EP0835522A1 - Procede de fabrication d'un substrat ceramique a couches multiples - Google Patents

Procede de fabrication d'un substrat ceramique a couches multiples

Info

Publication number
EP0835522A1
EP0835522A1 EP96946052A EP96946052A EP0835522A1 EP 0835522 A1 EP0835522 A1 EP 0835522A1 EP 96946052 A EP96946052 A EP 96946052A EP 96946052 A EP96946052 A EP 96946052A EP 0835522 A1 EP0835522 A1 EP 0835522A1
Authority
EP
European Patent Office
Prior art keywords
foils
ceramic
green ceramic
conductive paste
conductor tracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP96946052A
Other languages
German (de)
English (en)
Inventor
Ulrich Goebel
Walter Roethlingshoefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP0835522A1 publication Critical patent/EP0835522A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Definitions

  • the method according to the invention with the characterizing features of the main claim has the great advantage that the green ceramic films do not have to be dried before stacking.
  • the use of a guide paste, which contains a wax as a print carrier and does not contain any volatile solvents means that the time-consuming drying of the green ceramic films is eliminated.
  • the foils can be stacked and burned immediately after the conductor tracks and plated-through holes have been printed. Since the drying times are eliminated, the ceramic multilayer substrates can be manufactured much faster.
  • shrinkage of the conductor tracks and the green ceramic foils is avoided before firing. A distortion of the fine conductor track structures on the green ceramic foils is therefore excluded.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Le procédé décrit sert à fabriquer un substrat céramique à couches multiples, notamment un substrat LTCC (en céramiques cocuites à basse température). On réalise par un procédé d'impression des circuits imprimés et des trous métallisés sur plusieurs feuilles céramiques crues en utilisant une pâte conductrice qui contient une cire comme milieu d'impression et est exempte de solvants volatils. On empile ensuite les feuilles céramiques crues et on les cuit. Il n'est plus nécessaire de faire longtemps sécher les feuilles céramiques crues pour faire s'évaporer le solvant utilisé. Les feuilles peuvent être empilées et cuites dès que les circuits imprimés et les trous métallisés ont été imprimés. L'invention a en outre le grand avantage d'éviter le retrait des circuits imprimés et des feuilles céramiques crues avant leur cuisson, ce qui améliore de manière décisive la précision du substrat céramique à couches multiples ainsi produit.
EP96946052A 1996-04-20 1996-12-07 Procede de fabrication d'un substrat ceramique a couches multiples Withdrawn EP0835522A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19615787 1996-04-20
DE19615787A DE19615787A1 (de) 1996-04-20 1996-04-20 Verfahren zur Herstellung eines keramischen Multilayer-Substrats
PCT/DE1996/002348 WO1997040529A1 (fr) 1996-04-20 1996-12-07 Procede de fabrication d'un substrat ceramique a couches multiples

Publications (1)

Publication Number Publication Date
EP0835522A1 true EP0835522A1 (fr) 1998-04-15

Family

ID=7791942

Family Applications (1)

Application Number Title Priority Date Filing Date
EP96946052A Withdrawn EP0835522A1 (fr) 1996-04-20 1996-12-07 Procede de fabrication d'un substrat ceramique a couches multiples

Country Status (9)

Country Link
US (1) US5919325A (fr)
EP (1) EP0835522A1 (fr)
JP (1) JPH11510963A (fr)
KR (1) KR19990022267A (fr)
AU (1) AU715150B2 (fr)
BR (1) BR9610093A (fr)
DE (1) DE19615787A1 (fr)
RU (1) RU2185683C2 (fr)
WO (1) WO1997040529A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551720B2 (en) 2000-05-02 2003-04-22 Sarnoff Corporation Materials to fabricate a high resolution plasma display back panel
US6738600B1 (en) 2000-08-04 2004-05-18 Harris Corporation Ceramic microelectromechanical structure
US6437981B1 (en) 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
DE10234773A1 (de) * 2002-07-30 2004-02-12 Daimlerchrysler Ag Einspritzsystem und Drucksensor für ein solches
DE10305950B4 (de) * 2003-02-12 2006-03-02 Daimlerchrysler Ag Einspritzsystem und thermischer Massenflusssensor für ein solches
US7240424B2 (en) * 2004-04-29 2007-07-10 Northrop Grumman Corporation Method of laminating low temperature co-fired ceramic (LTCC) Material
US7795632B2 (en) 2006-06-26 2010-09-14 Osram Sylvania Inc. Light emitting diode with direct view optic
DE102007015399A1 (de) 2007-03-30 2008-10-02 Robert Bosch Gmbh Verfahren zur Herstellung einer keramischen Mehrlagen-Schaltungsanordnung und entsprechende Mehrlagen-Schaltungsanordnung
JP5686606B2 (ja) * 2010-01-12 2015-03-18 日本軽金属株式会社 フィン一体型基板の製造方法およびフィン一体型基板
CN104885576B (zh) * 2012-12-31 2017-12-05 阿莫绿色技术有限公司 柔性印刷电路基板及其制造方法
US9640419B2 (en) * 2014-08-04 2017-05-02 Infineon Technologies Ag Carrier system for processing semiconductor substrates, and methods thereof
US9368436B2 (en) * 2014-08-04 2016-06-14 Infineon Technologies Ag Source down semiconductor devices and methods of formation thereof
CN106145914B (zh) * 2016-06-24 2018-11-09 中国电子科技集团公司第三十八研究所 一种超薄型低温共烧陶瓷基板的快速成型与烧结方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU1688754C (ru) * 1980-06-14 1994-12-30 Научно-исследовательский институт физики при Ростовском государственном университете Способ изготовления многослойных пьезокерамических элементов
US4345955A (en) * 1980-10-28 1982-08-24 E. I. Du Pont De Nemours And Company Process for manufacturing multilayer ceramic chip carrier modules
JPS59193972A (ja) * 1983-04-15 1984-11-02 Nippon Engeruharudo Kk 熱可塑性導電ペ−スト組成物
US4546065A (en) * 1983-08-08 1985-10-08 International Business Machines Corporation Process for forming a pattern of metallurgy on the top of a ceramic substrate
JPH0224907A (ja) * 1988-07-11 1990-01-26 Fujitsu Ltd ペースト組成物およびこれを用いたパターン形成方法
US5085720A (en) * 1990-01-18 1992-02-04 E. I. Du Pont De Nemours And Company Method for reducing shrinkage during firing of green ceramic bodies
DE4309005A1 (de) * 1992-07-23 1994-01-27 Bosch Gmbh Robert Verfahren zur Herstellung von Mehrlagen-Hybriden

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9740529A1 *

Also Published As

Publication number Publication date
WO1997040529A1 (fr) 1997-10-30
RU2185683C2 (ru) 2002-07-20
JPH11510963A (ja) 1999-09-21
KR19990022267A (ko) 1999-03-25
BR9610093A (pt) 1999-01-05
US5919325A (en) 1999-07-06
AU715150B2 (en) 2000-01-20
DE19615787A1 (de) 1997-10-23
AU1868997A (en) 1997-11-12

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