EP0893935A2 - Boítier pour transducteur électroacoustique - Google Patents
Boítier pour transducteur électroacoustique Download PDFInfo
- Publication number
- EP0893935A2 EP0893935A2 EP98110703A EP98110703A EP0893935A2 EP 0893935 A2 EP0893935 A2 EP 0893935A2 EP 98110703 A EP98110703 A EP 98110703A EP 98110703 A EP98110703 A EP 98110703A EP 0893935 A2 EP0893935 A2 EP 0893935A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- transducer
- mounting
- sound
- receiving
- contacting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
Definitions
- the present invention relates to a mounting housing for Inclusion of a cylindrical electroacoustic transducer, the contact surfaces that are not rotationally symmetrical on the back for automatic contacting, connection pins and at least one not rotationally symmetrical Has sound inlet opening.
- Such converters are automatically contacted in usually by means of a contact rubber contact or Leaf spring contact and in particular with pressure gradient microphones, which in addition to rotationally symmetrical sound inlets generally not on the front rotationally symmetrical sound inlets in the back Own circuit board by hand soldering leaf springs on the converter.
- Such contacts have large height tolerances no constant contact force and there is a risk of plastic spring deformation during assembly and during Handling. Also the assembly itself, especially at Pressure gradient microphones, difficult.
- a mounting case of the above Kind resolved which is characterized by a mounting plate for the converter with two mounting holes to guide the connecting pins, at least one radially aligned groove, which is below a sound inlet and through two mounting holes, which is below the contact areas for the automatic Contacting are located in the spiral springs are on the side of that of the acoustic transducer opposite side, protrude, and a cover cap which can be plugged in via the acoustic transducer, the Edge can be locked with the edge of the mounting plate, and which has at least one sound inlet bore, the connects to a sound inlet groove of the mounting plate.
- the mounting housing according to the present invention offers a stable, vibration-proof contacting principle with an even contact force over large height tolerances. Another advantage is that only a small one There is a risk of plastic deformation. For microphones with the rear sound inlet opening there is the possibility automatic soldering without manual soldering at defined acoustic behavior in that the existing Connection pins for a clear definition of the location of the electroacoustic transducer can be used.
- An expedient development of the present invention is characterized in that the end of the coil spring, which is in contact with the transducer, a larger diameter has than the rest of the coil spring, and that the internal dimensions of the mounting holes for the coil springs External dimensions of the coil springs are adapted.
- the electroacoustic transducer shown in FIGS. 1 to 3 in the present case a microphone capsule, has front rotationally symmetrical sound inlet openings 5 and one rear non-rotationally symmetrical sound inlet opening 6. Furthermore, the microphone capsule shown on the Rear 2 pins 4 and 3 solder pads for other types of connection e.g. for leaf springs.
- the mounting housing according to the present invention for receiving the microphone capsule shown in Figures 1 to 3 has a mounting plate 7.
- This mounting plate 7 has corresponding bores 13 for receiving the connecting pins 4.
- the microphone capsule becomes a fixed orientation Recording plate 7 causes. At defined intervals from these Pins 4 are then contact surfaces on the Rear wall of the microphone capsule realized.
- the sound entry groove 9 comes into the receiving plate to lie exactly below the rear sound inlet opening 6.
- the spiral springs 11, which in the Bores 12 are held under the solder pads 3 for different Connection types to lie, so that a reliable contact is guaranteed.
- Cover cap 8 which e.g. is made of rubber, to seal against unwanted sound entry to reach.
- the cover cap 8 has a sound entry bore 10, which is arranged such that it adapts to the Sound entry groove 10 connects in the receiving plate 7, see above that ensures a continuous rear sound inlet opening is.
- the spiral springs 11 on one Form end with a larger diameter. Then be for contacting the solder pads 3 of the microphone capsule 1 Used ends with the larger diameter, and for contacting towards the outside are the ends with the smaller diameter used.
- the bore is adapted to these diameters, so that in this case a self-holding during assembly Spring contact results.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Headphones And Earphones (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE29713202U DE29713202U1 (de) | 1997-07-24 | 1997-07-24 | Montagegehäuse für elektroakustischen Wandler |
| DE29713202U | 1997-07-24 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0893935A2 true EP0893935A2 (fr) | 1999-01-27 |
| EP0893935A3 EP0893935A3 (fr) | 2006-05-03 |
| EP0893935B1 EP0893935B1 (fr) | 2010-12-15 |
Family
ID=8043646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP98110703A Expired - Lifetime EP0893935B1 (fr) | 1997-07-24 | 1998-06-10 | Boîtier pour un transducteur électroacoustique |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5995637A (fr) |
| EP (1) | EP0893935B1 (fr) |
| JP (1) | JP3056041U (fr) |
| AT (1) | ATE492124T1 (fr) |
| DE (2) | DE29713202U1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE29713202U1 (de) * | 1997-07-24 | 1997-12-18 | Siemens AG, 80333 München | Montagegehäuse für elektroakustischen Wandler |
| JP4402471B2 (ja) | 2004-02-05 | 2010-01-20 | スター精密株式会社 | 電気音響変換器 |
| US9042606B2 (en) * | 2006-06-16 | 2015-05-26 | Board Of Regents Of The Nevada System Of Higher Education | Hand-based biometric analysis |
| US8655084B2 (en) * | 2009-06-23 | 2014-02-18 | Board Of Regents Of The Nevada System Of Higher Education, On Behalf Of The University Of Nevada, Reno | Hand-based gender classification |
| EP3297163B1 (fr) * | 2015-06-19 | 2020-03-11 | Huawei Technologies Co., Ltd. | Équipement d'utilisateur |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2833868A (en) * | 1953-05-07 | 1958-05-06 | Maico Electronics Inc | Microphone mounting for hearing aids |
| FR2402374A1 (fr) * | 1977-08-30 | 1979-03-30 | Thomson Brandt | Dispositif de montage d'un microphone incorpore dans un appareil d'enregistrement sonore et appareil a microphone incorpore |
| US4306121A (en) * | 1979-04-12 | 1981-12-15 | Instrument Systems Corporation | Electro-acoustic transducer assembly |
| US4295009A (en) * | 1980-03-07 | 1981-10-13 | Amp Incorporated | Piezoelectric audio transducer mounting and electrical connector |
| SE440581B (sv) * | 1983-12-22 | 1985-08-05 | Ericsson Telefon Ab L M | Forfarande for framstellning av elektroakustiska omvandlare med slutet resonansrum, foretredesvis mikrofoner, samt elektroakustisk omvandlare framstelld enligt forfarandet |
| DE29713202U1 (de) * | 1997-07-24 | 1997-12-18 | Siemens AG, 80333 München | Montagegehäuse für elektroakustischen Wandler |
-
1997
- 1997-07-24 DE DE29713202U patent/DE29713202U1/de not_active Expired - Lifetime
-
1998
- 1998-06-10 AT AT98110703T patent/ATE492124T1/de active
- 1998-06-10 EP EP98110703A patent/EP0893935B1/fr not_active Expired - Lifetime
- 1998-06-10 DE DE59814476T patent/DE59814476D1/de not_active Expired - Lifetime
- 1998-06-30 US US09/106,775 patent/US5995637A/en not_active Expired - Lifetime
- 1998-07-21 JP JP1998005415U patent/JP3056041U/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE29713202U1 (de) | 1997-12-18 |
| DE59814476D1 (de) | 2011-01-27 |
| EP0893935A3 (fr) | 2006-05-03 |
| ATE492124T1 (de) | 2011-01-15 |
| JP3056041U (ja) | 1999-02-02 |
| US5995637A (en) | 1999-11-30 |
| EP0893935B1 (fr) | 2010-12-15 |
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