-12-22 1991-03-12 Hughes Aircraft Company Bond signature analyzer
EP0498936B1 (fr) * 1991-02-15 1995-01-25 Esec Sa Procédé et dispositif de mesure de l'amplitude d'oscillation d'un transducteur d'énergie
DE4131565C2 (de) * 1991-09-18 2002-04-25 Bleich Karl Heinz Verfahren zur Optimierung des Schweißprozesses bei Bondverfahren

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9620806A1 *

Also Published As

Publication number Publication date
WO1996020806A1 (fr) 1996-07-11
DE4447073C1 (de) 1996-07-18
ES2138758T3 (es) 2000-01-16
EP0800433B1 (fr) 1999-10-20
DE59507106D1 (de) 1999-11-25

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