EP0802990A1 - Dispositif de traitement de surface, chimique ou electrolytique d'objets plaque - Google Patents

Dispositif de traitement de surface, chimique ou electrolytique d'objets plaque

Info

Publication number
EP0802990A1
EP0802990A1 EP96945491A EP96945491A EP0802990A1 EP 0802990 A1 EP0802990 A1 EP 0802990A1 EP 96945491 A EP96945491 A EP 96945491A EP 96945491 A EP96945491 A EP 96945491A EP 0802990 A1 EP0802990 A1 EP 0802990A1
Authority
EP
European Patent Office
Prior art keywords
objects
flow
angle
plate
lamellae
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96945491A
Other languages
German (de)
English (en)
Inventor
Karl Hans Fuchs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials Deutschland GmbH
Original Assignee
LeaRonal GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19539866A external-priority patent/DE19539866C2/de
Priority claimed from DE19541099A external-priority patent/DE19541099A1/de
Application filed by LeaRonal GmbH filed Critical LeaRonal GmbH
Publication of EP0802990A1 publication Critical patent/EP0802990A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Definitions

  • the invention relates to a device according to the preamble of patent claim 1.
  • a fundamental objective in surface treatment devices such as Electroplating baths that are used to coat plate-like objects such as PCBs, is to achieve a uniform surface quality, e.g. a good layer thickness distribution over the entire surface of the panel to be coated.
  • the boreholes in particular are critical here, the inner walls of which should also be provided with a layer thickness that should be as close as possible to the average copper layer thickness in the surface area.
  • Another objective is generally to intensify and accelerate the overall effect of the electrolytic or chemical processes, for example the deposition in an electroplating bath, the state of the art in electroplating baths (for example DE 44 05 741) using electrolytes by means of suitable To move pipe devices past the printed circuit boards to be coated in the electroplating bath to make a larger one To achieve separation speed.
  • the pumping effort to force the electrolyte through the electroplating bath increases to uneconomical values.
  • the increased pump energy expenditure leads to increasing heat development, which results in an additional heat supply to the electroplating bath, the removal of which in turn necessitates additional energy expenditure.
  • an electroplating bath in particular high deposition rates with short electroplating distances, the highest possible current densities, a layer thickness distribution that is as uniform as possible and a low energy expenditure for circulating the electrolyte should be achieved.
  • the principle of the invention of the air admixture in connection with the design of the guide elements as a flow grille causes the emerging air bubbles to try to pass the flow grille upwards as quickly as possible due to the buoyancy and thus entrain the surrounding process liquid with them.
  • the relationship between the effort of the process liquid to optimize the process parameters and the energy expenditure required for this is decisively improved.
  • the flow grille when the lamellae are positioned according to the invention, the flow grille also has no negative effects on the coating result in an electroplating bath; Despite the electrical shielding effects of the flow grids, neither the constant layer thickness on the surface of the electroplated material (printed circuit board) nor the above-mentioned layer thickness distribution in boreholes of printed circuit boards is impaired.
  • a particularly preferred application of the solution according to the invention provides that the bottom of the flow cell designed as a galvano cell is formed by a two-part supply tank, the upper chamber of which forms the electrolyte chamber and the lower chamber of which forms an air chamber, from which supply pipes are guided vertically upwards into the electroplating bath , which are used for the directed supply of both the electrolyte and the air and at the same time for the positionally correct reception of the fins forming the two flow grids.
  • the top of the supply tank and the underlying partition between the electrolyte chamber and the air chamber are provided with rows of holes that are aligned with one another, then the corresponding supply pipes can be simply inserted into the supply tank at the intended distance and in their relative positioning relative to one another and are thus retained. This allows a simple, modular overall structure of the flow cell to be achieved, which can also be quickly adapted to changing operating conditions.
  • FIG. 1 A partially cut perspective partial representation of an electroplating bath with the essential elements of the invention
  • FIG. 2 a schematic longitudinal vertical section through the electroplating bath
  • FIG. 3 shows a schematic partial cross section through the electroplating bath in the plane III-III of FIG. 2, and
  • Figure 4 a top view of the supply tank with the openings for the feed pipes.
  • the electroplating bath G is, as usual, delimited by two vertical side walls 7A, 7B and (not shown) end walls, by means of which, for example by means of suitable lip seals, the electroplating material 10 to be coated can be inserted vertically in suitable plating elements into the electroplating bath G and removed therefrom , as described for example in DE 39 29 728 AI in detail, so that the usual elements of such known systems need not be discussed here.
  • the bottom of the electroplating bath G is formed by a supply tank 1, which consists of two chambers one above the other; in the upper chamber, the electrolyte chamber 2, there is the respective electrolyte liquid of the electroplating bath G, which is pumped vertically upwards via feed pipes RE (only one shown in FIG. 1), where the electrolyte through outlet openings in the feed pipe RE in the direction of the electroplating material to be coated 10 is pushed out under the action of the circulation pump and thus specifically covers the surface of the object to be coated (this movement is symbolized by the three arrows, starting from the feed pipe RE).
  • Compressed, oil-free blown air is guided from the air chamber 3 via a large number of further feed pipes RL, which blown out in the form of air bubbles at outlet openings of the feed pipes RL into the electroplating bath G.
  • a large number of such feed pipes RE.RL are inserted in parallel rows through suitable openings in the supply tank 1, where they are held, for example, by O-rings as seals.
  • the inlet openings of the feed pipes RE end in the electrolyte chamber 2, the lower ends of the feed pipes RL are pushed through the intermediate floor between the electrolyte chamber 2 and the air chamber 3 and end in the air chamber 3.
  • a preferred embodiment provides that electrolyte feed tubes RE and air feed tubes RL are arranged alternately along the supply tank 1 such that (as shown in FIG. 1) a feed tube RE and a feed tube RL are always opposite.
  • the plate-shaped electroplating material 10 to be coated hangs between the two rows of feed pipes (FIG. 4).
  • Another important, mechanical function of the feed pipes RE, RL is to accommodate a plurality of fins L arranged parallel to one another such that a flow grid 5A, 5B consisting of fins L arranged one above the other is formed on both sides of the electroplating material 10 to be coated is so that a frame or frame-like structure is formed on both sides of the electroplating material 10, which serves to optimize the electrolyte flow in the area of this electroplating material 10.
  • the lamellae L are viewed in the direction of the plane of the electroplating material 10, either rising (flow grating 5A) or falling (flow grating 5B), at the same time they are arranged in a roof-like manner in the direction of the electroplating good 10. This orientation causes an air bubble emerging from a feed pipe RL, driven by its buoyancy, to Direction of movement is impressed by the "next upper" lamella, which has an essential directional component both in the longitudinal direction of the electroplating material 10 and in the direction of the surface of the electroplating material 10.
  • this movement of the air bubbles has the result that electrolyte liquid located in the immediate vicinity of the air bubbles is entrained by the air bubbles in this predetermined direction, so that, graphically speaking, each air bubble has a certain amount of electrolyte liquid with "upward” and pulls in the direction of the object to be coated, as a result of which the energy expenditure required for circulating the electrolyte via the feed tubes RE can be drastically reduced.
  • the air bubbles thus generate a turbulent flow of an electrolyte / air mixture in the immediate surface area of the electroplating material 10 to be coated, with the resulting positive effects such as faster deposition of the coating metal, optimization of the layer thickness constancy, in particular also in the case of line plate holes, and short electroplating bath duration.
  • the above-mentioned relative positioning of supply pipes RE, RL has a positive effect in that air bubbles are always applied to the electrolyte from only one side of the circuit board and thus also a defined flow through holes or bores in the circuit board over wide areas can be generated, which has a positive influence on the last-mentioned effect (uniformity of the layer thickness).
  • a particularly favorable effect in terms of optimizing the electrolyte throughput can be achieved if the direction of the outlet openings on the feed pipes RL, RE is approximately 20 ° to 70 ° is directed away from the vertical plane of the electroplating material 10 in the direction of the rise of the fins L. This defines a supply of air and electrolyte into the electroplating bath which is compatible with the movement direction described above, which is imprinted by the arrangement of the fins L.
  • the vertically successive lamellae L of a flow grille are inclined upwards or downwards at the same first angle 1, and if they are positioned in height so that the higher end point of the lower lamella with the lower end point of the upper one Slat is at the same height.
  • the lamellae of the flow grille 5A are inclined upward (seen from the plane of the drawing), the lamellae of the flow grille 5B are inclined downward.
  • the two flow grids 5A, 5B are positioned relative to one another in such a way that the horizontal projection of their respective slats L on the object 10 to be coated does not coincide.
  • the positioning is preferably selected so that intersection points result on half the length of the flow grids; in FIG. 2 these intersection points of the projections lie in the sectional plane III-III, which results in the sectional illustration of FIG. 3 showing the same height position of the sectional lines of opposing lamellae, and also in the perspective sectional illustration of FIG. 1 the front sectional plane lies in this sectional plane III III.
  • the "non-overlapping" arrangement of the lamellae has the effect that influences of the electrical field in the cathode compartment of the electroplating cell, which cannot be ruled out, largely compensate for one another and thus differences in the coating quality due to locally changing field strengths above the surface of the coating material can be avoided.
  • lamellae An alternative to the arrangement of the lamellae, which is not shown in the drawing, consists in that the lamellae are arranged vertically and are designed as an angle profile, the open side of which points toward the object to be coated. In this case, it is then expedient that these angle profiles are mutually offset in the horizontal. Even with such an arrangement, an "acceleration effect" of the air bubbles emerging from the feed pipes on the surrounding electrolytes is possible if the feed pipes are arranged in the opening area of the angle profiles.
  • the two flow grids form a gap of 10 to 15 mm, in which the circuit board 10 is immersed.
  • 5,000 to 25,000 1 / h of electrolyte per meter of chamber length are pumped into the electrolyte chamber 2, and slightly compressed, oil-free blown air is introduced into the air chamber 3 (the corresponding pumps are not shown in the illustrations).
  • Commercially available high-performance electrolytes can be used, for example a copper electrolyte for the deposition of copper on printed circuit boards, which is commercially available under the name "Copper Gleam 125 HS" from Lea Ronal GmbH.
  • the current densities that can be used in practice are between 3 and 40 A / qdm at working temperatures of 28 ° to 55 ° Celsius, the value of the current densities that can be achieved for printed circuit boards is essentially determined by the geometry of the boreholes, with a falling length-diameter ratio, particularly good layer thickness distribution results can be achieved can also be achieved at high current densities.
  • the exemplary embodiment described relates to the use of the flow cell as an electroplating bath for the electrolytic coating of printed circuit boards. It goes without saying that the concept of the invention encompasses all other areas of application in which the action of a process liquid on surface areas of a product to be processed is important.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

L'invention concerne un dispositif permettant le traitement chimique ou électrolytique de surfaces d'objets de type plaque, se présentant sous forme de cellule d'écoulement. Ce dispositif comprend de premiers éléments d'amenée sous forme de tubes munis d'orifices de sortie pour assurer une alimentation ciblée en liquide de traitement au niveau des objets à traiter. En outre, ce dispositif comprend également de seconds éléments d'amenée dans le liquide de traitement, afin d'assurer une alimentation ciblée en air dans la zone d'action d'éléments de guidage constitués d'une grille d'écoulement composée de lamelles à configuration de type jalousie, et maintenue à distance de chaque côté des objets à traiter. Les lamelles sont inclinées vers le haut ou vers le bas, dans une direction parallèle au plan principal des objets de type plaques. Ce principe du mélange de l'air associé avec la configuration en grille d'écoulement des éléments de guidage fait que les bulles d'air sortant de la grille d'écoulement se dégagent vers le haut et entraînent au passage le liquide de traitement environnant. Le rapport entre la complexité technique requise par le guidage forcé du liquide de traitement pour optimiser les paramêtres du procédé et la dépense d'énergie qui en découle est considérablement amélioré.
EP96945491A 1995-10-26 1996-10-11 Dispositif de traitement de surface, chimique ou electrolytique d'objets plaque Withdrawn EP0802990A1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE19539866 1995-10-26
DE19539866A DE19539866C2 (de) 1995-10-26 1995-10-26 Vorrichtung zur chemischen oder elektrolytischen Oberflächenbehandlung plattenförmiger Gegenstände
DE19541099A DE19541099A1 (de) 1995-11-06 1995-11-06 Vorrichtung zur chemischen oder elektrolytischen Oberflächenbehandlung plattenförmiger Gegenstände
DE19541099 1995-11-06
PCT/DE1996/001938 WO1997015702A2 (fr) 1995-10-26 1996-10-11 Dispositif de traitement de surface, chimique ou electrolytique d'objets plaque

Publications (1)

Publication Number Publication Date
EP0802990A1 true EP0802990A1 (fr) 1997-10-29

Family

ID=26019804

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96945491A Withdrawn EP0802990A1 (fr) 1995-10-26 1996-10-11 Dispositif de traitement de surface, chimique ou electrolytique d'objets plaque

Country Status (4)

Country Link
US (1) US5897756A (fr)
EP (1) EP0802990A1 (fr)
JP (1) JPH10511744A (fr)
WO (1) WO1997015702A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037011A (en) * 1997-11-04 2000-03-14 Inland Steel Company Hot dip coating employing a plug of chilled coating metal
KR100732263B1 (ko) * 1999-11-09 2007-06-25 아토테크더치랜드게엠베하 기판 형태의 작업물, 특히 인쇄 회로 기판을 전해처리하기위한 장치
CN108892194B (zh) * 2018-08-03 2024-03-15 中国石油工程建设有限公司 一种格栅装置和具有该装置的气浮设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3875041A (en) * 1974-02-25 1975-04-01 Kennecott Copper Corp Apparatus for the electrolytic recovery of metal employing improved electrolyte convection
US3959112A (en) * 1975-06-12 1976-05-25 Amax Inc. Device for providing uniform air distribution in air-agitated electrowinning cells
US4113586A (en) * 1977-10-25 1978-09-12 Kennecott Copper Corporation Method and apparatus for the electrolytic recovery of metal employing electrolyte convection
US4773983A (en) * 1986-02-03 1988-09-27 Omi International Corporation Electrolytic apparatus and process
DD285127B5 (de) * 1989-06-23 1995-11-02 Grimma Masch Anlagen Gmbh Elektrodenelement einer Elektrode fuer gasentwickelnde elektrolytische Prozesse
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
JPH03115593A (ja) * 1989-09-29 1991-05-16 Hiroshige Sawa 鍍金方法及びその鍍金方法に使用する鍍金装置
DE4032856A1 (de) * 1990-10-13 1992-04-16 Schering Ag Membranelektrolysemodul
DE4405741C1 (de) * 1994-02-23 1995-06-01 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallen aus Elektrolyten mit Prozeßorganik
CN1095882C (zh) * 1994-11-15 2002-12-11 比利时西门子公司 板形工件,特别是印刷电路板的电解加工装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9715702A2 *

Also Published As

Publication number Publication date
WO1997015702A2 (fr) 1997-05-01
US5897756A (en) 1999-04-27
JPH10511744A (ja) 1998-11-10
WO1997015702A3 (fr) 1997-08-14

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