EP0906965A3 - Nitrure de silcium obtenu de bis (tertiobutylamino) silane - Google Patents
Nitrure de silcium obtenu de bis (tertiobutylamino) silane Download PDFInfo
- Publication number
- EP0906965A3 EP0906965A3 EP98118461A EP98118461A EP0906965A3 EP 0906965 A3 EP0906965 A3 EP 0906965A3 EP 98118461 A EP98118461 A EP 98118461A EP 98118461 A EP98118461 A EP 98118461A EP 0906965 A3 EP0906965 A3 EP 0906965A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- silane
- silicon nitride
- tertiarybutylamino
- bis
- sih
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6687—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and nitrogen
- H10P14/6689—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and nitrogen the compound being a silazane
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/694—Inorganic materials composed of nitrides
- H10P14/6943—Inorganic materials composed of nitrides containing silicon
- H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/942,996 US5874368A (en) | 1997-10-02 | 1997-10-02 | Silicon nitride from bis(tertiarybutylamino)silane |
| US942996 | 1997-10-02 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0906965A2 EP0906965A2 (fr) | 1999-04-07 |
| EP0906965A3 true EP0906965A3 (fr) | 2000-12-06 |
| EP0906965B1 EP0906965B1 (fr) | 2006-05-24 |
Family
ID=25478939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP98118461A Expired - Lifetime EP0906965B1 (fr) | 1997-10-02 | 1998-09-30 | Nitrure de silcium obtenu de bis (tertiobutylamino) silane |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5874368A (fr) |
| EP (1) | EP0906965B1 (fr) |
| JP (1) | JP2962417B2 (fr) |
| KR (1) | KR100318978B1 (fr) |
| DE (1) | DE69834609T2 (fr) |
| SG (1) | SG66493A1 (fr) |
| TW (1) | TW507017B (fr) |
Families Citing this family (98)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| JP2001156065A (ja) * | 1999-11-24 | 2001-06-08 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法および半導体製造装置 |
| JP3819660B2 (ja) * | 2000-02-15 | 2006-09-13 | 株式会社日立国際電気 | 半導体装置の製造方法および半導体製造装置 |
| US6429149B1 (en) | 2000-02-23 | 2002-08-06 | International Business Machines Corporation | Low temperature LPCVD PSG/BPSG process |
| US6268299B1 (en) * | 2000-09-25 | 2001-07-31 | International Business Machines Corporation | Variable stoichiometry silicon nitride barrier films for tunable etch selectivity and enhanced hyrogen permeability |
| DE10051382A1 (de) * | 2000-10-17 | 2002-05-02 | Texas Instruments Deutschland | Verfahren zum Herstellen eines Stapels aus einer Si¶3¶N¶4¶-Schicht und einer darüberliegenden Si0¶2¶-Schicht auf einem Halbleitersubstrat |
| US6500772B2 (en) | 2001-01-08 | 2002-12-31 | International Business Machines Corporation | Methods and materials for depositing films on semiconductor substrates |
| JP4021653B2 (ja) * | 2001-11-30 | 2007-12-12 | レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | Cvd法によるシリコン窒化物膜またはシリコンオキシ窒化物膜の製造方法 |
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| TW200424343A (en) * | 2002-09-05 | 2004-11-16 | Asml Us Inc | Low temperature deposition of silicon based thin films by single-wafer hot-wall rapid thermal chemical vapor deposition |
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| JP4403824B2 (ja) * | 2003-05-26 | 2010-01-27 | 東京エレクトロン株式会社 | シリコン窒化膜の成膜方法 |
| US6974781B2 (en) * | 2003-10-20 | 2005-12-13 | Asm International N.V. | Reactor precoating for reduced stress and uniform CVD |
| DE10350752A1 (de) * | 2003-10-30 | 2005-06-09 | Infineon Technologies Ag | Verfahren zum Ausbilden eines Dielektrikums auf einer kupferhaltigen Metallisierung und Kondensatoranordnung |
| EP1788118A3 (fr) * | 2003-11-25 | 2007-07-04 | Applied Materials, Inc. | Dépôt de vapeur chimique thermale d'un nitrure de silicone |
| US20050181633A1 (en) * | 2004-02-17 | 2005-08-18 | Hochberg Arthur K. | Precursors for depositing silicon-containing films and processes thereof |
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| JP6946989B2 (ja) * | 2017-12-06 | 2021-10-13 | 住友電気工業株式会社 | 窒化珪素パッシベーション膜の成膜方法及び半導体装置の製造方法 |
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| JP2022534793A (ja) | 2019-06-07 | 2022-08-03 | ラム リサーチ コーポレーション | 原子層堆積時における膜特性の原位置制御 |
| WO2020252306A1 (fr) | 2019-06-14 | 2020-12-17 | Silcotek Corp. | Croissance de nanofils |
| US12473635B2 (en) | 2020-06-03 | 2025-11-18 | Silcotek Corp. | Dielectric article |
| TWI797640B (zh) | 2020-06-18 | 2023-04-01 | 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 | 基於矽之自組裝單層組成物及使用該組成物之表面製備 |
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| US3574677A (en) * | 1966-04-29 | 1971-04-13 | Siemens Ag | Method of producing a protective layer from a semiconductor nitrogen compound for semiconductor purposes |
| US4877651A (en) * | 1988-05-31 | 1989-10-31 | Olin Corporation | Process for thermally depositing silicon nitride and silicon dioxide films onto a substrate |
| JPH06132284A (ja) * | 1992-10-22 | 1994-05-13 | Kawasaki Steel Corp | 半導体装置の保護膜形成方法 |
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| US4777205A (en) * | 1987-07-22 | 1988-10-11 | Wacker Silicones Corporation | Electrically conductive compositions |
| US4992299A (en) * | 1990-02-01 | 1991-02-12 | Air Products And Chemicals, Inc. | Deposition of silicon nitride films from azidosilane sources |
| JP2637265B2 (ja) * | 1990-06-28 | 1997-08-06 | 株式会社東芝 | 窒化珪素膜の形成方法 |
| JP2819382B2 (ja) * | 1993-12-14 | 1998-10-30 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
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1997
- 1997-10-02 US US08/942,996 patent/US5874368A/en not_active Expired - Lifetime
-
1998
- 1998-09-18 SG SG1998003737A patent/SG66493A1/en unknown
- 1998-09-28 TW TW087116112A patent/TW507017B/zh not_active IP Right Cessation
- 1998-09-30 KR KR19980040875A patent/KR100318978B1/ko not_active Expired - Lifetime
- 1998-09-30 EP EP98118461A patent/EP0906965B1/fr not_active Expired - Lifetime
- 1998-09-30 DE DE69834609T patent/DE69834609T2/de not_active Expired - Lifetime
- 1998-10-02 JP JP10281036A patent/JP2962417B2/ja not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3574677A (en) * | 1966-04-29 | 1971-04-13 | Siemens Ag | Method of producing a protective layer from a semiconductor nitrogen compound for semiconductor purposes |
| US4877651A (en) * | 1988-05-31 | 1989-10-31 | Olin Corporation | Process for thermally depositing silicon nitride and silicon dioxide films onto a substrate |
| JPH06132284A (ja) * | 1992-10-22 | 1994-05-13 | Kawasaki Steel Corp | 半導体装置の保護膜形成方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR100318978B1 (ko) | 2002-11-18 |
| DE69834609T2 (de) | 2007-05-03 |
| US5874368A (en) | 1999-02-23 |
| DE69834609D1 (en) | 2006-06-29 |
| EP0906965B1 (fr) | 2006-05-24 |
| SG66493A1 (en) | 1999-07-20 |
| HK1017390A1 (en) | 1999-11-19 |
| EP0906965A2 (fr) | 1999-04-07 |
| JP2962417B2 (ja) | 1999-10-12 |
| KR19990036717A (ko) | 1999-05-25 |
| TW507017B (en) | 2002-10-21 |
| JPH11172439A (ja) | 1999-06-29 |
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